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レポート概要
| 360iResearch社の市場調査によると、2021年の879.9億ドルであった世界のDRAMモジュール・コンポーネント市場規模は、2022年には905.1億ドルへ達し、2027年までに年平均3.12%成長して1058.3億ドルへ拡大すると予想されています。本調査資料では、DRAMモジュール・コンポーネントの世界市場を調査・分析し、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、種類別（DDR2 DRAM、DDR3 DRAM、DDR4 DRAM、DDR5 DRAM、その他）分析、メモリー別（2GB、3-4GB、6-8GB、8GB以上、1GB以下）分析、エンドユーザー別（自動車、コンピューター、家電、モバイル機器、サーバー）分析、地域別（南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他）分析、競争状況、企業情報などの項目を掲載しています。また、当書ではADATA Technology Co., Ltd.、Apacer Technology Inc.、Elite Semiconductor Microelectronics Technology Inc.、Etron Technology, Inc.、Fidelix Co., Ltd.、Innodisk Corporation、Integrated Silicon Solution Inc.、Kingston Technology Company, Inc.、Micron Technology, Inc.、Nanya Technology Corporation、Patriot Memory, Inc.、Powerchip Semiconductor Manufacturing Corp.などの企業情報が含まれています。 ・序論 ・調査方法 ・エグゼクティブサマリー ・市場概 ・市場インサイト ・世界のDRAMモジュール・コンポーネント市場規模：種類別 - DDR2 DRAMの市場規模 - DDR3 DRAMの市場規模 - DDR4 DRAMの市場規模 - DDR5 DRAMの市場規模 - その他DRAMモジュール・コンポーネントの市場規模 ・世界のDRAMモジュール・コンポーネント市場規模：メモリー別 - 2GBDRAMモジュール・コンポーネントの市場規模 - 3-4GBDRAMモジュール・コンポーネントの市場規模 - 6-8GBDRAMモジュール・コンポーネントの市場規模 - 8GB以上DRAMモジュール・コンポーネントの市場規模 - 1GB以下DRAMモジュール・コンポーネントの市場規模 ・世界のDRAMモジュール・コンポーネント市場規模：エンドユーザー別 - 自動車における市場規模 - コンピューターにおける市場規模 - 家電における市場規模 - モバイル機器における市場規模 - サーバーにおける市場規模 ・世界のDRAMモジュール・コンポーネント市場規模：地域別 - 南北アメリカのDRAMモジュール・コンポーネント市場規模 アメリカのDRAMモジュール・コンポーネント市場規模 カナダのDRAMモジュール・コンポーネント市場規模 ブラジルのDRAMモジュール・コンポーネント市場規模 ... - アジア太平洋のDRAMモジュール・コンポーネント市場規模 日本のDRAMモジュール・コンポーネント市場規模 中国のDRAMモジュール・コンポーネント市場規模 インドのDRAMモジュール・コンポーネント市場規模 韓国のDRAMモジュール・コンポーネント市場規模 台湾のDRAMモジュール・コンポーネント市場規模 ... - ヨーロッパ/中東/アフリカのDRAMモジュール・コンポーネント市場規模 イギリスのDRAMモジュール・コンポーネント市場規模 ドイツのDRAMモジュール・コンポーネント市場規模 フランスのDRAMモジュール・コンポーネント市場規模 ロシアのDRAMモジュール・コンポーネント市場規模 ... - その他地域のDRAMモジュール・コンポーネント市場規模 ・競争状況 ・企業情報 |
The Global DRAM Module & Component Market size was estimated at USD 87.99 billion in 2021 and expected to reach USD 90.51 billion in 2022, and is projected to grow at a CAGR 3.12% to reach USD 105.83 billion by 2027.
Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.
Market Segmentation & Coverage:
This research report categorizes the DRAM Module & Component to forecast the revenues and analyze the trends in each of the following sub-markets:
Based on Type, the market was studied across DDR2 DRAM, DDR3 DRAM, DDR4 DRAM, DDR5 DRAM, GDDR, HBM, and LPDRAM.
Based on Memory, the market was studied across 2GB, 3-4GB, 6-8GB, Above 8GB, and Up to 1GB.
Based on End-User Industries, the market was studied across Automobiles, Computers, Consumer Electronics, Mobile Devices, and Servers.
Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.
Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.
Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for DRAM Module & Component market considering the current update on the conflict and its global response.
Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.
FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the DRAM Module & Component Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.
Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.
Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.
Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global DRAM Module & Component Market, including ADATA Technology Co., Ltd., Apacer Technology Inc., Elite Semiconductor Microelectronics Technology Inc., Etron Technology, Inc., Fidelix Co., Ltd., Innodisk Corporation, Integrated Silicon Solution Inc., Kingston Technology Company, Inc., Micron Technology, Inc., Nanya Technology Corporation, Patriot Memory, Inc., Powerchip Semiconductor Manufacturing Corp., Ramaxel Technology (Shenzhen) Co, Ltd., Rohm Co., Ltd., Samsung Electronics Co., Ltd., SK hynix Inc., SMART Modular Technologies, Inc., Team Group Inc., Transcend Information, Inc., and Winbond Electronics Corporaiton.
The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments
The report answers questions such as:
1. What is the market size and forecast of the Global DRAM Module & Component Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global DRAM Module & Component Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global DRAM Module & Component Market?
4. What is the competitive strategic window for opportunities in the Global DRAM Module & Component Market?
5. What are the technology trends and regulatory frameworks in the Global DRAM Module & Component Market?
6. What is the market share of the leading vendors in the Global DRAM Module & Component Market?
7. What modes and strategic moves are considered suitable for entering the Global DRAM Module & Component Market?
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Rapid emergence of 5G technology all over the globe
5.1.1.2. Immense use of smartphones, laptopes, and desktops
5.1.1.3. Surging number of data centers with the developments of cloud platforms
5.1.2. Restraints
5.1.2.1. Fluctuating cost of DRAM modules & components
5.1.3. Opportunities
5.1.3.1. Government initiatives to support in-house semiconductor production
5.1.3.2. Rapid adoption of IoT-based devices
5.1.4. Challenges
5.1.4.1. Stability issues under extreme environmental conditions
5.2. Cumulative Impact of COVID-19
6. DRAM Module & Component Market, by Type
6.1. Introduction
6.2. DDR2 DRAM
6.3. DDR3 DRAM
6.4. DDR4 DRAM
6.5. DDR5 DRAM
6.6. GDDR
6.7. HBM
6.8. LPDRAM
7. DRAM Module & Component Market, by Memory
7.1. Introduction
7.2. 2GB
7.3. 3-4GB
7.4. 6-8GB
7.5. Above 8GB
7.6. Up to 1GB
8. DRAM Module & Component Market, by End-User Industries
8.1. Introduction
8.2. Automobiles
8.3. Computers
8.4. Consumer Electronics
8.5. Mobile Devices
8.6. Servers
9. Americas DRAM Module & Component Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific DRAM Module & Component Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa DRAM Module & Component Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.1.1. Quadrants
12.1.2. Business Strategy
12.1.3. Product Satisfaction
12.2. Market Ranking Analysis, By Key Player
12.3. Market Share Analysis, By Key Player
12.4. Competitive Scenario
12.4.1. Merger & Acquisition
12.4.2. Agreement, Collaboration, & Partnership
12.4.3. New Product Launch & Enhancement
12.4.4. Investment & Funding
12.4.5. Award, Recognition, & Expansion
13. Company Usability Profiles
13.1. ADATA Technology Co., Ltd.
13.1.1. Business Overview
13.1.2. Key Executives
13.1.3. Product & Services
13.2. Apacer Technology Inc.
13.2.1. Business Overview
13.2.2. Key Executives
13.2.3. Product & Services
13.3. Elite Semiconductor Microelectronics Technology Inc.
13.3.1. Business Overview
13.3.2. Key Executives
13.3.3. Product & Services
13.4. Etron Technology, Inc.
13.4.1. Business Overview
13.4.2. Key Executives
13.4.3. Product & Services
13.5. Fidelix Co., Ltd.
13.5.1. Business Overview
13.5.2. Key Executives
13.5.3. Product & Services
13.6. Innodisk Corporation
13.6.1. Business Overview
13.6.2. Key Executives
13.6.3. Product & Services
13.7. Integrated Silicon Solution Inc.
13.7.1. Business Overview
13.7.2. Key Executives
13.7.3. Product & Services
13.8. Kingston Technology Company, Inc.
13.8.1. Business Overview
13.8.2. Key Executives
13.8.3. Product & Services
13.9. Micron Technology, Inc.
13.9.1. Business Overview
13.9.2. Key Executives
13.9.3. Product & Services
13.10. Nanya Technology Corporation
13.10.1. Business Overview
13.10.2. Key Executives
13.10.3. Product & Services
13.11. Patriot Memory, Inc.
13.11.1. Business Overview
13.11.2. Key Executives
13.11.3. Product & Services
13.12. Powerchip Semiconductor Manufacturing Corp.
13.12.1. Business Overview
13.12.2. Key Executives
13.12.3. Product & Services
13.13. Ramaxel Technology (Shenzhen) Co, Ltd.
13.13.1. Business Overview
13.13.2. Key Executives
13.13.3. Product & Services
13.14. Rohm Co., Ltd.
13.14.1. Business Overview
13.14.2. Key Executives
13.14.3. Product & Services
13.15. Samsung Electronics Co., Ltd.
13.15.1. Business Overview
13.15.2. Key Executives
13.15.3. Product & Services
13.16. SK hynix Inc.
13.16.1. Business Overview
13.16.2. Key Executives
13.16.3. Product & Services
13.17. SMART Modular Technologies, Inc.
13.17.1. Business Overview
13.17.2. Key Executives
13.17.3. Product & Services
13.18. Team Group Inc.
13.18.1. Business Overview
13.18.2. Key Executives
13.18.3. Product & Services
13.19. Transcend Information, Inc.
13.19.1. Business Overview
13.19.2. Key Executives
13.19.3. Product & Services
13.20. Winbond Electronics Corporaiton
13.20.1. Business Overview
13.20.2. Key Executives
13.20.3. Product & Services
14. Appendix
14.1. Discussion Guide
14.2. License & Pricing