▶ 調査レポート

半導体用ウエハーボンダーの世界市場2023年:手動、半自動、全自動

• 英文タイトル:Global Semiconductor Wafer Bonder Market Research Report 2023

QYResearchが調査・発行した産業分析レポートです。半導体用ウエハーボンダーの世界市場2023年:手動、半自動、全自動 / Global Semiconductor Wafer Bonder Market Research Report 2023 / MRC23Q34742資料のイメージです。• レポートコード:MRC23Q34742
• 出版社/出版日:QYResearch / 2023年3月
• レポート形態:英文、PDF、92ページ
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レポート概要
本調査レポートは世界の半導体用ウエハーボンダー市場について調査・分析し、世界の半導体用ウエハーボンダー市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析(手動、半自動、全自動)、用途別セグメント分析(微小電気機械システム(MEMS)、ナノ電気機械システム(NEMS)、マイクロ電子、オプト電子)、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、Besi、ASM Pacific Technology、Shibaura、Muehlbauer、Kulicke & Soffa、Hamni、ASM AMICRA、SET、Athlete FAなどが含まれています。世界の半導体用ウエハーボンダー市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX%です。COVID-19とロシア・ウクライナ戦争による影響は、半導体用ウエハーボンダー市場規模を推定する際に考慮しました。本レポートは、半導体用ウエハーボンダーの世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、半導体用ウエハーボンダーに関するビジネス上の意思決定に役立てることを目的としています。

・半導体用ウエハーボンダー市場の概要
- 製品の定義
- 半導体用ウエハーボンダーのタイプ別セグメント
- 世界の半導体用ウエハーボンダー市場成長率のタイプ別分析(手動、半自動、全自動)
- 半導体用ウエハーボンダーの用途別セグメント
- 世界の半導体用ウエハーボンダー市場成長率の用途別分析(微小電気機械システム(MEMS)、ナノ電気機械システム(NEMS)、マイクロ電子、オプト電子)
- 世界市場の成長展望
- 世界の半導体用ウエハーボンダー生産量の推定と予測(2018年-2029年)
- 世界の半導体用ウエハーボンダー生産能力の推定と予測(2018年-2029年)
- 半導体用ウエハーボンダーの平均価格の推定と予測(2018年-2029年)
- 前提条件と制限事項

・メーカー別競争状況
- メーカー別市場シェア
- 世界の主要メーカー、業界ランキング分析
- メーカー別平均価格
- 半導体用ウエハーボンダー市場の競争状況およびトレンド

・半導体用ウエハーボンダーの地域別生産量
- 半導体用ウエハーボンダー生産量の地域別推計と予測(2018年-2029年)
- 地域別半導体用ウエハーボンダー価格分析(2018年-2023年)
- 北米の半導体用ウエハーボンダー生産規模(2018年-2029年)
- ヨーロッパの半導体用ウエハーボンダー生産規模(2018年-2029年)
- 中国の半導体用ウエハーボンダー生産規模(2018年-2029年)
- 日本の半導体用ウエハーボンダー生産規模(2018年-2029年)
- 韓国の半導体用ウエハーボンダー生産規模(2018年-2029年)
- インドの半導体用ウエハーボンダー生産規模(2018年-2029年)

・半導体用ウエハーボンダーの地域別消費量
- 半導体用ウエハーボンダー消費量の地域別推計と予測(2018年-2029年)
- 北米の半導体用ウエハーボンダー消費量(2018年-2029年)
- アメリカの半導体用ウエハーボンダー消費量(2018年-2029年)
- ヨーロッパの半導体用ウエハーボンダー消費量(2018年-2029年)
- アジア太平洋の半導体用ウエハーボンダー消費量(2018年-2029年)
- 中国の半導体用ウエハーボンダー消費量(2018年-2029年)
- 日本の半導体用ウエハーボンダー消費量(2018年-2029年)
- 韓国の半導体用ウエハーボンダー消費量(2018年-2029年)
- 東南アジアの半導体用ウエハーボンダー消費量(2018年-2029年)
- インドの半導体用ウエハーボンダー消費量(2018年-2029年)
- 中南米・中東・アフリカの半導体用ウエハーボンダー消費量(2018年-2029年)

・タイプ別セグメント:手動、半自動、全自動
- 世界の半導体用ウエハーボンダーのタイプ別生産量(2018年-2023年)
- 世界の半導体用ウエハーボンダーのタイプ別生産量(2024年-2029年)
- 世界の半導体用ウエハーボンダーのタイプ別価格

・用途別セグメント:微小電気機械システム(MEMS)、ナノ電気機械システム(NEMS)、マイクロ電子、オプト電子
- 世界の半導体用ウエハーボンダーの用途別生産量(2018年-2023年)
- 世界の半導体用ウエハーボンダーの用途別生産量(2024年-2029年)
- 世界の半導体用ウエハーボンダーの用途別価格

・主要企業のプロファイル:企業情報、製品ポートフォリオ、生産量、価格、動向
Besi、ASM Pacific Technology、Shibaura、Muehlbauer、Kulicke & Soffa、Hamni、ASM AMICRA、SET、Athlete FA

・産業チェーンと販売チャネルの分析
- 半導体用ウエハーボンダー産業チェーン分析
- 半導体用ウエハーボンダーの主要原材料
- 半導体用ウエハーボンダーの販売チャネル
- 半導体用ウエハーボンダーのディストリビューター
- 半導体用ウエハーボンダーの主要顧客

・半導体用ウエハーボンダー市場ダイナミクス
- 半導体用ウエハーボンダーの業界動向
- 半導体用ウエハーボンダー市場の成長ドライバ、課題、阻害要因

・調査成果および結論

・調査方法とデータソース

A Semiconductor Wafer Bonder is a precision machine tool used in the fabrication of micro-electrical mechanical systems (MEMS) and other similar technologies. A wafer bonder is used to package together two or more substrates on the wafer-level.

Wafer bonders are used on both R&D and industrial scales when the mechanically stable joining, or bonding, together of two substrates is required. This bonding process can either be temporary or permanent, and a number of methods and technologies have been developed depending on the substrates involved and the applications required. For more information on the commonly used bonding methods, see Inseto’s knowledge base document Wafer bonding methods.
The global Semiconductor Wafer Bonder market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Semiconductor Wafer Bonder is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Semiconductor Wafer Bonder is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Semiconductor Wafer Bonder include Besi, ASM Pacific Technology, Shibaura, Muehlbauer, Kulicke & Soffa, Hamni, ASM AMICRA, SET and Athlete FA, etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Wafer Bonder, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Wafer Bonder.
The Semiconductor Wafer Bonder market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Semiconductor Wafer Bonder market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Wafer Bonder manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Besi
ASM Pacific Technology
Shibaura
Muehlbauer
Kulicke & Soffa
Hamni
ASM AMICRA
SET
Athlete FA
Segment by Type
Manual
Semi-automatic
Fully automatic
Segment by Application
Microelectromechanical systems (MEMS)
Nanoelectromechanical systems (NEMS)
Microelectronics
Optoelectronics
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Wafer Bonder manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Wafer Bonder by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Wafer Bonder in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

レポート目次

1 Semiconductor Wafer Bonder Market Overview
1.1 Product Definition
1.2 Semiconductor Wafer Bonder Segment by Type
1.2.1 Global Semiconductor Wafer Bonder Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Manual
1.2.3 Semi-automatic
1.2.4 Fully automatic
1.3 Semiconductor Wafer Bonder Segment by Application
1.3.1 Global Semiconductor Wafer Bonder Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Microelectromechanical systems (MEMS)
1.3.3 Nanoelectromechanical systems (NEMS)
1.3.4 Microelectronics
1.3.5 Optoelectronics
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Wafer Bonder Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Semiconductor Wafer Bonder Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Semiconductor Wafer Bonder Production Estimates and Forecasts (2018-2029)
1.4.4 Global Semiconductor Wafer Bonder Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Wafer Bonder Production Market Share by Manufacturers (2018-2023)
2.2 Global Semiconductor Wafer Bonder Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Semiconductor Wafer Bonder, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Semiconductor Wafer Bonder Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Wafer Bonder Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Semiconductor Wafer Bonder, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Wafer Bonder, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Wafer Bonder, Date of Enter into This Industry
2.9 Semiconductor Wafer Bonder Market Competitive Situation and Trends
2.9.1 Semiconductor Wafer Bonder Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Wafer Bonder Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Wafer Bonder Production by Region
3.1 Global Semiconductor Wafer Bonder Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Semiconductor Wafer Bonder Production Value by Region (2018-2029)
3.2.1 Global Semiconductor Wafer Bonder Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Semiconductor Wafer Bonder by Region (2024-2029)
3.3 Global Semiconductor Wafer Bonder Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Semiconductor Wafer Bonder Production by Region (2018-2029)
3.4.1 Global Semiconductor Wafer Bonder Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Semiconductor Wafer Bonder by Region (2024-2029)
3.5 Global Semiconductor Wafer Bonder Market Price Analysis by Region (2018-2023)
3.6 Global Semiconductor Wafer Bonder Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Wafer Bonder Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Semiconductor Wafer Bonder Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Semiconductor Wafer Bonder Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Semiconductor Wafer Bonder Production Value Estimates and Forecasts (2018-2029)
4 Semiconductor Wafer Bonder Consumption by Region
4.1 Global Semiconductor Wafer Bonder Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Semiconductor Wafer Bonder Consumption by Region (2018-2029)
4.2.1 Global Semiconductor Wafer Bonder Consumption by Region (2018-2023)
4.2.2 Global Semiconductor Wafer Bonder Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Semiconductor Wafer Bonder Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Semiconductor Wafer Bonder Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Wafer Bonder Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Semiconductor Wafer Bonder Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Wafer Bonder Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Semiconductor Wafer Bonder Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Wafer Bonder Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Semiconductor Wafer Bonder Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Semiconductor Wafer Bonder Production by Type (2018-2029)
5.1.1 Global Semiconductor Wafer Bonder Production by Type (2018-2023)
5.1.2 Global Semiconductor Wafer Bonder Production by Type (2024-2029)
5.1.3 Global Semiconductor Wafer Bonder Production Market Share by Type (2018-2029)
5.2 Global Semiconductor Wafer Bonder Production Value by Type (2018-2029)
5.2.1 Global Semiconductor Wafer Bonder Production Value by Type (2018-2023)
5.2.2 Global Semiconductor Wafer Bonder Production Value by Type (2024-2029)
5.2.3 Global Semiconductor Wafer Bonder Production Value Market Share by Type (2018-2029)
5.3 Global Semiconductor Wafer Bonder Price by Type (2018-2029)
6 Segment by Application
6.1 Global Semiconductor Wafer Bonder Production by Application (2018-2029)
6.1.1 Global Semiconductor Wafer Bonder Production by Application (2018-2023)
6.1.2 Global Semiconductor Wafer Bonder Production by Application (2024-2029)
6.1.3 Global Semiconductor Wafer Bonder Production Market Share by Application (2018-2029)
6.2 Global Semiconductor Wafer Bonder Production Value by Application (2018-2029)
6.2.1 Global Semiconductor Wafer Bonder Production Value by Application (2018-2023)
6.2.2 Global Semiconductor Wafer Bonder Production Value by Application (2024-2029)
6.2.3 Global Semiconductor Wafer Bonder Production Value Market Share by Application (2018-2029)
6.3 Global Semiconductor Wafer Bonder Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Besi
7.1.1 Besi Semiconductor Wafer Bonder Corporation Information
7.1.2 Besi Semiconductor Wafer Bonder Product Portfolio
7.1.3 Besi Semiconductor Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Besi Main Business and Markets Served
7.1.5 Besi Recent Developments/Updates
7.2 ASM Pacific Technology
7.2.1 ASM Pacific Technology Semiconductor Wafer Bonder Corporation Information
7.2.2 ASM Pacific Technology Semiconductor Wafer Bonder Product Portfolio
7.2.3 ASM Pacific Technology Semiconductor Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.2.4 ASM Pacific Technology Main Business and Markets Served
7.2.5 ASM Pacific Technology Recent Developments/Updates
7.3 Shibaura
7.3.1 Shibaura Semiconductor Wafer Bonder Corporation Information
7.3.2 Shibaura Semiconductor Wafer Bonder Product Portfolio
7.3.3 Shibaura Semiconductor Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Shibaura Main Business and Markets Served
7.3.5 Shibaura Recent Developments/Updates
7.4 Muehlbauer
7.4.1 Muehlbauer Semiconductor Wafer Bonder Corporation Information
7.4.2 Muehlbauer Semiconductor Wafer Bonder Product Portfolio
7.4.3 Muehlbauer Semiconductor Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Muehlbauer Main Business and Markets Served
7.4.5 Muehlbauer Recent Developments/Updates
7.5 Kulicke & Soffa
7.5.1 Kulicke & Soffa Semiconductor Wafer Bonder Corporation Information
7.5.2 Kulicke & Soffa Semiconductor Wafer Bonder Product Portfolio
7.5.3 Kulicke & Soffa Semiconductor Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Kulicke & Soffa Main Business and Markets Served
7.5.5 Kulicke & Soffa Recent Developments/Updates
7.6 Hamni
7.6.1 Hamni Semiconductor Wafer Bonder Corporation Information
7.6.2 Hamni Semiconductor Wafer Bonder Product Portfolio
7.6.3 Hamni Semiconductor Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Hamni Main Business and Markets Served
7.6.5 Hamni Recent Developments/Updates
7.7 ASM AMICRA
7.7.1 ASM AMICRA Semiconductor Wafer Bonder Corporation Information
7.7.2 ASM AMICRA Semiconductor Wafer Bonder Product Portfolio
7.7.3 ASM AMICRA Semiconductor Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.7.4 ASM AMICRA Main Business and Markets Served
7.7.5 ASM AMICRA Recent Developments/Updates
7.8 SET
7.8.1 SET Semiconductor Wafer Bonder Corporation Information
7.8.2 SET Semiconductor Wafer Bonder Product Portfolio
7.8.3 SET Semiconductor Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.8.4 SET Main Business and Markets Served
7.7.5 SET Recent Developments/Updates
7.9 Athlete FA
7.9.1 Athlete FA Semiconductor Wafer Bonder Corporation Information
7.9.2 Athlete FA Semiconductor Wafer Bonder Product Portfolio
7.9.3 Athlete FA Semiconductor Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Athlete FA Main Business and Markets Served
7.9.5 Athlete FA Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Wafer Bonder Industry Chain Analysis
8.2 Semiconductor Wafer Bonder Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Wafer Bonder Production Mode & Process
8.4 Semiconductor Wafer Bonder Sales and Marketing
8.4.1 Semiconductor Wafer Bonder Sales Channels
8.4.2 Semiconductor Wafer Bonder Distributors
8.5 Semiconductor Wafer Bonder Customers
9 Semiconductor Wafer Bonder Market Dynamics
9.1 Semiconductor Wafer Bonder Industry Trends
9.2 Semiconductor Wafer Bonder Market Drivers
9.3 Semiconductor Wafer Bonder Market Challenges
9.4 Semiconductor Wafer Bonder Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer



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