データバスコンポーネントの世界市場2023年：付属品、ボックスカプラー、コネクター、コンタクト、マイクロカプラー、ターミネーター

• 英文タイトル：Global Data Bus Component Market Research Report 2023

• レポートコード：MRC23Q35926 • 出版社/出版日：QYResearch / 2023年3月 • レポート形態：英文、PDF、85ページ • 納品方法：Eメール（2-3日） • 産業分類：電子＆半導体

• 販売価格（消費税別）

Single User	￥435,000 (USD2,900)	▷ お問い合わせ
Enterprise License	￥870,000 (USD5,800)	▷ お問い合わせ

• ご注文方法：お問い合わせフォーム記入又はEメールでご連絡ください。
• お支払方法：銀行振込（納品後、ご請求書送付）

---

レポート概要

---

本調査レポートは世界のデータバスコンポーネント市場について調査・分析し、世界のデータバスコンポーネント市場概要、市場トレンド、主要企業別競争状況、タイプ別セグメント分析（付属品、ボックスカプラー、コネクター、コンタクト、マイクロカプラー、ターミネーター）、用途別セグメント分析（船舶、航空宇宙、自動車、その他）、地域別市場規模、主要企業のプロファイルなどに関する情報を掲載しています。主要企業としては、Adesto Technologies、TE Con​​nectivity、Fujikura、Corning、Transdigm、Rockwell Collins、Nexans、Astronics Corporation、Data Device Corporation、Huber+Suhnerなどが含まれています。世界のデータバスコンポーネント市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争の影響は、データバスコンポーネント市場規模を推定する際に考慮しました。本レポートは、データバスコンポーネントの世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、データバスコンポーネントに関するビジネス上の意思決定に役立てることを目的としています。 ・データバスコンポーネント市場の概要 - データバスコンポーネントのタイプ別セグメント - 世界のデータバスコンポーネント市場規模：タイプ別分析（付属品、ボックスカプラー、コネクター、コンタクト、マイクロカプラー、ターミネーター） - データバスコンポーネントの用途別セグメント - 世界のデータバスコンポーネント市場規模：用途別分析（船舶、航空宇宙、自動車、その他） - 世界のデータバスコンポーネント市場規模予測（2018年-2029年） ・データバスコンポーネント市場の成長トレンド - データバスコンポーネントの地域別市場規模（2018年-2029年） - データバスコンポーネント市場ダイナミクス - データバスコンポーネントの業界動向 - データバスコンポーネント市場の成長ドライバ、課題、阻害要因 ・主要企業別競争状況 - 企業別市場シェア - 世界の主要企業、業界ランキング分析 - 市場への参入、M＆A動向 ・タイプ別セグメント：付属品、ボックスカプラー、コネクター、コンタクト、マイクロカプラー、ターミネーター - 世界のデータバスコンポーネントのタイプ別市場規模（2018年-2023年） - 世界のデータバスコンポーネントのタイプ別市場規模（2024年-2029年） ・用途別セグメント：船舶、航空宇宙、自動車、その他 - 世界のデータバスコンポーネントの用途別市場規模（2018年-2023年） - 世界のデータバスコンポーネントの用途別市場規模（2024年-2029年） ・データバスコンポーネントの地域別市場規模 - 北米のデータバスコンポーネント市場規模（2018年-2029年） - アメリカのデータバスコンポーネント市場規模（2018年-2029年） - ヨーロッパのデータバスコンポーネント市場規模（2018年-2029年） - アジア太平洋のデータバスコンポーネント市場規模（2018年-2029年） - 中国のデータバスコンポーネント市場規模（2018年-2029年） - 日本のデータバスコンポーネント市場規模（2018年-2029年） - 韓国のデータバスコンポーネント市場規模（2018年-2029年） - インドのデータバスコンポーネント市場規模（2018年-2029年） - オーストラリアのデータバスコンポーネント市場規模（2018年-2029年） - 中南米のデータバスコンポーネント市場規模（2018年-2029年） - 中東・アフリカのデータバスコンポーネント市場規模（2018年-2029年） ・主要企業のプロファイル：企業情報、事業概要、売上、動向 Adesto Technologies、TE Con​​nectivity、Fujikura、Corning、Transdigm、Rockwell Collins、Nexans、Astronics Corporation、Data Device Corporation、Huber+Suhner ・アナリストの観点/結論 ・調査方法とデータソース

Highlights
The global Data Bus Component market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Data Bus Component is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Data Bus Component is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The global market for Data Bus Component in Ship is estimated to increase from $ million in 2023 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Data Bus Component include Adesto Technologies, TE Con​​nectivity, Fujikura, Corning, Transdigm, Rockwell Collins, Nexans, Astronics Corporation and Data Device Corporation, etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Data Bus Component, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Data Bus Component.
The Data Bus Component market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Data Bus Component market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Data Bus Component companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Adesto Technologies
TE Con​​nectivity
Fujikura
Corning
Transdigm
Rockwell Collins
Nexans
Astronics Corporation
Data Device Corporation
Huber+Suhner
Segment by Type
Accessories
Box Couplers
Connectors
Contacts
Microcouplers
Terminators
Segment by Application
Ship
Aerospace
Automobile
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Data Bus Component companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

レポート目次

---

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Data Bus Component Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 Accessories
1.2.3 Box Couplers
1.2.4 Connectors
1.2.5 Contacts
1.2.6 Microcouplers
1.2.7 Terminators
1.3 Market by Application
1.3.1 Global Data Bus Component Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Ship
1.3.3 Aerospace
1.3.4 Automobile
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Data Bus Component Market Perspective (2018-2029)
2.2 Data Bus Component Growth Trends by Region
2.2.1 Global Data Bus Component Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Data Bus Component Historic Market Size by Region (2018-2023)
2.2.3 Data Bus Component Forecasted Market Size by Region (2024-2029)
2.3 Data Bus Component Market Dynamics
2.3.1 Data Bus Component Industry Trends
2.3.2 Data Bus Component Market Drivers
2.3.3 Data Bus Component Market Challenges
2.3.4 Data Bus Component Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Data Bus Component Players by Revenue
3.1.1 Global Top Data Bus Component Players by Revenue (2018-2023)
3.1.2 Global Data Bus Component Revenue Market Share by Players (2018-2023)
3.2 Global Data Bus Component Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Data Bus Component Revenue
3.4 Global Data Bus Component Market Concentration Ratio
3.4.1 Global Data Bus Component Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Data Bus Component Revenue in 2022
3.5 Data Bus Component Key Players Head office and Area Served
3.6 Key Players Data Bus Component Product Solution and Service
3.7 Date of Enter into Data Bus Component Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Data Bus Component Breakdown Data by Type
4.1 Global Data Bus Component Historic Market Size by Type (2018-2023)
4.2 Global Data Bus Component Forecasted Market Size by Type (2024-2029)
5 Data Bus Component Breakdown Data by Application
5.1 Global Data Bus Component Historic Market Size by Application (2018-2023)
5.2 Global Data Bus Component Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Data Bus Component Market Size (2018-2029)
6.2 North America Data Bus Component Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Data Bus Component Market Size by Country (2018-2023)
6.4 North America Data Bus Component Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Data Bus Component Market Size (2018-2029)
7.2 Europe Data Bus Component Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Data Bus Component Market Size by Country (2018-2023)
7.4 Europe Data Bus Component Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Data Bus Component Market Size (2018-2029)
8.2 Asia-Pacific Data Bus Component Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Data Bus Component Market Size by Region (2018-2023)
8.4 Asia-Pacific Data Bus Component Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Data Bus Component Market Size (2018-2029)
9.2 Latin America Data Bus Component Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Data Bus Component Market Size by Country (2018-2023)
9.4 Latin America Data Bus Component Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Data Bus Component Market Size (2018-2029)
10.2 Middle East & Africa Data Bus Component Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Data Bus Component Market Size by Country (2018-2023)
10.4 Middle East & Africa Data Bus Component Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Adesto Technologies
11.1.1 Adesto Technologies Company Detail
11.1.2 Adesto Technologies Business Overview
11.1.3 Adesto Technologies Data Bus Component Introduction
11.1.4 Adesto Technologies Revenue in Data Bus Component Business (2018-2023)
11.1.5 Adesto Technologies Recent Development
11.2 TE Con​​nectivity
11.2.1 TE Con​​nectivity Company Detail
11.2.2 TE Con​​nectivity Business Overview
11.2.3 TE Con​​nectivity Data Bus Component Introduction
11.2.4 TE Con​​nectivity Revenue in Data Bus Component Business (2018-2023)
11.2.5 TE Con​​nectivity Recent Development
11.3 Fujikura
11.3.1 Fujikura Company Detail
11.3.2 Fujikura Business Overview
11.3.3 Fujikura Data Bus Component Introduction
11.3.4 Fujikura Revenue in Data Bus Component Business (2018-2023)
11.3.5 Fujikura Recent Development
11.4 Corning
11.4.1 Corning Company Detail
11.4.2 Corning Business Overview
11.4.3 Corning Data Bus Component Introduction
11.4.4 Corning Revenue in Data Bus Component Business (2018-2023)
11.4.5 Corning Recent Development
11.5 Transdigm
11.5.1 Transdigm Company Detail
11.5.2 Transdigm Business Overview
11.5.3 Transdigm Data Bus Component Introduction
11.5.4 Transdigm Revenue in Data Bus Component Business (2018-2023)
11.5.5 Transdigm Recent Development
11.6 Rockwell Collins
11.6.1 Rockwell Collins Company Detail
11.6.2 Rockwell Collins Business Overview
11.6.3 Rockwell Collins Data Bus Component Introduction
11.6.4 Rockwell Collins Revenue in Data Bus Component Business (2018-2023)
11.6.5 Rockwell Collins Recent Development
11.7 Nexans
11.7.1 Nexans Company Detail
11.7.2 Nexans Business Overview
11.7.3 Nexans Data Bus Component Introduction
11.7.4 Nexans Revenue in Data Bus Component Business (2018-2023)
11.7.5 Nexans Recent Development
11.8 Astronics Corporation
11.8.1 Astronics Corporation Company Detail
11.8.2 Astronics Corporation Business Overview
11.8.3 Astronics Corporation Data Bus Component Introduction
11.8.4 Astronics Corporation Revenue in Data Bus Component Business (2018-2023)
11.8.5 Astronics Corporation Recent Development
11.9 Data Device Corporation
11.9.1 Data Device Corporation Company Detail
11.9.2 Data Device Corporation Business Overview
11.9.3 Data Device Corporation Data Bus Component Introduction
11.9.4 Data Device Corporation Revenue in Data Bus Component Business (2018-2023)
11.9.5 Data Device Corporation Recent Development
11.10 Huber+Suhner
11.10.1 Huber+Suhner Company Detail
11.10.2 Huber+Suhner Business Overview
11.10.3 Huber+Suhner Data Bus Component Introduction
11.10.4 Huber+Suhner Revenue in Data Bus Component Business (2018-2023)
11.10.5 Huber+Suhner Recent Development
12 Analyst’s Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

---