 | • レポートコード：MRC2304F104 • 出版社/出版日：360iResearch / 2022年10月 • レポート形態：英語、PDF、256ページ • 納品方法：Eメール（受注後2-3日） • 産業分類：電子 |
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レポート概要
| 360iResearch社の本調査レポートによると、2021年に1,961.9億ドルであった世界の受動＆相互接続電子部品市場規模は2022年に2,109.5億ドルになり、更に年平均7.69％拡大して2027年までに3,061.4億ドルに達する見通しです。本書は、受動＆相互接続電子部品の世界市場についての多面的な調査を元に、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、種類別（相互接続部品、受動部品）分析、用途別（自動車＆輸送、家電、情報処理、産業機器、医療機器）分析、地域別（南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他）分析、競争状況、企業情報などの内容をまとめた市場調査レポートです。なお、本書に掲載されている企業情報には、ABB Ltd、American Electronic Components、Amphenol Corporation、API Technologies、Berkshire Hathaway Group、Datronix Holding Ltd.、Eaton Corporation PLC、Fujitsu Component Limited、Hirose Electric Co., Ltd、Hosiden Corporationなどが含まれています。 ・序論 ・調査方法 ・エグゼクティブサマリー ・市場概要 ・市場インサイト ・世界の受動＆相互接続電子部品市場規模：種類別 - 相互接続部品の市場規模 - 受動部品の市場規模 ・世界の受動＆相互接続電子部品市場規模：用途別 - 自動車＆輸送における市場規模 - 家電における市場規模 - 情報処理における市場規模 - 産業機器における市場規模 - 医療機器における市場規模 ・世界の受動＆相互接続電子部品市場規模：地域別 - 南北アメリカの受動＆相互接続電子部品市場規模 アメリカの受動＆相互接続電子部品市場規模 カナダの受動＆相互接続電子部品市場規模 ブラジルの受動＆相互接続電子部品市場規模 ... - アジア太平洋の受動＆相互接続電子部品市場規模 日本の受動＆相互接続電子部品市場規模 中国の受動＆相互接続電子部品市場規模 インドの受動＆相互接続電子部品市場規模 韓国の受動＆相互接続電子部品市場規模 台湾の受動＆相互接続電子部品市場規模 ... - ヨーロッパ/中東/アフリカの受動＆相互接続電子部品市場規模 イギリスの受動＆相互接続電子部品市場規模 ドイツの受動＆相互接続電子部品市場規模 フランスの受動＆相互接続電子部品市場規模 ロシアの受動＆相互接続電子部品市場規模 ... - その他地域の受動＆相互接続電子部品市場規模 ・競争状況 ・企業情報 |
The Global Passive & Interconnecting Electronic Components Market size was estimated at USD 196.19 billion in 2021 and expected to reach USD 210.95 billion in 2022, and is projected to grow at a CAGR 7.69% to reach USD 306.14 billion by 2027.
Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.
Market Segmentation & Coverage:
This research report categorizes the Passive & Interconnecting Electronic Components to forecast the revenues and analyze the trends in each of the following sub-markets:
Based on Type, the market was studied across Interconnects and Passive Components. The Interconnects is further studied across Connectors, Printed Circuit Boards, Relays, and Switches. The Passive Components is further studied across Capacitors, Diodes, Inductors, Resistors, and Transformers.
Based on Application, the market was studied across Automotive & Transportation, Consumer Electronics, Data Processing, Industrial Equipment, Medical Devices, Military & Aerospace Equipment, and Telecommunication.
Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.
Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.
Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Passive & Interconnecting Electronic Components market considering the current update on the conflict and its global response.
Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.
FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Passive & Interconnecting Electronic Components Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.
Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.
Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.
Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Passive & Interconnecting Electronic Components Market, including ABB Ltd, American Electronic Components, Amphenol Corporation, API Technologies, Berkshire Hathaway Group, Datronix Holding Ltd., Eaton Corporation PLC, Fujitsu Component Limited, Hirose Electric Co., Ltd, Hosiden Corporation, Japan Aviation Electronics Industry, Ltd., Molex Incorporated, Murata Manufacturing Co., Ltd., Nichicon Corporation, Panasonic Corporation, Samsung Electro-Mechanics, STMicroelectronics, Taiyo Yuden Co., Ltd., TDK Corporation, TE Connectivity Ltd., The 3M Company, and Vishay Intertechnology, Inc..
The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments
The report answers questions such as:
1. What is the market size and forecast of the Global Passive & Interconnecting Electronic Components Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Passive & Interconnecting Electronic Components Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Passive & Interconnecting Electronic Components Market?
4. What is the competitive strategic window for opportunities in the Global Passive & Interconnecting Electronic Components Market?
5. What are the technology trends and regulatory frameworks in the Global Passive & Interconnecting Electronic Components Market?
6. What is the market share of the leading vendors in the Global Passive & Interconnecting Electronic Components Market?
7. What modes and strategic moves are considered suitable for entering the Global Passive & Interconnecting Electronic Components Market?
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Significantly growing adoption of smartphones and laptops
5.1.1.2. Growing trend of automation and manufacturing facilities are implementing several connected devices
5.1.1.3. Proliferation of consumer electronics such as portable music players, digital cameras, and gaming consoles
5.1.2. Restraints
5.1.2.1. Rising cost of passive electronic components
5.1.3. Opportunities
5.1.3.1. Advancement and incorporation of infotainment and navigation features
5.1.3.2. Rapidly increasing 5G network infrastructure coupled with high-speed internet
5.1.4. Challenges
5.1.4.1. Complexity of passive and interconnecting electronic components
5.2. Cumulative Impact of COVID-19
6. Passive & Interconnecting Electronic Components Market, by Type
6.1. Introduction
6.2. Interconnects
6.3.1. Connectors
6.3.2. Printed Circuit Boards
6.3.3. Relays
6.3.4. Switches
6.3. Passive Components
6.4.1. Capacitors
6.4.2. Diodes
6.4.3. Inductors
6.4.4. Resistors
6.4.5. Transformers
7. Passive & Interconnecting Electronic Components Market, by Application
7.1. Introduction
7.2. Automotive & Transportation
7.3. Consumer Electronics
7.4. Data Processing
7.5. Industrial Equipment
7.6. Medical Devices
7.7. Military & Aerospace Equipment
7.8. Telecommunication
8. Americas Passive & Interconnecting Electronic Components Market
8.1. Introduction
8.2. Argentina
8.3. Brazil
8.4. Canada
8.5. Mexico
8.6. United States
9. Asia-Pacific Passive & Interconnecting Electronic Components Market
9.1. Introduction
9.2. Australia
9.3. China
9.4. India
9.5. Indonesia
9.6. Japan
9.7. Malaysia
9.8. Philippines
9.9. Singapore
9.10. South Korea
9.11. Taiwan
9.12. Thailand
9.13. Vietnam
10. Europe, Middle East & Africa Passive & Interconnecting Electronic Components Market
10.1. Introduction
10.2. Denmark
10.3. Egypt
10.4. Finland
10.5. France
10.6. Germany
10.7. Israel
10.8. Italy
10.9. Netherlands
10.10. Nigeria
10.11. Norway
10.12. Poland
10.13. Qatar
10.14. Russia
10.15. Saudi Arabia
10.16. South Africa
10.17. Spain
10.18. Sweden
10.19. Switzerland
10.20. Turkey
10.21. United Arab Emirates
10.22. United Kingdom
11. Competitive Landscape
11.1. FPNV Positioning Matrix
11.1.1. Quadrants
11.1.2. Business Strategy
11.1.3. Product Satisfaction
11.2. Market Ranking Analysis, By Key Player
11.3. Market Share Analysis, By Key Player
11.4. Competitive Scenario
11.4.1. Merger & Acquisition
11.4.2. Agreement, Collaboration, & Partnership
11.4.3. New Product Launch & Enhancement
11.4.4. Investment & Funding
11.4.5. Award, Recognition, & Expansion
12. Company Usability Profiles
12.1. ABB Ltd
12.1.1. Business Overview
12.1.2. Key Executives
12.1.3. Product & Services
12.2. American Electronic Components
12.2.1. Business Overview
12.2.2. Key Executives
12.2.3. Product & Services
12.3. Amphenol Corporation
12.3.1. Business Overview
12.3.2. Key Executives
12.3.3. Product & Services
12.4. API Technologies
12.4.1. Business Overview
12.4.2. Key Executives
12.4.3. Product & Services
12.5. Berkshire Hathaway Group
12.5.1. Business Overview
12.5.2. Key Executives
12.5.3. Product & Services
12.6. Datronix Holding Ltd.
12.6.1. Business Overview
12.6.2. Key Executives
12.6.3. Product & Services
12.7. Eaton Corporation PLC
12.7.1. Business Overview
12.7.2. Key Executives
12.7.3. Product & Services
12.8. Fujitsu Component Limited
12.8.1. Business Overview
12.8.2. Key Executives
12.8.3. Product & Services
12.9. Hirose Electric Co., Ltd
12.9.1. Business Overview
12.9.2. Key Executives
12.9.3. Product & Services
12.10. Hosiden Corporation
12.10.1. Business Overview
12.10.2. Key Executives
12.10.3. Product & Services
12.11. Japan Aviation Electronics Industry, Ltd.
12.11.1. Business Overview
12.11.2. Key Executives
12.11.3. Product & Services
12.12. Molex Incorporated
12.12.1. Business Overview
12.12.2. Key Executives
12.12.3. Product & Services
12.13. Murata Manufacturing Co., Ltd.
12.13.1. Business Overview
12.13.2. Key Executives
12.13.3. Product & Services
12.14. Nichicon Corporation
12.14.1. Business Overview
12.14.2. Key Executives
12.14.3. Product & Services
12.15. Panasonic Corporation
12.15.1. Business Overview
12.15.2. Key Executives
12.15.3. Product & Services
12.16. Samsung Electro-Mechanics
12.16.1. Business Overview
12.16.2. Key Executives
12.16.3. Product & Services
12.17. STMicroelectronics
12.17.1. Business Overview
12.17.2. Key Executives
12.17.3. Product & Services
12.18. Taiyo Yuden Co., Ltd.
12.18.1. Business Overview
12.18.2. Key Executives
12.18.3. Product & Services
12.19. TDK Corporation
12.19.1. Business Overview
12.19.2. Key Executives
12.19.3. Product & Services
12.20. TE Connectivity Ltd.
12.20.1. Business Overview
12.20.2. Key Executives
12.20.3. Product & Services
12.21. The 3M Company
12.21.1. Business Overview
12.21.2. Key Executives
12.21.3. Product & Services
12.22. Vishay Intertechnology, Inc.
12.22.1. Business Overview
12.22.2. Key Executives
12.22.3. Product & Services
13. Appendix
13.1. Discussion Guide
13.2. License & Pricing