▶ 調査レポート

世界のWi-Fiチップセット市場(~2027):MIMO構成別、IEEE標準別、製品別、帯域別、地域別

• 英文タイトル:Wi-Fi Chipset Market Research Report by MIMO Configuration, IEEE Standards, Product, Band, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19

360iResearchが調査・発行した産業分析レポートです。世界のWi-Fiチップセット市場(~2027):MIMO構成別、IEEE標準別、製品別、帯域別、地域別 / Wi-Fi Chipset Market Research Report by MIMO Configuration, IEEE Standards, Product, Band, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19 / MRC2305B222資料のイメージです。• レポートコード:MRC2305B222
• 出版社/出版日:360iResearch / 2022年10月
• レポート形態:英語、PDF、232ページ
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レポート概要
360iResearch社は、世界のWi-Fiチップセット市場規模が2021年に219.7億ドル、2022年に241.2億ドルとなり、今後年平均9.94%拡大して2027年には388.1億ドルまで成長すると予測しています。当市場調査レポートは、Wi-Fiチップセットの世界市場を多面的に分析し、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、MIMO構成別(1x1MU-MIMO、2x2MU-MIMO、3x3MU-MIMO、4x4MU-MIMO、8x8MU-MIMO)分析、IEEE標準別(IEEE 802.11acWave1、IEEE 802.11acWave2、IEEE 802.11ad、IEEE 802.11ax、IEEE 802.11ay)分析、製品別(アクセスポイント機器、コネクテッドホームデバイス、PCS、スマートフォン、タブレット)分析、帯域別(デュアルバンド、シングルバンド、トライバンド)分析、地域別(南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他)分析、競争状況、企業情報などの構成でまとめました。また、当書には、Blu Wireless Technology Ltd、Broadcom Inc.、Celeno Communications, Ltd.、Cypress Semiconductor Corporation、Espressif Systems Pte., Ltd.、Intel Corporation、Marvell Technology Group Ltd.、MediaTek Inc.、Microchip Technology, Inc.、Peraso Technologies, Inc.などの企業情報が含まれています。
・序論
・調査方法
・エグゼクティブサマリー
・市場概要
・市場インサイト
・世界のWi-Fiチップセット市場規模:MIMO構成別
- 1x1MU-MIMOの市場規模
- 2x2MU-MIMOの市場規模
- 3x3MU-MIMOの市場規模
- 4x4MU-MIMOの市場規模
- 8x8MU-MIMOの市場規模
・世界のWi-Fiチップセット市場規模:IEEE標準別
- IEEE 802.11acWave1の市場規模
- IEEE 802.11acWave2の市場規模
- IEEE 802.11adの市場規模
- IEEE 802.11axの市場規模
- IEEE 802.11ayの市場規模
・世界のWi-Fiチップセット市場規模:製品別
- アクセスポイント機器の市場規模
- コネクテッドホームデバイスの市場規模
- PCSの市場規模
- スマートフォンの市場規模
- タブレットの市場規模
・世界のWi-Fiチップセット市場規模:帯域別
- デュアルバンドの市場規模
- シングルバンドの市場規模
- トライバンドの市場規模
・世界のWi-Fiチップセット市場規模:地域別
- 南北アメリカのWi-Fiチップセット市場規模
アメリカのWi-Fiチップセット市場規模
カナダのWi-Fiチップセット市場規模
ブラジルのWi-Fiチップセット市場規模
...
- アジア太平洋のWi-Fiチップセット市場規模
日本のWi-Fiチップセット市場規模
中国のWi-Fiチップセット市場規模
インドのWi-Fiチップセット市場規模
韓国のWi-Fiチップセット市場規模
台湾のWi-Fiチップセット市場規模
...
- ヨーロッパ/中東/アフリカのWi-Fiチップセット市場規模
イギリスのWi-Fiチップセット市場規模
ドイツのWi-Fiチップセット市場規模
フランスのWi-Fiチップセット市場規模
ロシアのWi-Fiチップセット市場規模
...
- その他地域のWi-Fiチップセット市場規模
・競争状況
・企業情報

The Global Wi-Fi Chipset Market size was estimated at USD 21.97 billion in 2021 and expected to reach USD 24.12 billion in 2022, and is projected to grow at a CAGR 9.94% to reach USD 38.81 billion by 2027.

Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.

Market Segmentation & Coverage:
This research report categorizes the Wi-Fi Chipset to forecast the revenues and analyze the trends in each of the following sub-markets:

Based on MIMO Configuration, the market was studied across 1×1 MU-MIMO, 2×2 MU-MIMO, 3×3 MU-MIMO, 4×4 MU-MIMO, 8×8 MU-MIMO, MU-MIMO, and SU-MIMO.

Based on IEEE Standards, the market was studied across IEEE 802.11ac Wave 1, IEEE 802.11ac Wave 2, IEEE 802.11ad, IEEE 802.11ax, IEEE 802.11ay, IEEE 802.11b/G, and IEEE 802.11n (SB and DB).

Based on Product, the market was studied across Access Point Equipment, Connected Home Devices, PCS, Smartphones, and Tablet.

Based on Band, the market was studied across Dual Band, Single Band, and TRI Band.

Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Wi-Fi Chipset market considering the current update on the conflict and its global response.

Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Wi-Fi Chipset Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.

Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Wi-Fi Chipset Market, including Blu Wireless Technology Ltd, Broadcom Inc., Celeno Communications, Ltd., Cypress Semiconductor Corporation, Espressif Systems Pte., Ltd., Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., Microchip Technology, Inc., Peraso Technologies, Inc., Qualcomm Technologies, Inc., Quantenna Communications, Inc., Samsung Electronics Co., Ltd., Stmicroelectronics N.V., and Texas Instruments Inc..

The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:
1. What is the market size and forecast of the Global Wi-Fi Chipset Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Wi-Fi Chipset Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Wi-Fi Chipset Market?
4. What is the competitive strategic window for opportunities in the Global Wi-Fi Chipset Market?
5. What are the technology trends and regulatory frameworks in the Global Wi-Fi Chipset Market?
6. What is the market share of the leading vendors in the Global Wi-Fi Chipset Market?
7. What modes and strategic moves are considered suitable for entering the Global Wi-Fi Chipset Market?

レポート目次

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Increasing popularity of voice over Wi-Fi
5.1.1.2. Growing integration between Wi-Fi and mobile networks
5.1.1.3. Development of smart-home technology and the proliferation of Wi-Fi-enabled mobile devices
5.1.1.4. Growing number of public Wi-Fi hotspots
5.1.2. Restraints
5.1.2.1. Growing security concern
5.1.2.2. Declining shipment of PCs and Tablets
5.1.3. Opportunities
5.1.3.1. Emergence of wearable technology
5.1.3.2. Increasing integration of Wi-Fi into homes and enterprises
5.1.3.3. Application advancement of Wi-Fi in Augmented Reality (AR) and Virtual Reality (VR)
5.1.4. Challenges
5.1.4.1. Overcrowded unlicensed wireless frequency spectrum
5.1.4.2. Issues due to use of 5 GHz band Wi-Fi with LTE in unlicensed spectrum (LTE-U)
5.2. Cumulative Impact of COVID-19

6. Wi-Fi Chipset Market, by MIMO Configuration
6.1. Introduction
6.2. 1×1 MU-MIMO
6.3. 2×2 MU-MIMO
6.4. 3×3 MU-MIMO
6.5. 4×4 MU-MIMO
6.6. 8×8 MU-MIMO
6.7. MU-MIMO
6.8. SU-MIMO

7. Wi-Fi Chipset Market, by IEEE Standards
7.1. Introduction
7.2. IEEE 802.11ac Wave 1
7.3. IEEE 802.11ac Wave 2
7.4. IEEE 802.11ad
7.5. IEEE 802.11ax
7.6. IEEE 802.11ay
7.7. IEEE 802.11b/G
7.8. IEEE 802.11n (SB and DB)

8. Wi-Fi Chipset Market, by Product
8.1. Introduction
8.2. Access Point Equipment
8.3. Connected Home Devices
8.4. PCS
8.5. Smartphones
8.6. Tablet

9. Wi-Fi Chipset Market, by Band
9.1. Introduction
9.2. Dual Band
9.3. Single Band
9.4. TRI Band

10. Americas Wi-Fi Chipset Market
10.1. Introduction
10.2. Argentina
10.3. Brazil
10.4. Canada
10.5. Mexico
10.6. United States

11. Asia-Pacific Wi-Fi Chipset Market
11.1. Introduction
11.2. Australia
11.3. China
11.4. India
11.5. Indonesia
11.6. Japan
11.7. Malaysia
11.8. Philippines
11.9. Singapore
11.10. South Korea
11.11. Taiwan
11.12. Thailand
11.13. Vietnam

12. Europe, Middle East & Africa Wi-Fi Chipset Market
12.1. Introduction
12.2. Denmark
12.3. Egypt
12.4. Finland
12.5. France
12.6. Germany
12.7. Israel
12.8. Italy
12.9. Netherlands
12.10. Nigeria
12.11. Norway
12.12. Poland
12.13. Qatar
12.14. Russia
12.15. Saudi Arabia
12.16. South Africa
12.17. Spain
12.18. Sweden
12.19. Switzerland
12.20. Turkey
12.21. United Arab Emirates
12.22. United Kingdom

13. Competitive Landscape
13.1. FPNV Positioning Matrix
13.1.1. Quadrants
13.1.2. Business Strategy
13.1.3. Product Satisfaction
13.2. Market Ranking Analysis, By Key Player
13.3. Market Share Analysis, By Key Player
13.4. Competitive Scenario
13.4.1. Merger & Acquisition
13.4.2. Agreement, Collaboration, & Partnership
13.4.3. New Product Launch & Enhancement
13.4.4. Investment & Funding
13.4.5. Award, Recognition, & Expansion

14. Company Usability Profiles
14.1. Blu Wireless Technology Ltd
14.1.1. Business Overview
14.1.2. Key Executives
14.1.3. Product & Services
14.2. Broadcom Inc.
14.2.1. Business Overview
14.2.2. Key Executives
14.2.3. Product & Services
14.3. Celeno Communications, Ltd.
14.3.1. Business Overview
14.3.2. Key Executives
14.3.3. Product & Services
14.4. Cypress Semiconductor Corporation
14.4.1. Business Overview
14.4.2. Key Executives
14.4.3. Product & Services
14.5. Espressif Systems Pte., Ltd.
14.5.1. Business Overview
14.5.2. Key Executives
14.5.3. Product & Services
14.6. Intel Corporation
14.6.1. Business Overview
14.6.2. Key Executives
14.6.3. Product & Services
14.7. Marvell Technology Group Ltd.
14.7.1. Business Overview
14.7.2. Key Executives
14.7.3. Product & Services
14.8. MediaTek Inc.
14.8.1. Business Overview
14.8.2. Key Executives
14.8.3. Product & Services
14.9. Microchip Technology, Inc.
14.9.1. Business Overview
14.9.2. Key Executives
14.9.3. Product & Services
14.10. Peraso Technologies, Inc.
14.10.1. Business Overview
14.10.2. Key Executives
14.10.3. Product & Services
14.11. Qualcomm Technologies, Inc.
14.11.1. Business Overview
14.11.2. Key Executives
14.11.3. Product & Services
14.12. Quantenna Communications, Inc.
14.12.1. Business Overview
14.12.2. Key Executives
14.12.3. Product & Services
14.13. Samsung Electronics Co., Ltd.
14.13.1. Business Overview
14.13.2. Key Executives
14.13.3. Product & Services
14.14. Stmicroelectronics N.V.
14.14.1. Business Overview
14.14.2. Key Executives
14.14.3. Product & Services
14.15. Texas Instruments Inc.
14.15.1. Business Overview
14.15.2. Key Executives
14.15.3. Product & Services

15. Appendix
15.1. Discussion Guide
15.2. License & Pricing