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レポート概要
| GlobalInfoResearchの最新の調査によると、世界の薄ウェーハ仮止め接着剤の市場規模は2022年のxxx米ドルから2029年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。新型コロナウイルス感染症とロシア・ウクライナ戦争の影響を考慮しながら市場規模を推計しました。 このレポートは、世界の薄ウェーハ仮止め接着剤市場に関する詳細かつ包括的な分析の結果です。定量的分析と定性的分析データが、メーカー別、地域別、国別、種類別、用途別に記載されています。 市場は常に変化しているため、本レポートでは、競争、需要と供給の傾向、および多くの市場にわたる需要の変化に影響する主要な要因を調査しました。主要な競合他社の企業概要と製品例、および2023年の市場シェア予測も記載しました。 本レポートの主な目的は次のとおりです。 - 世界および主要国の市場機会の規模を決定するため - 薄ウェーハ仮止め接着剤の成長可能性を評価するため - 各製品および最終用途市場の将来の成長を予測するため - 市場に影響を与える競争要因を評価するため 薄ウェーハ仮止め接着剤市場は種類と用途によって区分されます。2018年～2029年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 種類別セグメント ・熱スライドオフ剥離、機械剥離、レーザー剥離 用途別セグメント ・MEMS、アドバンストパッケージング、CMOS、その他 主要な市場プレーヤー ・3M、Daxin Materials、Brewer Science、AI Technology、YINCAE Advanced Materials、Micro Materials、Promerus、Daetec、Suntific Materials 地域別セグメントは次の地域・国をカバーします。 ・北米（米国、カナダ、メキシコ） ・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南アメリカ（ブラジル、アルゼンチン、コロンビア） ・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、薄ウェーハ仮止め接着剤製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要な薄ウェーハ仮止め接着剤メーカーの企業概要、2019年～2022年までの薄ウェーハ仮止め接着剤の価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要な薄ウェーハ仮止め接着剤メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2018年～2029年までの地域別薄ウェーハ仮止め接着剤の販売量、売上、成長性を示しています。 ・第5、6章では、2018年～2029年までの薄ウェーハ仮止め接着剤の種類別と用途別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2018年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2029年までの主要地域での薄ウェーハ仮止め接着剤市場予測を収録しています。 ・第12章では、市場力学、成長要因、阻害要因、トレンド、ポーターズファイブフォース分析、新型コロナウイルス感染症とロシア・ウクライナ戦争の影響を掲載しています。 ・第13章では、主要な原材料、主要なサプライヤー、および薄ウェーハ仮止め接着剤の産業チェーンを掲載しています。 ・第14、15章では、薄ウェーハ仮止め接着剤の販売チャネル、販売業者、顧客、調査結果について説明します。 ***** 目次(一部) ***** ・市場概要 - 薄ウェーハ仮止め接着剤の概要 - 種類別分析（2018年vs2022年vs2029年）：熱スライドオフ剥離、機械剥離、レーザー剥離 - 用途別分析（2018年vs2022年vs2029年）：MEMS、アドバンストパッケージング、CMOS、その他 - 世界の薄ウェーハ仮止め接着剤市場規模・予測 - 世界の薄ウェーハ仮止め接着剤生産能力分析 - 市場の成長要因・阻害要因・動向 ・メーカー情報（企業概要、製品概要、販売量、価格、売上） - 3M、Daxin Materials、Brewer Science、AI Technology、YINCAE Advanced Materials、Micro Materials、Promerus、Daetec、Suntific Materials ・メーカー別市場シェア・市場集中度 ・地域別市場分析2018年-2029年 ・種類別分析2018年-2029年：熱スライドオフ剥離、機械剥離、レーザー剥離 ・用途別分析2018年-2029年：MEMS、アドバンストパッケージング、CMOS、その他 ・薄ウェーハ仮止め接着剤の北米市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：アメリカ、カナダ、メキシコなど ・薄ウェーハ仮止め接着剤のヨーロッパ市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：ドイツ、イギリス、フランス、ロシア、イタリアなど ・薄ウェーハ仮止め接着剤のアジア市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：中国、日本、韓国、インド、東南アジア、オーストラリアなど ・薄ウェーハ仮止め接着剤の南米市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：ブラジル、アルゼンチンなど ・薄ウェーハ仮止め接着剤の中東・アフリカ市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：サウジアラビア、トルコ、エジプト、南アフリカなど ・市場力学（成長要因、阻害要因、トレンド、ポーターズファイブフォース分析） ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論 |
According to our (Global Info Research) latest study, the global Thin Wafer Temporary Bonding Adhesive market size was valued at USD 183.2 million in 2022 and is forecast to a readjusted size of USD 343 million by 2029 with a CAGR of 9.4% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Thin Wafer Temporary Bonding Adhesive can bonded with different surface, This product can be used for backside processes such as fixing, thinning, etching, passivation, electroplating, and reflow soldering of thin wafers below 100μm.
This report is a detailed and comprehensive analysis for global Thin Wafer Temporary Bonding Adhesive market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Thin Wafer Temporary Bonding Adhesive market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029
Global Thin Wafer Temporary Bonding Adhesive market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029
Global Thin Wafer Temporary Bonding Adhesive market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029
Global Thin Wafer Temporary Bonding Adhesive market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thin Wafer Temporary Bonding Adhesive
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thin Wafer Temporary Bonding Adhesive market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include 3M, Daxin Materials, Brewer Science, AI Technology and YINCAE Advanced Materials, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Thin Wafer Temporary Bonding Adhesive market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Thermal Slide-off Debonding
Mechanical Debonding
Laser Debonding
Market segment by Application
MEMS
Advanced Packaging
CMOS
Other
Major players covered
3M
Daxin Materials
Brewer Science
AI Technology
YINCAE Advanced Materials
Micro Materials
Promerus
Daetec
Suntific Materials
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thin Wafer Temporary Bonding Adhesive product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Thin Wafer Temporary Bonding Adhesive, with price, sales, revenue and global market share of Thin Wafer Temporary Bonding Adhesive from 2018 to 2023.
Chapter 3, the Thin Wafer Temporary Bonding Adhesive competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thin Wafer Temporary Bonding Adhesive breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Thin Wafer Temporary Bonding Adhesive market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Thin Wafer Temporary Bonding Adhesive.
Chapter 14 and 15, to describe Thin Wafer Temporary Bonding Adhesive sales channel, distributors, customers, research findings and conclusion.
1 Market Overview
1.1 Product Overview and Scope of Thin Wafer Temporary Bonding Adhesive
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Type
1.3.1 Overview: Global Thin Wafer Temporary Bonding Adhesive Consumption Value by Type: 2018 Versus 2022 Versus 2029
1.3.2 Thermal Slide-off Debonding
1.3.3 Mechanical Debonding
1.3.4 Laser Debonding
1.4 Market Analysis by Application
1.4.1 Overview: Global Thin Wafer Temporary Bonding Adhesive Consumption Value by Application: 2018 Versus 2022 Versus 2029
1.4.2 MEMS
1.4.3 Advanced Packaging
1.4.4 CMOS
1.4.5 Other
1.5 Global Thin Wafer Temporary Bonding Adhesive Market Size & Forecast
1.5.1 Global Thin Wafer Temporary Bonding Adhesive Consumption Value (2018 & 2022 & 2029)
1.5.2 Global Thin Wafer Temporary Bonding Adhesive Sales Quantity (2018-2029)
1.5.3 Global Thin Wafer Temporary Bonding Adhesive Average Price (2018-2029)
2 Manufacturers Profiles
2.1 3M
2.1.1 3M Details
2.1.2 3M Major Business
2.1.3 3M Thin Wafer Temporary Bonding Adhesive Product and Services
2.1.4 3M Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.1.5 3M Recent Developments/Updates
2.2 Daxin Materials
2.2.1 Daxin Materials Details
2.2.2 Daxin Materials Major Business
2.2.3 Daxin Materials Thin Wafer Temporary Bonding Adhesive Product and Services
2.2.4 Daxin Materials Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.2.5 Daxin Materials Recent Developments/Updates
2.3 Brewer Science
2.3.1 Brewer Science Details
2.3.2 Brewer Science Major Business
2.3.3 Brewer Science Thin Wafer Temporary Bonding Adhesive Product and Services
2.3.4 Brewer Science Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.3.5 Brewer Science Recent Developments/Updates
2.4 AI Technology
2.4.1 AI Technology Details
2.4.2 AI Technology Major Business
2.4.3 AI Technology Thin Wafer Temporary Bonding Adhesive Product and Services
2.4.4 AI Technology Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.4.5 AI Technology Recent Developments/Updates
2.5 YINCAE Advanced Materials
2.5.1 YINCAE Advanced Materials Details
2.5.2 YINCAE Advanced Materials Major Business
2.5.3 YINCAE Advanced Materials Thin Wafer Temporary Bonding Adhesive Product and Services
2.5.4 YINCAE Advanced Materials Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.5.5 YINCAE Advanced Materials Recent Developments/Updates
2.6 Micro Materials
2.6.1 Micro Materials Details
2.6.2 Micro Materials Major Business
2.6.3 Micro Materials Thin Wafer Temporary Bonding Adhesive Product and Services
2.6.4 Micro Materials Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.6.5 Micro Materials Recent Developments/Updates
2.7 Promerus
2.7.1 Promerus Details
2.7.2 Promerus Major Business
2.7.3 Promerus Thin Wafer Temporary Bonding Adhesive Product and Services
2.7.4 Promerus Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.7.5 Promerus Recent Developments/Updates
2.8 Daetec
2.8.1 Daetec Details
2.8.2 Daetec Major Business
2.8.3 Daetec Thin Wafer Temporary Bonding Adhesive Product and Services
2.8.4 Daetec Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.8.5 Daetec Recent Developments/Updates
2.9 Suntific Materials
2.9.1 Suntific Materials Details
2.9.2 Suntific Materials Major Business
2.9.3 Suntific Materials Thin Wafer Temporary Bonding Adhesive Product and Services
2.9.4 Suntific Materials Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.9.5 Suntific Materials Recent Developments/Updates
3 Competitive Environment: Thin Wafer Temporary Bonding Adhesive by Manufacturer
3.1 Global Thin Wafer Temporary Bonding Adhesive Sales Quantity by Manufacturer (2018-2023)
3.2 Global Thin Wafer Temporary Bonding Adhesive Revenue by Manufacturer (2018-2023)
3.3 Global Thin Wafer Temporary Bonding Adhesive Average Price by Manufacturer (2018-2023)
3.4 Market Share Analysis (2022)
3.4.1 Producer Shipments of Thin Wafer Temporary Bonding Adhesive by Manufacturer Revenue ($MM) and Market Share (%): 2022
3.4.2 Top 3 Thin Wafer Temporary Bonding Adhesive Manufacturer Market Share in 2022
3.4.2 Top 6 Thin Wafer Temporary Bonding Adhesive Manufacturer Market Share in 2022
3.5 Thin Wafer Temporary Bonding Adhesive Market: Overall Company Footprint Analysis
3.5.1 Thin Wafer Temporary Bonding Adhesive Market: Region Footprint
3.5.2 Thin Wafer Temporary Bonding Adhesive Market: Company Product Type Footprint
3.5.3 Thin Wafer Temporary Bonding Adhesive Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Thin Wafer Temporary Bonding Adhesive Market Size by Region
4.1.1 Global Thin Wafer Temporary Bonding Adhesive Sales Quantity by Region (2018-2029)
4.1.2 Global Thin Wafer Temporary Bonding Adhesive Consumption Value by Region (2018-2029)
4.1.3 Global Thin Wafer Temporary Bonding Adhesive Average Price by Region (2018-2029)
4.2 North America Thin Wafer Temporary Bonding Adhesive Consumption Value (2018-2029)
4.3 Europe Thin Wafer Temporary Bonding Adhesive Consumption Value (2018-2029)
4.4 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Consumption Value (2018-2029)
4.5 South America Thin Wafer Temporary Bonding Adhesive Consumption Value (2018-2029)
4.6 Middle East and Africa Thin Wafer Temporary Bonding Adhesive Consumption Value (2018-2029)
5 Market Segment by Type
5.1 Global Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
5.2 Global Thin Wafer Temporary Bonding Adhesive Consumption Value by Type (2018-2029)
5.3 Global Thin Wafer Temporary Bonding Adhesive Average Price by Type (2018-2029)
6 Market Segment by Application
6.1 Global Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
6.2 Global Thin Wafer Temporary Bonding Adhesive Consumption Value by Application (2018-2029)
6.3 Global Thin Wafer Temporary Bonding Adhesive Average Price by Application (2018-2029)
7 North America
7.1 North America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
7.2 North America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
7.3 North America Thin Wafer Temporary Bonding Adhesive Market Size by Country
7.3.1 North America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Country (2018-2029)
7.3.2 North America Thin Wafer Temporary Bonding Adhesive Consumption Value by Country (2018-2029)
7.3.3 United States Market Size and Forecast (2018-2029)
7.3.4 Canada Market Size and Forecast (2018-2029)
7.3.5 Mexico Market Size and Forecast (2018-2029)
8 Europe
8.1 Europe Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
8.2 Europe Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
8.3 Europe Thin Wafer Temporary Bonding Adhesive Market Size by Country
8.3.1 Europe Thin Wafer Temporary Bonding Adhesive Sales Quantity by Country (2018-2029)
8.3.2 Europe Thin Wafer Temporary Bonding Adhesive Consumption Value by Country (2018-2029)
8.3.3 Germany Market Size and Forecast (2018-2029)
8.3.4 France Market Size and Forecast (2018-2029)
8.3.5 United Kingdom Market Size and Forecast (2018-2029)
8.3.6 Russia Market Size and Forecast (2018-2029)
8.3.7 Italy Market Size and Forecast (2018-2029)
9 Asia-Pacific
9.1 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
9.2 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
9.3 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Market Size by Region
9.3.1 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Sales Quantity by Region (2018-2029)
9.3.2 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Consumption Value by Region (2018-2029)
9.3.3 China Market Size and Forecast (2018-2029)
9.3.4 Japan Market Size and Forecast (2018-2029)
9.3.5 Korea Market Size and Forecast (2018-2029)
9.3.6 India Market Size and Forecast (2018-2029)
9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
9.3.8 Australia Market Size and Forecast (2018-2029)
10 South America
10.1 South America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
10.2 South America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
10.3 South America Thin Wafer Temporary Bonding Adhesive Market Size by Country
10.3.1 South America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Country (2018-2029)
10.3.2 South America Thin Wafer Temporary Bonding Adhesive Consumption Value by Country (2018-2029)
10.3.3 Brazil Market Size and Forecast (2018-2029)
10.3.4 Argentina Market Size and Forecast (2018-2029)
11 Middle East & Africa
11.1 Middle East & Africa Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
11.2 Middle East & Africa Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
11.3 Middle East & Africa Thin Wafer Temporary Bonding Adhesive Market Size by Country
11.3.1 Middle East & Africa Thin Wafer Temporary Bonding Adhesive Sales Quantity by Country (2018-2029)
11.3.2 Middle East & Africa Thin Wafer Temporary Bonding Adhesive Consumption Value by Country (2018-2029)
11.3.3 Turkey Market Size and Forecast (2018-2029)
11.3.4 Egypt Market Size and Forecast (2018-2029)
11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
11.3.6 South Africa Market Size and Forecast (2018-2029)
12 Market Dynamics
12.1 Thin Wafer Temporary Bonding Adhesive Market Drivers
12.2 Thin Wafer Temporary Bonding Adhesive Market Restraints
12.3 Thin Wafer Temporary Bonding Adhesive Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
12.5 Influence of COVID-19 and Russia-Ukraine War
12.5.1 Influence of COVID-19
12.5.2 Influence of Russia-Ukraine War
13 Raw Material and Industry Chain
13.1 Raw Material of Thin Wafer Temporary Bonding Adhesive and Key Manufacturers
13.2 Manufacturing Costs Percentage of Thin Wafer Temporary Bonding Adhesive
13.3 Thin Wafer Temporary Bonding Adhesive Production Process
13.4 Thin Wafer Temporary Bonding Adhesive Industrial Chain
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Thin Wafer Temporary Bonding Adhesive Typical Distributors
14.3 Thin Wafer Temporary Bonding Adhesive Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer