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レポート概要
| GlobalInfoResearchの最新の調査によると、世界の全自動フリップチップボンダーの市場規模は2022年のxxx米ドルから2029年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。新型コロナウイルス感染症とロシア・ウクライナ戦争の影響を考慮しながら市場規模を推計しました。 このレポートは、世界の全自動フリップチップボンダー市場に関する詳細かつ包括的な分析の結果です。定量的分析と定性的分析データが、メーカー別、地域別、国別、種類別、用途別に記載されています。 市場は常に変化しているため、本レポートでは、競争、需要と供給の傾向、および多くの市場にわたる需要の変化に影響する主要な要因を調査しました。主要な競合他社の企業概要と製品例、および2023年の市場シェア予測も記載しました。 本レポートの主な目的は次のとおりです。 - 世界および主要国の市場機会の規模を決定するため - 全自動フリップチップボンダーの成長可能性を評価するため - 各製品および最終用途市場の将来の成長を予測するため - 市場に影響を与える競争要因を評価するため 全自動フリップチップボンダー市場は種類と用途によって区分されます。2018年～2029年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 種類別セグメント ・6インチウェーハ凝固機、8インチウェーハ凝固機、12インチウェーハ凝固機、その他 用途別セグメント ・OSAT、IDM 主要な市場プレーヤー ・ASMPT、HiSOL、TORAY ENGINEERING、SETNA、Finetech、Accuratus Pte、Shibaura、Muehlbauer、K&S、SET、Athlete FA 地域別セグメントは次の地域・国をカバーします。 ・北米（米国、カナダ、メキシコ） ・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南アメリカ（ブラジル、アルゼンチン、コロンビア） ・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、全自動フリップチップボンダー製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要な全自動フリップチップボンダーメーカーの企業概要、2019年～2022年までの全自動フリップチップボンダーの価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要な全自動フリップチップボンダーメーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2018年～2029年までの地域別全自動フリップチップボンダーの販売量、売上、成長性を示しています。 ・第5、6章では、2018年～2029年までの全自動フリップチップボンダーの種類別と用途別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2018年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2029年までの主要地域での全自動フリップチップボンダー市場予測を収録しています。 ・第12章では、市場力学、成長要因、阻害要因、トレンド、ポーターズファイブフォース分析、新型コロナウイルス感染症とロシア・ウクライナ戦争の影響を掲載しています。 ・第13章では、主要な原材料、主要なサプライヤー、および全自動フリップチップボンダーの産業チェーンを掲載しています。 ・第14、15章では、全自動フリップチップボンダーの販売チャネル、販売業者、顧客、調査結果について説明します。 ***** 目次(一部) ***** ・市場概要 - 全自動フリップチップボンダーの概要 - 種類別分析（2018年vs2022年vs2029年）：6インチウェーハ凝固機、8インチウェーハ凝固機、12インチウェーハ凝固機、その他 - 用途別分析（2018年vs2022年vs2029年）：OSAT、IDM - 世界の全自動フリップチップボンダー市場規模・予測 - 世界の全自動フリップチップボンダー生産能力分析 - 市場の成長要因・阻害要因・動向 ・メーカー情報（企業概要、製品概要、販売量、価格、売上） - ASMPT、HiSOL、TORAY ENGINEERING、SETNA、Finetech、Accuratus Pte、Shibaura、Muehlbauer、K&S、SET、Athlete FA ・メーカー別市場シェア・市場集中度 ・地域別市場分析2018年-2029年 ・種類別分析2018年-2029年：6インチウェーハ凝固機、8インチウェーハ凝固機、12インチウェーハ凝固機、その他 ・用途別分析2018年-2029年：OSAT、IDM ・全自動フリップチップボンダーの北米市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：アメリカ、カナダ、メキシコなど ・全自動フリップチップボンダーのヨーロッパ市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：ドイツ、イギリス、フランス、ロシア、イタリアなど ・全自動フリップチップボンダーのアジア市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：中国、日本、韓国、インド、東南アジア、オーストラリアなど ・全自動フリップチップボンダーの南米市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：ブラジル、アルゼンチンなど ・全自動フリップチップボンダーの中東・アフリカ市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：サウジアラビア、トルコ、エジプト、南アフリカなど ・市場力学（成長要因、阻害要因、トレンド、ポーターズファイブフォース分析） ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論 |
According to our (Global Info Research) latest study, the global Fully Automatic Flip Chip Bonder market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
This report is a detailed and comprehensive analysis for global Fully Automatic Flip Chip Bonder market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Fully Automatic Flip Chip Bonder market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2018-2029
Global Fully Automatic Flip Chip Bonder market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2018-2029
Global Fully Automatic Flip Chip Bonder market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2018-2029
Global Fully Automatic Flip Chip Bonder market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Fully Automatic Flip Chip Bonder
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Fully Automatic Flip Chip Bonder market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASMPT, HiSOL, TORAY ENGINEERING, SETNA and Finetech, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Fully Automatic Flip Chip Bonder market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
6-Inch Wafer Solidification Machine
8-Inch Wafer Solidification Machine
12 Inch Wafer Solidification Machine
Others
Market segment by Application
OSAT
IDM
Major players covered
ASMPT
HiSOL
TORAY ENGINEERING
SETNA
Finetech
Accuratus Pte
Shibaura
Muehlbauer
K&S
SET
Athlete FA
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Fully Automatic Flip Chip Bonder product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Fully Automatic Flip Chip Bonder, with price, sales, revenue and global market share of Fully Automatic Flip Chip Bonder from 2018 to 2023.
Chapter 3, the Fully Automatic Flip Chip Bonder competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Fully Automatic Flip Chip Bonder breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Fully Automatic Flip Chip Bonder market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Fully Automatic Flip Chip Bonder.
Chapter 14 and 15, to describe Fully Automatic Flip Chip Bonder sales channel, distributors, customers, research findings and conclusion.
1 Market Overview
1.1 Product Overview and Scope of Fully Automatic Flip Chip Bonder
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Type
1.3.1 Overview: Global Fully Automatic Flip Chip Bonder Consumption Value by Type: 2018 Versus 2022 Versus 2029
1.3.2 6-Inch Wafer Solidification Machine
1.3.3 8-Inch Wafer Solidification Machine
1.3.4 12 Inch Wafer Solidification Machine
1.3.5 Others
1.4 Market Analysis by Application
1.4.1 Overview: Global Fully Automatic Flip Chip Bonder Consumption Value by Application: 2018 Versus 2022 Versus 2029
1.4.2 OSAT
1.4.3 IDM
1.5 Global Fully Automatic Flip Chip Bonder Market Size & Forecast
1.5.1 Global Fully Automatic Flip Chip Bonder Consumption Value (2018 & 2022 & 2029)
1.5.2 Global Fully Automatic Flip Chip Bonder Sales Quantity (2018-2029)
1.5.3 Global Fully Automatic Flip Chip Bonder Average Price (2018-2029)
2 Manufacturers Profiles
2.1 ASMPT
2.1.1 ASMPT Details
2.1.2 ASMPT Major Business
2.1.3 ASMPT Fully Automatic Flip Chip Bonder Product and Services
2.1.4 ASMPT Fully Automatic Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.1.5 ASMPT Recent Developments/Updates
2.2 HiSOL
2.2.1 HiSOL Details
2.2.2 HiSOL Major Business
2.2.3 HiSOL Fully Automatic Flip Chip Bonder Product and Services
2.2.4 HiSOL Fully Automatic Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.2.5 HiSOL Recent Developments/Updates
2.3 TORAY ENGINEERING
2.3.1 TORAY ENGINEERING Details
2.3.2 TORAY ENGINEERING Major Business
2.3.3 TORAY ENGINEERING Fully Automatic Flip Chip Bonder Product and Services
2.3.4 TORAY ENGINEERING Fully Automatic Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.3.5 TORAY ENGINEERING Recent Developments/Updates
2.4 SETNA
2.4.1 SETNA Details
2.4.2 SETNA Major Business
2.4.3 SETNA Fully Automatic Flip Chip Bonder Product and Services
2.4.4 SETNA Fully Automatic Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.4.5 SETNA Recent Developments/Updates
2.5 Finetech
2.5.1 Finetech Details
2.5.2 Finetech Major Business
2.5.3 Finetech Fully Automatic Flip Chip Bonder Product and Services
2.5.4 Finetech Fully Automatic Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.5.5 Finetech Recent Developments/Updates
2.6 Accuratus Pte
2.6.1 Accuratus Pte Details
2.6.2 Accuratus Pte Major Business
2.6.3 Accuratus Pte Fully Automatic Flip Chip Bonder Product and Services
2.6.4 Accuratus Pte Fully Automatic Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.6.5 Accuratus Pte Recent Developments/Updates
2.7 Shibaura
2.7.1 Shibaura Details
2.7.2 Shibaura Major Business
2.7.3 Shibaura Fully Automatic Flip Chip Bonder Product and Services
2.7.4 Shibaura Fully Automatic Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.7.5 Shibaura Recent Developments/Updates
2.8 Muehlbauer
2.8.1 Muehlbauer Details
2.8.2 Muehlbauer Major Business
2.8.3 Muehlbauer Fully Automatic Flip Chip Bonder Product and Services
2.8.4 Muehlbauer Fully Automatic Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.8.5 Muehlbauer Recent Developments/Updates
2.9 K&S
2.9.1 K&S Details
2.9.2 K&S Major Business
2.9.3 K&S Fully Automatic Flip Chip Bonder Product and Services
2.9.4 K&S Fully Automatic Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.9.5 K&S Recent Developments/Updates
2.10 SET
2.10.1 SET Details
2.10.2 SET Major Business
2.10.3 SET Fully Automatic Flip Chip Bonder Product and Services
2.10.4 SET Fully Automatic Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.10.5 SET Recent Developments/Updates
2.11 Athlete FA
2.11.1 Athlete FA Details
2.11.2 Athlete FA Major Business
2.11.3 Athlete FA Fully Automatic Flip Chip Bonder Product and Services
2.11.4 Athlete FA Fully Automatic Flip Chip Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.11.5 Athlete FA Recent Developments/Updates
3 Competitive Environment: Fully Automatic Flip Chip Bonder by Manufacturer
3.1 Global Fully Automatic Flip Chip Bonder Sales Quantity by Manufacturer (2018-2023)
3.2 Global Fully Automatic Flip Chip Bonder Revenue by Manufacturer (2018-2023)
3.3 Global Fully Automatic Flip Chip Bonder Average Price by Manufacturer (2018-2023)
3.4 Market Share Analysis (2022)
3.4.1 Producer Shipments of Fully Automatic Flip Chip Bonder by Manufacturer Revenue ($MM) and Market Share (%): 2022
3.4.2 Top 3 Fully Automatic Flip Chip Bonder Manufacturer Market Share in 2022
3.4.2 Top 6 Fully Automatic Flip Chip Bonder Manufacturer Market Share in 2022
3.5 Fully Automatic Flip Chip Bonder Market: Overall Company Footprint Analysis
3.5.1 Fully Automatic Flip Chip Bonder Market: Region Footprint
3.5.2 Fully Automatic Flip Chip Bonder Market: Company Product Type Footprint
3.5.3 Fully Automatic Flip Chip Bonder Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Fully Automatic Flip Chip Bonder Market Size by Region
4.1.1 Global Fully Automatic Flip Chip Bonder Sales Quantity by Region (2018-2029)
4.1.2 Global Fully Automatic Flip Chip Bonder Consumption Value by Region (2018-2029)
4.1.3 Global Fully Automatic Flip Chip Bonder Average Price by Region (2018-2029)
4.2 North America Fully Automatic Flip Chip Bonder Consumption Value (2018-2029)
4.3 Europe Fully Automatic Flip Chip Bonder Consumption Value (2018-2029)
4.4 Asia-Pacific Fully Automatic Flip Chip Bonder Consumption Value (2018-2029)
4.5 South America Fully Automatic Flip Chip Bonder Consumption Value (2018-2029)
4.6 Middle East and Africa Fully Automatic Flip Chip Bonder Consumption Value (2018-2029)
5 Market Segment by Type
5.1 Global Fully Automatic Flip Chip Bonder Sales Quantity by Type (2018-2029)
5.2 Global Fully Automatic Flip Chip Bonder Consumption Value by Type (2018-2029)
5.3 Global Fully Automatic Flip Chip Bonder Average Price by Type (2018-2029)
6 Market Segment by Application
6.1 Global Fully Automatic Flip Chip Bonder Sales Quantity by Application (2018-2029)
6.2 Global Fully Automatic Flip Chip Bonder Consumption Value by Application (2018-2029)
6.3 Global Fully Automatic Flip Chip Bonder Average Price by Application (2018-2029)
7 North America
7.1 North America Fully Automatic Flip Chip Bonder Sales Quantity by Type (2018-2029)
7.2 North America Fully Automatic Flip Chip Bonder Sales Quantity by Application (2018-2029)
7.3 North America Fully Automatic Flip Chip Bonder Market Size by Country
7.3.1 North America Fully Automatic Flip Chip Bonder Sales Quantity by Country (2018-2029)
7.3.2 North America Fully Automatic Flip Chip Bonder Consumption Value by Country (2018-2029)
7.3.3 United States Market Size and Forecast (2018-2029)
7.3.4 Canada Market Size and Forecast (2018-2029)
7.3.5 Mexico Market Size and Forecast (2018-2029)
8 Europe
8.1 Europe Fully Automatic Flip Chip Bonder Sales Quantity by Type (2018-2029)
8.2 Europe Fully Automatic Flip Chip Bonder Sales Quantity by Application (2018-2029)
8.3 Europe Fully Automatic Flip Chip Bonder Market Size by Country
8.3.1 Europe Fully Automatic Flip Chip Bonder Sales Quantity by Country (2018-2029)
8.3.2 Europe Fully Automatic Flip Chip Bonder Consumption Value by Country (2018-2029)
8.3.3 Germany Market Size and Forecast (2018-2029)
8.3.4 France Market Size and Forecast (2018-2029)
8.3.5 United Kingdom Market Size and Forecast (2018-2029)
8.3.6 Russia Market Size and Forecast (2018-2029)
8.3.7 Italy Market Size and Forecast (2018-2029)
9 Asia-Pacific
9.1 Asia-Pacific Fully Automatic Flip Chip Bonder Sales Quantity by Type (2018-2029)
9.2 Asia-Pacific Fully Automatic Flip Chip Bonder Sales Quantity by Application (2018-2029)
9.3 Asia-Pacific Fully Automatic Flip Chip Bonder Market Size by Region
9.3.1 Asia-Pacific Fully Automatic Flip Chip Bonder Sales Quantity by Region (2018-2029)
9.3.2 Asia-Pacific Fully Automatic Flip Chip Bonder Consumption Value by Region (2018-2029)
9.3.3 China Market Size and Forecast (2018-2029)
9.3.4 Japan Market Size and Forecast (2018-2029)
9.3.5 Korea Market Size and Forecast (2018-2029)
9.3.6 India Market Size and Forecast (2018-2029)
9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
9.3.8 Australia Market Size and Forecast (2018-2029)
10 South America
10.1 South America Fully Automatic Flip Chip Bonder Sales Quantity by Type (2018-2029)
10.2 South America Fully Automatic Flip Chip Bonder Sales Quantity by Application (2018-2029)
10.3 South America Fully Automatic Flip Chip Bonder Market Size by Country
10.3.1 South America Fully Automatic Flip Chip Bonder Sales Quantity by Country (2018-2029)
10.3.2 South America Fully Automatic Flip Chip Bonder Consumption Value by Country (2018-2029)
10.3.3 Brazil Market Size and Forecast (2018-2029)
10.3.4 Argentina Market Size and Forecast (2018-2029)
11 Middle East & Africa
11.1 Middle East & Africa Fully Automatic Flip Chip Bonder Sales Quantity by Type (2018-2029)
11.2 Middle East & Africa Fully Automatic Flip Chip Bonder Sales Quantity by Application (2018-2029)
11.3 Middle East & Africa Fully Automatic Flip Chip Bonder Market Size by Country
11.3.1 Middle East & Africa Fully Automatic Flip Chip Bonder Sales Quantity by Country (2018-2029)
11.3.2 Middle East & Africa Fully Automatic Flip Chip Bonder Consumption Value by Country (2018-2029)
11.3.3 Turkey Market Size and Forecast (2018-2029)
11.3.4 Egypt Market Size and Forecast (2018-2029)
11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
11.3.6 South Africa Market Size and Forecast (2018-2029)
12 Market Dynamics
12.1 Fully Automatic Flip Chip Bonder Market Drivers
12.2 Fully Automatic Flip Chip Bonder Market Restraints
12.3 Fully Automatic Flip Chip Bonder Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
12.5 Influence of COVID-19 and Russia-Ukraine War
12.5.1 Influence of COVID-19
12.5.2 Influence of Russia-Ukraine War
13 Raw Material and Industry Chain
13.1 Raw Material of Fully Automatic Flip Chip Bonder and Key Manufacturers
13.2 Manufacturing Costs Percentage of Fully Automatic Flip Chip Bonder
13.3 Fully Automatic Flip Chip Bonder Production Process
13.4 Fully Automatic Flip Chip Bonder Industrial Chain
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Fully Automatic Flip Chip Bonder Typical Distributors
14.3 Fully Automatic Flip Chip Bonder Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer