![Transparency Market Researchが調査・発行した産業分析レポートです。アンテナ・イン・パッケージ（AiP）技術の世界市場2023-2031：産業分析、規模、シェア、成長、動向、予測 / Antenna-in-Package Technology Market (Packaging Technology: Flip Chip Ball Grid Array [FCBGA], Low-density Fan-out Package, High-density Fan-out Package, and Others [3D Stacking, 2.5D Stacking, etc.] - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2023-2031 / MRC2305A002資料のイメージです。](https://www.marketresearch.co.jp/images-folder2/99x123xreport-contents-65.gif.pagespeed.ic.-R1hplx-d-.jpg) | • レポートコード：MRC2305A002 • 出版社/出版日：Transparency Market Research / 2023年3月24日 • レポート形態：英文、PDF、201ページ • 納品方法：Eメール • 産業分類：電子 |
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レポート概要
| Transparency Market Research社の当調査レポートによると、世界のアンテナ・イン・パッケージ（AiP）技術市場規模が、2023年の34.8百万ドルから2031年に327.3百万ドルとなり、予測期間中に年平均28.3%で成長すると推測されています。本レポートは、アンテナ・イン・パッケージ（AiP）技術の世界市場について徹底的に分析・調査を行い、序論、エグゼクティブサマリー、市場動向、関連産業・主要指標分析、パッケージ技術別（フリップチップボールグリッドアレイ（FCBGA）、低密度ファンアウトパッケージ、高密度ファンアウトパッケージ、その他）分析、周波数別（50GHz以下、51-100GHz、101-200GHz、201-300GHz、300GHz以上）分析、用途別（無線機・ジェスチャレーダー、自動車レーダー、ワイヤレスリンク、5Gデバイス/モバイルネットワーク、その他）分析、産業別（航空宇宙・防衛、自動車、家電、IT/通信、その他）分析、地域別（北米、ヨーロッパ、アジア太平洋、中東・アフリカ、南米）分析、競争状況、企業情報など、以下の項目を整理しています。また、3D Glass Solutions、Advanced Semiconductor Engineering, Inc.、Amkor Technology, Inc.、MediaTek Inc.、MixComm Inc.、Murata Manufacturing Co., Ltd、Powertech Technology Inc.、Samsung Electronics Co., Ltd.、Taiwan Semiconductor Manufacturing Company Limited、Texas Instruments Incorporated、TMY Technology Inc.など、主要企業情報を含んでいます。 ・序論 ・エグゼクティブサマリー ・市場動向 ・関連産業・主要指標分析 ・世界のアンテナ・イン・パッケージ（AiP）技術市場規模：パッケージ技術別 - フリップチップボールグリッドアレイ（FCBGA）における市場規模 - 低密度ファンアウトパッケージにおける市場規模 - 高密度ファンアウトパッケージにおける市場規模 - その他技術における市場規模 ・世界のアンテナ・イン・パッケージ（AiP）技術市場規模：周波数別 - 50GHz以下アンテナ・イン・パッケージ（AiP）技術の市場規模 - 51-100GHzアンテナ・イン・パッケージ（AiP）技術の市場規模 - 101-200GHzアンテナ・イン・パッケージ（AiP）技術の市場規模 - 201-300GHzアンテナ・イン・パッケージ（AiP）技術の市場規模 - 300GHz以上アンテナ・イン・パッケージ（AiP）技術の市場規模 ・世界のアンテナ・イン・パッケージ（AiP）技術市場規模：用途別 - 無線機・ジェスチャレーダーにおける市場規模 - 自動車レーダーにおける市場規模 - ワイヤレスリンクにおける市場規模 - 5Gデバイス/モバイルネットワークにおける市場規模 - その他用途における市場規模 ・世界のアンテナ・イン・パッケージ（AiP）技術市場規模：産業別 - 航空宇宙・防衛における市場規模 - 自動車における市場規模 - 家電における市場規模 - IT/通信における市場規模 - その他産業における市場規模 ・世界のアンテナ・イン・パッケージ（AiP）技術市場規模：地域別 - 北米のアンテナ・イン・パッケージ（AiP）技術市場規模 - ヨーロッパのアンテナ・イン・パッケージ（AiP）技術市場規模 - アジア太平洋のアンテナ・イン・パッケージ（AiP）技術市場規模 - 中東・アフリカのアンテナ・イン・パッケージ（AiP）技術市場規模 - 南米のアンテナ・イン・パッケージ（AiP）技術市場規模 ・競争状況 ・企業情報 |
Antenna-in-Package Technology Market – Scope of Report
TMR’s report on the global antenna-in-package technology market studies the past as well as the current growth trends and opportunities to gain valuable insights of the indicators of the market during the forecast period from 2023 to 2031. The report provides revenue of the global antenna-in-package technology market for the period 2017–2031, considering 2023 as the base year and 2031 as the forecast year. The report also provides the compound annual growth rate (CAGR %) of the global antenna-in-package technology market from 2023 to 2031.
The report has been prepared after an extensive research. Primary research involved bulk of the research efforts, wherein analysts carried out interviews with key opinion leaders, industry leaders, and opinion makers. Secondary research involved referring to key players’ product literature, annual reports, press releases, and relevant documents to understand the antenna-in-package technology market.
Secondary research also included Internet sources, statistical data from government agencies, websites, and trade associations. Analysts employed a combination of top-down and bottom-up approaches to study various attributes of the global antenna-in-package technology market.
The report includes an elaborate executive summary, along with a snapshot of the growth behavior of various segments included in the scope of the study. Moreover, the report throws light on the changing competitive dynamics in the global antenna-in-package technology market. These serve as valuable tools for existing market players as well as for entities interested in participating in the global antenna-in-package technology market.
The report delves into the competitive landscape of the global antenna-in-package technology market. Key players operating in the global antenna-in-package technology market have been identified and each one of these has been profiled in terms of various attributes. Company overview, financial standings, recent developments, and SWOT are the attributes of players in the global antenna-in-package technology market profiled in this report.
Key Questions Answered in Global Antenna-in-Package Technology Market Report
• What is the sales/revenue generated by antenna-in-package technology across all regions during the forecast period?
• What are the opportunities in the global antenna-in-package technology market?
• What are the major drivers, restraints, opportunities, and threats in the market?
• Which regional market is set to expand at the fastest CAGR during the forecast period?
• Which segment is expected to generate the highest revenue globally in 2031?
• Which segment is projected to expand at the highest CAGR during the forecast period?
• What are the market positions of different companies operating in the global market?
Antenna-in-Package Technology Market – Research Objectives and Research Approach
The comprehensive report on the global antenna-in-package technology market begins with an overview, followed by the scope and objectives of the study. The report provides detailed explanation of the objectives behind this study and key vendors and distributors operating in the market and regulatory scenario for approval of products.
For reading comprehensibility, the report has been compiled in a chapter-wise layout, with each section divided into smaller ones. The report comprises an exhaustive collection of graphs and tables that are appropriately interspersed. Pictorial representation of actual and projected values of key segments is visually appealing to readers. This also allows comparison of the market shares of key segments in the past and at the end of the forecast period.
The report analyzes the global antenna-in-package technology market in terms of product, end-user, and region. Key segments under each criterion have been studied at length, and the market share for each of these at the end of 2031 has been provided. Such valuable insights enable market stakeholders in making informed business decisions for investment in the global antenna-in-package technology market.
レポート目次1. Preface
1.1. Market Introduction
1.2. Market and Segments Definition
1.3. Market Taxonomy
1.4. Research Methodology
1.5. Assumption and Acronyms
2. Executive Summary
2.1. Global Antenna-in-Package Technology Market Overview
2.2. Regional Outline
2.3. Industry Outline
2.4. Market Dynamics Snapshot
2.5. Competition Blueprint
3. Market Dynamics
3.1. Macro-economic Factors
3.2. Drivers
3.3. Restraints
3.4. Opportunities
3.5. Key Trends
3.6. Regulatory Framework
4. Associated Industry and Key Indicator Assessment
4.1. Parent Industry Overview – Global Radio Frequency Integrated Circuit (RFIC) Industry Overview
4.2. Supply chain Analysis
4.3. Technology Roadmap Analysis
4.4. Industry SWOT Analysis
4.5. Porter Five Forces Analysis
4.6. COVID-19 Impact and Recovery Analysis
5. Global Antenna-in-Package Technology Market Analysis, by Packaging Technology
5.1. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
5.1.1. Flip Chip Ball Grid Array (FCBGA)
5.1.2. Low-density Fan-out Package
5.1.3. High-density Fan-out Package
5.1.4. Others
5.2. Others Market Attractiveness Analysis, by Packaging Technology
6. Global Antenna-in-Package Technology Market Analysis, by Frequency
6.1. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
6.1.1. Up to 50 GHz
6.1.2. 51-100 GHz
6.1.3. 101-200 GHz
6.1.4. 201-300 GHz
6.1.5. Above 300 GHz
6.2. Market Attractiveness Analysis, by Frequency
7. Global Antenna-in-Package Technology Market Analysis, by Application
7.1. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
7.1.1. Radios and Gesture Radars
7.1.2. Automotive Radars
7.1.3. Wireless links
7.1.4. 5G Devices/Mobile Networks
7.1.5. Smart Cameras
7.1.6. Wearable Devices
7.1.7. Others
7.2. Market Attractiveness Analysis, by Application
8. Global Antenna-in-Package Technology Market Analysis, by End-use Industry
8.1. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
8.1.1. Aerospace & Defense
8.1.2. Automotive
8.1.3. Consumer Electronics
8.1.4. IT & Telecommunication
8.1.5. Industrial
8.1.6. Others
8.2. Market Attractiveness Analysis, by End-use Industry
9. Global Antenna-in-Package Technology Market Analysis and Forecast, by Region
9.1. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Region, 2023-2031
9.1.1. North America
9.1.2. Europe
9.1.3. Asia Pacific
9.1.4. Middle East & Africa
9.1.5. South America
9.2. Market Attractiveness Analysis, by Region
10. North America Antenna-in-Package Technology Market Analysis and Forecast
10.1. Market Snapshot
10.2. Drivers and Restraints: Impact Analysis
10.3. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
10.3.1. Flip Chip Ball Grid Array (FCBGA)
10.3.2. Low-density Fan-out Package
10.3.3. High-density Fan-out Package
10.3.4. Others
10.4. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
10.4.1. Up to 50 GHz
10.4.2. 51-100 GHz
10.4.3. 101-200 GHz
10.4.4. 201-300 GHz
10.4.5. Above 300 GHz
10.5. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
10.5.1. Radios and Gesture Radars
10.5.2. Automotive Radars
10.5.3. Wireless links
10.5.4. 5G Devices/Mobile Networks
10.5.5. Smart Cameras
10.5.6. Wearable Devices
10.5.7. Others
10.6. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
10.6.1. Aerospace & Defense
10.6.2. Automotive
10.6.3. Consumer Electronics
10.6.4. IT & Telecommunication
10.6.5. Industrial
10.6.6. Others
10.7. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Country & Sub-Region, 2023-2031
10.7.1. The U.S.
10.7.2. Canada
10.7.3. Rest of North America
10.8. Market Attractiveness Analysis
10.8.1. By Packaging Technology
10.8.2. By Frequency
10.8.3. By Application
10.8.4. By End-use Industry
10.8.5. By Country/Sub-region
11. Europe Antenna-in-Package Technology Market Analysis and Forecast
11.1. Market Snapshot
11.2. Drivers and Restraints: Impact Analysis
11.3. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
11.3.1. Flip Chip Ball Grid Array (FCBGA)
11.3.2. Low-density Fan-out Package
11.3.3. High-density Fan-out Package
11.3.4. Others
11.4. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
11.4.1. Up to 50 GHz
11.4.2. 51-100 GHz
11.4.3. 101-200 GHz
11.4.4. 201-300 GHz
11.4.5. Above 300 GHz
11.5. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
11.5.1. Radios and Gesture Radars
11.5.2. Automotive Radars
11.5.3. Wireless links
11.5.4. 5G Devices/Mobile Networks
11.5.5. Smart Cameras
11.5.6. Wearable Devices
11.5.7. Others
11.6. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
11.6.1. Aerospace & Defense
11.6.2. Automotive
11.6.3. Consumer Electronics
11.6.4. IT & Telecommunication
11.6.5. Industrial
11.6.6. Others
11.7. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Country & Sub-Region, 2023-2031
11.7.1. The U.K.
11.7.2. Germany
11.7.3. France
11.7.4. Rest of Europe
11.8. Market Attractiveness Analysis
11.8.1. By Packaging Technology
11.8.2. By Frequency
11.8.3. By Application
11.8.4. By End-use Industry
11.8.5. By Country/Sub-region
12. Asia Pacific Antenna-in-Package Technology Market Analysis and Forecast
12.1. Market Snapshot
12.2. Drivers and Restraints: Impact Analysis
12.3. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
12.3.1. Flip Chip Ball Grid Array (FCBGA)
12.3.2. Low-density Fan-out Package
12.3.3. High-density Fan-out Package
12.3.4. Others
12.4. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
12.4.1. Up to 50 GHz
12.4.2. 51-100 GHz
12.4.3. 101-200 GHz
12.4.4. 201-300 GHz
12.4.5. Above 300 GHz
12.5. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
12.5.1. Radios and Gesture Radars
12.5.2. Automotive Radars
12.5.3. Wireless links
12.5.4. 5G Devices/Mobile Networks
12.5.5. Smart Cameras
12.5.6. Wearable Devices
12.5.7. Others
12.6. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
12.6.1. Aerospace & Defense
12.6.2. Automotive
12.6.3. Consumer Electronics
12.6.4. IT & Telecommunication
12.6.5. Industrial
12.6.6. Others
12.7. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Country & Sub-Region, 2023-2031
12.7.1. China
12.7.2. Japan
12.7.3. South Korea
12.7.4. Taiwan
12.7.5. ASEAN
12.7.6. Rest of Asia Pacific
12.8. Market Attractiveness Analysis
12.8.1. By Packaging Technology
12.8.2. By Frequency
12.8.3. By Application
12.8.4. By End-use Industry
12.8.5. By Country/Sub-region
13. Middle East & Africa Antenna-in-Package Technology Market Analysis and Forecast
13.1. Market Snapshot
13.2. Drivers and Restraints: Impact Analysis
13.3. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
13.3.1. Flip Chip Ball Grid Array (FCBGA)
13.3.2. Low-density Fan-out Package
13.3.3. High-density Fan-out Package
13.3.4. Others
13.4. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
13.4.1. Up to 50 GHz
13.4.2. 51-100 GHz
13.4.3. 101-200 GHz
13.4.4. 201-300 GHz
13.4.5. Above 300 GHz
13.5. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
13.5.1. Radios and Gesture Radars
13.5.2. Automotive Radars
13.5.3. Wireless links
13.5.4. 5G Devices/Mobile Networks
13.5.5. Smart Cameras
13.5.6. Wearable Devices
13.5.7. Others
13.6. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
13.6.1. Aerospace & Defense
13.6.2. Automotive
13.6.3. Consumer Electronics
13.6.4. IT & Telecommunication
13.6.5. Industrial
13.6.6. Others
13.7. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Country, 2023-2031
13.7.1. GCC
13.7.2. South Africa
13.7.3. Rest of Middle East & Africa
13.8. Market Attractiveness Analysis
13.8.1. By Packaging Technology
13.8.2. By Frequency
13.8.3. By Application
13.8.4. By End-use Industry
13.8.5. By Country
14. South America Antenna-in-Package Technology Market Analysis and Forecast
14.1. Market Snapshot
14.2. Drivers and Restraints: Impact Analysis
14.3. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
14.3.1. Flip Chip Ball Grid Array (FCBGA)
14.3.2. Low-density Fan-out Package
14.3.3. High-density Fan-out Package
14.3.4. Others
14.4. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
14.4.1. Up to 50 GHz
14.4.2. 51-100 GHz
14.4.3. 101-200 GHz
14.4.4. 201-300 GHz
14.4.5. Above 300 GHz
14.5. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
14.5.1. Radios and Gesture Radars
14.5.2. Automotive Radars
14.5.3. Wireless links
14.5.4. 5G Devices/Mobile Networks
14.5.5. Smart Cameras
14.5.6. Wearable Devices
14.5.7. Others
14.6. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
14.6.1. Aerospace & Defense
14.6.2. Automotive
14.6.3. Consumer Electronics
14.6.4. IT & Telecommunication
14.6.5. Industrial
14.6.6. Others
14.7. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Country, 2023-2031
14.7.1. Brazil
14.7.2. Rest of South America
14.8. Market Attractiveness Analysis
14.8.1. By Packaging Technology
14.8.2. By Frequency
14.8.3. By Application
14.8.4. By End-use Industry
14.8.5. By Country
15. Competition Assessment
15.1. Global Antenna-in-Package Technology Market Competition Matrix – Antenna-in-Package Technology Dashboard View
15.1.1. Global Market Company Share Analysis, by Value (2022)
15.1.2. Technological Differentiator
16. Company Profiles (Global Manufacturers/Suppliers)
16.1. 3D Glass Solutions
16.1.1. Overview
16.1.2. Product Portfolio
16.1.3. Sales Footprint
16.1.4. Key Subsidiaries or Distributors
16.1.5. Strategy and Recent Developments
16.1.6. Key Financials
16.2. Advanced Semiconductor Engineering, Inc.
16.2.1. Overview
16.2.2. Product Portfolio
16.2.3. Sales Footprint
16.2.4. Key Subsidiaries or Distributors
16.2.5. Strategy and Recent Developments
16.2.6. Key Financials
16.3. Amkor Technology, Inc.
16.3.1. Overview
16.3.2. Product Portfolio
16.3.3. Sales Footprint
16.3.4. Key Subsidiaries or Distributors
16.3.5. Strategy and Recent Developments
16.3.6. Key Financials
16.4. MediaTek Inc.
16.4.1. Overview
16.4.2. Product Portfolio
16.4.3. Sales Footprint
16.4.4. Key Subsidiaries or Distributors
16.4.5. Strategy and Recent Developments
16.4.6. Key Financials
16.5. MixComm Inc.
16.5.1. Overview
16.5.2. Product Portfolio
16.5.3. Sales Footprint
16.5.4. Key Subsidiaries or Distributors
16.5.5. Strategy and Recent Developments
16.5.6. Key Financials
16.6. Murata Manufacturing Co., Ltd
16.6.1. Overview
16.6.2. Product Portfolio
16.6.3. Sales Footprint
16.6.4. Key Subsidiaries or Distributors
16.6.5. Strategy and Recent Developments
16.6.6. Key Financials
16.7. Powertech Technology Inc.
16.7.1. Overview
16.7.2. Product Portfolio
16.7.3. Sales Footprint
16.7.4. Key Subsidiaries or Distributors
16.7.5. Strategy and Recent Developments
16.7.6. Key Financials
16.8. Samsung Electronics Co., Ltd.
16.8.1. Overview
16.8.2. Product Portfolio
16.8.3. Sales Footprint
16.8.4. Key Subsidiaries or Distributors
16.8.5. Strategy and Recent Developments
16.8.6. Key Financials
16.9. Taiwan Semiconductor Manufacturing Company Limited
16.9.1. Overview
16.9.2. Product Portfolio
16.9.3. Sales Footprint
16.9.4. Key Subsidiaries or Distributors
16.9.5. Strategy and Recent Developments
16.9.6. Key Financials
16.10. Texas Instruments Incorporated
16.10.1. Overview
16.10.2. Product Portfolio
16.10.3. Sales Footprint
16.10.4. Key Subsidiaries or Distributors
16.10.5. Strategy and Recent Developments
16.10.6. Key Financials
16.11. TMY Technology Inc.
16.11.1. Overview
16.11.2. Product Portfolio
16.11.3. Sales Footprint
16.11.4. Key Subsidiaries or Distributors
16.11.5. Strategy and Recent Developments
16.11.6. Key Financials
17. Recommendation
17.1. Identification of Potential Market Spaces
17.2. Understanding Buying Process of Customers
17.3. Preferred Sales & Marketing Strategy