世界のシステムインパッケージ（SiP）技術市場予測（～2028年）：2D ICパッケージング、2.5D ICパッケージング、3D ICパッケージング、多機能基板統合コンポーネントパッケージ

• 英文タイトル：Global System-in-Package Technology Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

• レポートコード：GIR-22E4690 • 出版社/出版日：GlobalInfoResearch / 2022年5月 • レポート形態：英文、PDF、129ページ • 納品方法：Eメール（2~3営業日） • 産業分類：電子＆半導体

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レポート概要

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システムインパッケージ（SiP）技術市場レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。 GlobalInfoResearchの最新の調査によると、世界のシステムインパッケージ（SiP）技術の市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。 システムインパッケージ（SiP）技術市場は種類と用途によって区分されます。2017年～2028年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 種類別セグメントは次をカバーします。 ・2D ICパッケージング、2.5D ICパッケージング、3D ICパッケージング、多機能基板統合コンポーネントパッケージ 用途別セグメントは次のように区分されます。 ・家庭用電化製品、自動車、通信、無線通信 世界のシステムインパッケージ（SiP）技術市場の主要な市場プレーヤーは以下のとおりです。 ・NXP、Amkor Technology、ASE、Jiangsu Changjiang Electronics Technology (JCET)、Siliconware Precision Industries (SPIL)、United Test and Assembly Center (UTAC)、Hana Micron、Hella、IMEC、Inari Berhad、Infineon、ams、Apple、ARM、Fitbit、Fujitsu、GaN Systems、Huawei、Qualcomm、SONY、Texas Instruments、Access、Analog Devices 地域別セグメントは次の地域・国をカバーします。 ・北米（米国、カナダ、メキシコ） ・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南アメリカ（ブラジル、アルゼンチン、コロンビア） ・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、システムインパッケージ（SiP）技術製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要なシステムインパッケージ（SiP）技術メーカーの企業概要、2019年～2022年までのシステムインパッケージ（SiP）技術の価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要なシステムインパッケージ（SiP）技術メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2017年～2028年までの地域別システムインパッケージ（SiP）技術の販売量、売上、成長性を示しています。 ・第5、6章では、2017年～2028年までのシステムインパッケージ（SiP）技術の種類別と用途別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2017年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2028年までの主要地域でのシステムインパッケージ（SiP）技術市場予測を収録しています。 ・第12章では、主要な原材料、主要なサプライヤー、およびシステムインパッケージ（SiP）技術の産業チェーンを掲載しています。 ・第13、14、15章では、システムインパッケージ（SiP）技術の販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。 ***** 目次(一部) ***** ・市場概要 ・メーカー情報（企業概要、製品概要、販売量、価格、売上）：NXP、Amkor Technology、ASE、Jiangsu Changjiang Electronics Technology (JCET)、Siliconware Precision Industries (SPIL)、United Test and Assembly Center (UTAC)、Hana Micron、Hella、IMEC、Inari Berhad、Infineon、ams、Apple、ARM、Fitbit、Fujitsu、GaN Systems、Huawei、Qualcomm、SONY、Texas Instruments、Access、Analog Devices ・メーカー別市場シェア ・地域別市場分析2017年-2028年 ・種類別分析2017年-2028年：2D ICパッケージング、2.5D ICパッケージング、3D ICパッケージング、多機能基板統合コンポーネントパッケージ ・用途別分析2017年-2028年：家庭用電化製品、自動車、通信、無線通信 ・システムインパッケージ（SiP）技術の北米市場規模2017年-2028年：アメリカ、カナダ、メキシコ ・システムインパッケージ（SiP）技術のヨーロッパ市場規模2017年-2028年：ドイツ、イギリス、フランス、ロシア、イタリア ・システムインパッケージ（SiP）技術のアジア市場規模2017年-2028年：中国、日本、韓国、インド、東南アジア、オーストラリア ・システムインパッケージ（SiP）技術の南米市場規模2017年-2028年：ブラジル、アルゼンチン ・システムインパッケージ（SiP）技術の中東・アフリカ市場規模2017年-2028年：サウジアラビア、トルコ、エジプト、南アフリカ ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論

The System-in-Package Technology market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global System-in-Package Technology market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during review period. Consumer Electronics accounting for % of the System-in-Package Technology global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While 2-D IC Packaging segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of System-in-Package Technology include NXP, Amkor Technology, ASE, Jiangsu Changjiang Electronics Technology (JCET), and Siliconware Precision Industries (SPIL), etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
System-in-Package Technology market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
2-D IC Packaging
2.5-D IC Packaging
3-D IC Packaging
Multifunctional Substrate Integrated Component Package
Market segment by Application can be divided into
Consumer Electronics
Automobile
Telecommunications
Wireless Communication
The key market players for global System-in-Package Technology market are listed below:
NXP
Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)
Hana Micron
Hella
IMEC
Inari Berhad
Infineon
ams
Apple
ARM
Fitbit
Fujitsu
GaN Systems
Huawei
Qualcomm
SONY
Texas Instruments
Access
Analog Devices
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe System-in-Package Technology product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of System-in-Package Technology, with price, sales, revenue and global market share of System-in-Package Technology from 2019 to 2022.
Chapter 3, the System-in-Package Technology competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the System-in-Package Technology breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and System-in-Package Technology market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of System-in-Package Technology.
Chapter 13, 14, and 15, to describe System-in-Package Technology sales channel, distributors, customers, research findings and conclusion, appendix and data source.

レポート目次

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1 Market Overview
1.1 System-in-Package Technology Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global System-in-Package Technology Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 2-D IC Packaging
1.2.3 2.5-D IC Packaging
1.2.4 3-D IC Packaging
1.2.5 Multifunctional Substrate Integrated Component Package
1.3 Market Analysis by Application
1.3.1 Overview: Global System-in-Package Technology Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 Consumer Electronics
1.3.3 Automobile
1.3.4 Telecommunications
1.3.5 Wireless Communication
1.4 Global System-in-Package Technology Market Size & Forecast
1.4.1 Global System-in-Package Technology Sales in Value (2017 & 2021 & 2028)
1.4.2 Global System-in-Package Technology Sales in Volume (2017-2028)
1.4.3 Global System-in-Package Technology Price (2017-2028)
1.5 Global System-in-Package Technology Production Capacity Analysis
1.5.1 Global System-in-Package Technology Total Production Capacity (2017-2028)
1.5.2 Global System-in-Package Technology Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 System-in-Package Technology Market Drivers
1.6.2 System-in-Package Technology Market Restraints
1.6.3 System-in-Package Technology Trends Analysis
2 Manufacturers Profiles
2.1 NXP
2.1.1 NXP Details
2.1.2 NXP Major Business
2.1.3 NXP System-in-Package Technology Product and Services
2.1.4 NXP System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 Amkor Technology
2.2.1 Amkor Technology Details
2.2.2 Amkor Technology Major Business
2.2.3 Amkor Technology System-in-Package Technology Product and Services
2.2.4 Amkor Technology System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 ASE
2.3.1 ASE Details
2.3.2 ASE Major Business
2.3.3 ASE System-in-Package Technology Product and Services
2.3.4 ASE System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 Jiangsu Changjiang Electronics Technology (JCET)
2.4.1 Jiangsu Changjiang Electronics Technology (JCET) Details
2.4.2 Jiangsu Changjiang Electronics Technology (JCET) Major Business
2.4.3 Jiangsu Changjiang Electronics Technology (JCET) System-in-Package Technology Product and Services
2.4.4 Jiangsu Changjiang Electronics Technology (JCET) System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 Siliconware Precision Industries (SPIL)
2.5.1 Siliconware Precision Industries (SPIL) Details
2.5.2 Siliconware Precision Industries (SPIL) Major Business
2.5.3 Siliconware Precision Industries (SPIL) System-in-Package Technology Product and Services
2.5.4 Siliconware Precision Industries (SPIL) System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 United Test and Assembly Center (UTAC)
2.6.1 United Test and Assembly Center (UTAC) Details
2.6.2 United Test and Assembly Center (UTAC) Major Business
2.6.3 United Test and Assembly Center (UTAC) System-in-Package Technology Product and Services
2.6.4 United Test and Assembly Center (UTAC) System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 Hana Micron
2.7.1 Hana Micron Details
2.7.2 Hana Micron Major Business
2.7.3 Hana Micron System-in-Package Technology Product and Services
2.7.4 Hana Micron System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 Hella
2.8.1 Hella Details
2.8.2 Hella Major Business
2.8.3 Hella System-in-Package Technology Product and Services
2.8.4 Hella System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 IMEC
2.9.1 IMEC Details
2.9.2 IMEC Major Business
2.9.3 IMEC System-in-Package Technology Product and Services
2.9.4 IMEC System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.10 Inari Berhad
2.10.1 Inari Berhad Details
2.10.2 Inari Berhad Major Business
2.10.3 Inari Berhad System-in-Package Technology Product and Services
2.10.4 Inari Berhad System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.11 Infineon
2.11.1 Infineon Details
2.11.2 Infineon Major Business
2.11.3 Infineon System-in-Package Technology Product and Services
2.11.4 Infineon System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.12 ams
2.12.1 ams Details
2.12.2 ams Major Business
2.12.3 ams System-in-Package Technology Product and Services
2.12.4 ams System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.13 Apple
2.13.1 Apple Details
2.13.2 Apple Major Business
2.13.3 Apple System-in-Package Technology Product and Services
2.13.4 Apple System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.14 ARM
2.14.1 ARM Details
2.14.2 ARM Major Business
2.14.3 ARM System-in-Package Technology Product and Services
2.14.4 ARM System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.15 Fitbit
2.15.1 Fitbit Details
2.15.2 Fitbit Major Business
2.15.3 Fitbit System-in-Package Technology Product and Services
2.15.4 Fitbit System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.16 Fujitsu
2.16.1 Fujitsu Details
2.16.2 Fujitsu Major Business
2.16.3 Fujitsu System-in-Package Technology Product and Services
2.16.4 Fujitsu System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.17 GaN Systems
2.17.1 GaN Systems Details
2.17.2 GaN Systems Major Business
2.17.3 GaN Systems System-in-Package Technology Product and Services
2.17.4 GaN Systems System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.18 Huawei
2.18.1 Huawei Details
2.18.2 Huawei Major Business
2.18.3 Huawei System-in-Package Technology Product and Services
2.18.4 Huawei System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.19 Qualcomm
2.19.1 Qualcomm Details
2.19.2 Qualcomm Major Business
2.19.3 Qualcomm System-in-Package Technology Product and Services
2.19.4 Qualcomm System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.20 SONY
2.20.1 SONY Details
2.20.2 SONY Major Business
2.20.3 SONY System-in-Package Technology Product and Services
2.20.4 SONY System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.21 Texas Instruments
2.21.1 Texas Instruments Details
2.21.2 Texas Instruments Major Business
2.21.3 Texas Instruments System-in-Package Technology Product and Services
2.21.4 Texas Instruments System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.22 Access
2.22.1 Access Details
2.22.2 Access Major Business
2.22.3 Access System-in-Package Technology Product and Services
2.22.4 Access System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.23 Analog Devices
2.23.1 Analog Devices Details
2.23.2 Analog Devices Major Business
2.23.3 Analog Devices System-in-Package Technology Product and Services
2.23.4 Analog Devices System-in-Package Technology Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 System-in-Package Technology Breakdown Data by Manufacturer
3.1 Global System-in-Package Technology Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global System-in-Package Technology Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in System-in-Package Technology
3.4 Market Concentration Rate
3.4.1 Top 3 System-in-Package Technology Manufacturer Market Share in 2021
3.4.2 Top 6 System-in-Package Technology Manufacturer Market Share in 2021
3.5 Global System-in-Package Technology Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and System-in-Package Technology Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global System-in-Package Technology Market Size by Region
4.1.1 Global System-in-Package Technology Sales in Volume by Region (2017-2028)
4.1.2 Global System-in-Package Technology Revenue by Region (2017-2028)
4.2 North America System-in-Package Technology Revenue (2017-2028)
4.3 Europe System-in-Package Technology Revenue (2017-2028)
4.4 Asia-Pacific System-in-Package Technology Revenue (2017-2028)
4.5 South America System-in-Package Technology Revenue (2017-2028)
4.6 Middle East and Africa System-in-Package Technology Revenue (2017-2028)
5 Market Segment by Type
5.1 Global System-in-Package Technology Sales in Volume by Type (2017-2028)
5.2 Global System-in-Package Technology Revenue by Type (2017-2028)
5.3 Global System-in-Package Technology Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global System-in-Package Technology Sales in Volume by Application (2017-2028)
6.2 Global System-in-Package Technology Revenue by Application (2017-2028)
6.3 Global System-in-Package Technology Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America System-in-Package Technology Sales by Type (2017-2028)
7.2 North America System-in-Package Technology Sales by Application (2017-2028)
7.3 North America System-in-Package Technology Market Size by Country
7.3.1 North America System-in-Package Technology Sales in Volume by Country (2017-2028)
7.3.2 North America System-in-Package Technology Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe System-in-Package Technology Sales by Type (2017-2028)
8.2 Europe System-in-Package Technology Sales by Application (2017-2028)
8.3 Europe System-in-Package Technology Market Size by Country
8.3.1 Europe System-in-Package Technology Sales in Volume by Country (2017-2028)
8.3.2 Europe System-in-Package Technology Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific System-in-Package Technology Sales by Type (2017-2028)
9.2 Asia-Pacific System-in-Package Technology Sales by Application (2017-2028)
9.3 Asia-Pacific System-in-Package Technology Market Size by Region
9.3.1 Asia-Pacific System-in-Package Technology Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific System-in-Package Technology Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America System-in-Package Technology Sales by Type (2017-2028)
10.2 South America System-in-Package Technology Sales by Application (2017-2028)
10.3 South America System-in-Package Technology Market Size by Country
10.3.1 South America System-in-Package Technology Sales in Volume by Country (2017-2028)
10.3.2 South America System-in-Package Technology Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa System-in-Package Technology Sales by Type (2017-2028)
11.2 Middle East & Africa System-in-Package Technology Sales by Application (2017-2028)
11.3 Middle East & Africa System-in-Package Technology Market Size by Country
11.3.1 Middle East & Africa System-in-Package Technology Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa System-in-Package Technology Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of System-in-Package Technology and Key Manufacturers
12.2 Manufacturing Costs Percentage of System-in-Package Technology
12.3 System-in-Package Technology Production Process
12.4 System-in-Package Technology Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 System-in-Package Technology Typical Distributors
13.3 System-in-Package Technology Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer

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