世界の3Dチップ（3D IC）市場予測（～2028年）：3Dウェーハレベルチップスケールパッケージング（WLCSP）、3D TSV、その他

• 英文タイトル：Global 3D Chips (3D IC) Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

• レポートコード：GIR-22E4772 • 出版社/出版日：GlobalInfoResearch / 2022年5月 • レポート形態：英文、PDF、103ページ • 納品方法：Eメール（2~3営業日） • 産業分類：電子＆半導体

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レポート概要

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3Dチップ（3D IC）市場レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。 GlobalInfoResearchの最新の調査によると、世界の3Dチップ（3D IC）の市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。 3Dチップ（3D IC）市場は種類と用途によって区分されます。2017年～2028年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 種類別セグメントは次をカバーします。 ・3Dウェーハレベルチップスケールパッケージング（WLCSP）、3D TSV、その他 用途別セグメントは次のように区分されます。 ・家電、通信、自動車、その他 世界の3Dチップ（3D IC）市場の主要な市場プレーヤーは以下のとおりです。 ・ASE Group、Samsung Electronics Co., Ltd.、STMicroelectronics N.V.、Taiwan Semiconductor Manufacturing Company Limited、Toshiba Corporation、Amkor Technology、United Microelectronics、Stmicroelectronics、Broadcom、Intel、Jiangsu Changjiang Electronics Technology、TSMC、Micron Technology 地域別セグメントは次の地域・国をカバーします。 ・北米（米国、カナダ、メキシコ） ・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南アメリカ（ブラジル、アルゼンチン、コロンビア） ・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、3Dチップ（3D IC）製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要な3Dチップ（3D IC）メーカーの企業概要、2019年～2022年までの3Dチップ（3D IC）の価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要な3Dチップ（3D IC）メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2017年～2028年までの地域別3Dチップ（3D IC）の販売量、売上、成長性を示しています。 ・第5、6章では、2017年～2028年までの3Dチップ（3D IC）の種類別と用途別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2017年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2028年までの主要地域での3Dチップ（3D IC）市場予測を収録しています。 ・第12章では、主要な原材料、主要なサプライヤー、および3Dチップ（3D IC）の産業チェーンを掲載しています。 ・第13、14、15章では、3Dチップ（3D IC）の販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。 ***** 目次(一部) ***** ・市場概要 ・メーカー情報（企業概要、製品概要、販売量、価格、売上）：ASE Group、Samsung Electronics Co., Ltd.、STMicroelectronics N.V.、Taiwan Semiconductor Manufacturing Company Limited、Toshiba Corporation、Amkor Technology、United Microelectronics、Stmicroelectronics、Broadcom、Intel、Jiangsu Changjiang Electronics Technology、TSMC、Micron Technology ・メーカー別市場シェア ・地域別市場分析2017年-2028年 ・種類別分析2017年-2028年：3Dウェーハレベルチップスケールパッケージング（WLCSP）、3D TSV、その他 ・用途別分析2017年-2028年：家電、通信、自動車、その他 ・3Dチップ（3D IC）の北米市場規模2017年-2028年：アメリカ、カナダ、メキシコ ・3Dチップ（3D IC）のヨーロッパ市場規模2017年-2028年：ドイツ、イギリス、フランス、ロシア、イタリア ・3Dチップ（3D IC）のアジア市場規模2017年-2028年：中国、日本、韓国、インド、東南アジア、オーストラリア ・3Dチップ（3D IC）の南米市場規模2017年-2028年：ブラジル、アルゼンチン ・3Dチップ（3D IC）の中東・アフリカ市場規模2017年-2028年：サウジアラビア、トルコ、エジプト、南アフリカ ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論

The 3D Chips (3D IC) market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global 3D Chips (3D IC) market size is estimated to be worth US$ 8869.1 million in 2021 and is forecast to a readjusted size of USD 23340 million by 2028 with a CAGR of 14.8% during review period. Consumer Electronics accounting for % of the 3D Chips (3D IC) global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While 3D Wafer-Level Chip-Scale Packaging (WLCSP) segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of 3D Chips (3D IC) include ASE Group, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, and Toshiba Corporation, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
3D Chips (3D IC) market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
3D Wafer-Level Chip-Scale Packaging (WLCSP)
3D TSV
Others
Market segment by Application can be divided into
Consumer Electronics
Telecommunication
Automotive
Others
The key market players for global 3D Chips (3D IC) market are listed below:
ASE Group
Samsung Electronics Co., Ltd.
STMicroelectronics N.V.
Taiwan Semiconductor Manufacturing Company Limited
Toshiba Corporation
Amkor Technology
United Microelectronics
Stmicroelectronics
Broadcom
Intel
Jiangsu Changjiang Electronics Technology
TSMC
Micron Technology
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe 3D Chips (3D IC) product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of 3D Chips (3D IC), with price, sales, revenue and global market share of 3D Chips (3D IC) from 2019 to 2022.
Chapter 3, the 3D Chips (3D IC) competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the 3D Chips (3D IC) breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and 3D Chips (3D IC) market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of 3D Chips (3D IC).
Chapter 13, 14, and 15, to describe 3D Chips (3D IC) sales channel, distributors, customers, research findings and conclusion, appendix and data source.

レポート目次

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1 Market Overview
1.1 3D Chips (3D IC) Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global 3D Chips (3D IC) Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 3D Wafer-Level Chip-Scale Packaging (WLCSP)
1.2.3 3D TSV
1.2.4 Others
1.3 Market Analysis by Application
1.3.1 Overview: Global 3D Chips (3D IC) Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 Consumer Electronics
1.3.3 Telecommunication
1.3.4 Automotive
1.3.5 Others
1.4 Global 3D Chips (3D IC) Market Size & Forecast
1.4.1 Global 3D Chips (3D IC) Sales in Value (2017 & 2021 & 2028)
1.4.2 Global 3D Chips (3D IC) Sales in Volume (2017-2028)
1.4.3 Global 3D Chips (3D IC) Price (2017-2028)
1.5 Global 3D Chips (3D IC) Production Capacity Analysis
1.5.1 Global 3D Chips (3D IC) Total Production Capacity (2017-2028)
1.5.2 Global 3D Chips (3D IC) Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 3D Chips (3D IC) Market Drivers
1.6.2 3D Chips (3D IC) Market Restraints
1.6.3 3D Chips (3D IC) Trends Analysis
2 Manufacturers Profiles
2.1 ASE Group
2.1.1 ASE Group Details
2.1.2 ASE Group Major Business
2.1.3 ASE Group 3D Chips (3D IC) Product and Services
2.1.4 ASE Group 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 Samsung Electronics Co., Ltd.
2.2.1 Samsung Electronics Co., Ltd. Details
2.2.2 Samsung Electronics Co., Ltd. Major Business
2.2.3 Samsung Electronics Co., Ltd. 3D Chips (3D IC) Product and Services
2.2.4 Samsung Electronics Co., Ltd. 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 STMicroelectronics N.V.
2.3.1 STMicroelectronics N.V. Details
2.3.2 STMicroelectronics N.V. Major Business
2.3.3 STMicroelectronics N.V. 3D Chips (3D IC) Product and Services
2.3.4 STMicroelectronics N.V. 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 Taiwan Semiconductor Manufacturing Company Limited
2.4.1 Taiwan Semiconductor Manufacturing Company Limited Details
2.4.2 Taiwan Semiconductor Manufacturing Company Limited Major Business
2.4.3 Taiwan Semiconductor Manufacturing Company Limited 3D Chips (3D IC) Product and Services
2.4.4 Taiwan Semiconductor Manufacturing Company Limited 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 Toshiba Corporation
2.5.1 Toshiba Corporation Details
2.5.2 Toshiba Corporation Major Business
2.5.3 Toshiba Corporation 3D Chips (3D IC) Product and Services
2.5.4 Toshiba Corporation 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 Amkor Technology
2.6.1 Amkor Technology Details
2.6.2 Amkor Technology Major Business
2.6.3 Amkor Technology 3D Chips (3D IC) Product and Services
2.6.4 Amkor Technology 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 United Microelectronics
2.7.1 United Microelectronics Details
2.7.2 United Microelectronics Major Business
2.7.3 United Microelectronics 3D Chips (3D IC) Product and Services
2.7.4 United Microelectronics 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 Stmicroelectronics
2.8.1 Stmicroelectronics Details
2.8.2 Stmicroelectronics Major Business
2.8.3 Stmicroelectronics 3D Chips (3D IC) Product and Services
2.8.4 Stmicroelectronics 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 Broadcom
2.9.1 Broadcom Details
2.9.2 Broadcom Major Business
2.9.3 Broadcom 3D Chips (3D IC) Product and Services
2.9.4 Broadcom 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.10 Intel
2.10.1 Intel Details
2.10.2 Intel Major Business
2.10.3 Intel 3D Chips (3D IC) Product and Services
2.10.4 Intel 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.11 Jiangsu Changjiang Electronics Technology
2.11.1 Jiangsu Changjiang Electronics Technology Details
2.11.2 Jiangsu Changjiang Electronics Technology Major Business
2.11.3 Jiangsu Changjiang Electronics Technology 3D Chips (3D IC) Product and Services
2.11.4 Jiangsu Changjiang Electronics Technology 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.12 TSMC
2.12.1 TSMC Details
2.12.2 TSMC Major Business
2.12.3 TSMC 3D Chips (3D IC) Product and Services
2.12.4 TSMC 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.13 Micron Technology
2.13.1 Micron Technology Details
2.13.2 Micron Technology Major Business
2.13.3 Micron Technology 3D Chips (3D IC) Product and Services
2.13.4 Micron Technology 3D Chips (3D IC) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 3D Chips (3D IC) Breakdown Data by Manufacturer
3.1 Global 3D Chips (3D IC) Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global 3D Chips (3D IC) Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in 3D Chips (3D IC)
3.4 Market Concentration Rate
3.4.1 Top 3 3D Chips (3D IC) Manufacturer Market Share in 2021
3.4.2 Top 6 3D Chips (3D IC) Manufacturer Market Share in 2021
3.5 Global 3D Chips (3D IC) Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and 3D Chips (3D IC) Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global 3D Chips (3D IC) Market Size by Region
4.1.1 Global 3D Chips (3D IC) Sales in Volume by Region (2017-2028)
4.1.2 Global 3D Chips (3D IC) Revenue by Region (2017-2028)
4.2 North America 3D Chips (3D IC) Revenue (2017-2028)
4.3 Europe 3D Chips (3D IC) Revenue (2017-2028)
4.4 Asia-Pacific 3D Chips (3D IC) Revenue (2017-2028)
4.5 South America 3D Chips (3D IC) Revenue (2017-2028)
4.6 Middle East and Africa 3D Chips (3D IC) Revenue (2017-2028)
5 Market Segment by Type
5.1 Global 3D Chips (3D IC) Sales in Volume by Type (2017-2028)
5.2 Global 3D Chips (3D IC) Revenue by Type (2017-2028)
5.3 Global 3D Chips (3D IC) Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global 3D Chips (3D IC) Sales in Volume by Application (2017-2028)
6.2 Global 3D Chips (3D IC) Revenue by Application (2017-2028)
6.3 Global 3D Chips (3D IC) Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America 3D Chips (3D IC) Sales by Type (2017-2028)
7.2 North America 3D Chips (3D IC) Sales by Application (2017-2028)
7.3 North America 3D Chips (3D IC) Market Size by Country
7.3.1 North America 3D Chips (3D IC) Sales in Volume by Country (2017-2028)
7.3.2 North America 3D Chips (3D IC) Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe 3D Chips (3D IC) Sales by Type (2017-2028)
8.2 Europe 3D Chips (3D IC) Sales by Application (2017-2028)
8.3 Europe 3D Chips (3D IC) Market Size by Country
8.3.1 Europe 3D Chips (3D IC) Sales in Volume by Country (2017-2028)
8.3.2 Europe 3D Chips (3D IC) Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific 3D Chips (3D IC) Sales by Type (2017-2028)
9.2 Asia-Pacific 3D Chips (3D IC) Sales by Application (2017-2028)
9.3 Asia-Pacific 3D Chips (3D IC) Market Size by Region
9.3.1 Asia-Pacific 3D Chips (3D IC) Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific 3D Chips (3D IC) Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America 3D Chips (3D IC) Sales by Type (2017-2028)
10.2 South America 3D Chips (3D IC) Sales by Application (2017-2028)
10.3 South America 3D Chips (3D IC) Market Size by Country
10.3.1 South America 3D Chips (3D IC) Sales in Volume by Country (2017-2028)
10.3.2 South America 3D Chips (3D IC) Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa 3D Chips (3D IC) Sales by Type (2017-2028)
11.2 Middle East & Africa 3D Chips (3D IC) Sales by Application (2017-2028)
11.3 Middle East & Africa 3D Chips (3D IC) Market Size by Country
11.3.1 Middle East & Africa 3D Chips (3D IC) Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa 3D Chips (3D IC) Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of 3D Chips (3D IC) and Key Manufacturers
12.2 Manufacturing Costs Percentage of 3D Chips (3D IC)
12.3 3D Chips (3D IC) Production Process
12.4 3D Chips (3D IC) Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 3D Chips (3D IC) Typical Distributors
13.3 3D Chips (3D IC) Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer

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