半導体包装用エポキシ成形コンパウンドのグローバル市場インサイト・予測（～2028年）

• 英文タイトル：Global Epoxy Molding Compound in Semiconductor Packaging Market Insights, Forecast to 2028

• レポートコード：QY2207C0290 • 出版社/出版日：QYResearch / 2022年7月15日 • レポート形態：英文、PDF、112ページ • 納品方法：Eメール（納期：3日） • 産業分類：化学＆材料

• 販売価格（消費税別）

Single User	￥735,000 (USD4,900)	▷ お問い合わせ
Multi User	￥1,102,500 (USD7,350)	▷ お問い合わせ
Enterprise License	￥1,470,000 (USD9,800)	▷ お問い合わせ

• ご注文方法：お問い合わせフォーム記入又はEメールでご連絡ください。
• お支払方法：銀行振込（納品後、ご請求書送付）

---

レポート概要

---

新型コロナウイルス感染症のパンデミックにより、世界の半導体包装用エポキシ成形コンパウンドの市場規模は2022年にUS$xxxと推定され、調査期間中のCAGRはxxx％で、2028年までに再調整された規模はUS$xxxになると予測されています。この医療危機による経済変化を十分に考慮すると、2021年に半導体包装用エポキシ成形コンパウンドの世界市場のxxx％を占める「通常型エポキシ成形コンパウンド」タイプは、2028年までにUS$xxxの規模になり、パンデミック後の修正xxx％CAGRで成長すると予測されています。一方、「IC」セグメントは、この予測期間を通じてxxx％のCAGRに変更されます。 中国の半導体包装用エポキシ成形コンパウンドの市場規模は2021年にUS$xxxと分析されており、米国とヨーロッパの半導体包装用エポキシ成形コンパウンド市場規模はそれぞれUS$xxxとUS$xxxです。米国の割合は2021年にxxx％であり、中国とヨーロッパはそれぞれxxx％とxxx％です。中国の割合は2028年にxxx％に達し、対象期間を通じてxxx％のCAGRを記録すると予測されています。日本、韓国、東南アジアはアジアで注目市場であり、今後6年間のCAGRはそれぞれxxx％、xxx％、xxx％になる見通しです。ヨーロッパの半導体包装用エポキシ成形コンパウンド市場については、ドイツは2028年までにUS$xxxに達すると予測されており、予測期間中のCAGRはxxx％になる見通しです。 半導体包装用エポキシ成形コンパウンドのグローバル主要メーカーには、Samsung SDI、Sumitomo Bakelite、Showa Denko、Eternal Materials、Chang Chun Group、KCC、Duresco、Hysol Huawei Electronics、Jiangsu Huahai Chengkexin Material、Beijing Kehua New Materialsなどがあります。2021年、世界のトップ5プレイヤーは売上ベースで約xxx％の市場シェアを占めています。 半導体包装用エポキシ成形コンパウンド市場は、種類と用途によって区分されます。世界の半導体包装用エポキシ成形コンパウンド市場のプレーヤー、利害関係者、およびその他の参加者は、当レポートを有益なリソースとして使用することで優位に立つことができます。セグメント分析は、2017年～2028年期間のタイプ別および用途別の販売量、売上、予測に焦点を当てています。 【種類別セグメント】 通常型エポキシ成形コンパウンド、グリーンエポキシ成形コンパウンド 【用途別セグメント】 IC、ダイオード、トランジスタ、フォトカプラ、その他 【掲載地域】 北米：アメリカ、カナダ ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア アジア太平洋：日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア 中南米：メキシコ、ブラジル、アルゼンチン 中東・アフリカ：トルコ、サウジアラビア、UAE 【目次（一部）】 ・調査の範囲 - 半導体包装用エポキシ成形コンパウンド製品概要 - 種類別市場（通常型エポキシ成形コンパウンド、グリーンエポキシ成形コンパウンド） - 用途別市場（IC、ダイオード、トランジスタ、フォトカプラ、その他） - 調査の目的 ・エグゼクティブサマリー - 世界の半導体包装用エポキシ成形コンパウンド販売量予測2017-2028 - 世界の半導体包装用エポキシ成形コンパウンド売上予測2017-2028 - 半導体包装用エポキシ成形コンパウンドの地域別販売量 - 半導体包装用エポキシ成形コンパウンドの地域別売上 - 北米市場 - ヨーロッパ市場 - アジア太平洋市場 - 中南米市場 - 中東・アフリカ市場 ・メーカーの競争状況 - 主要メーカー別半導体包装用エポキシ成形コンパウンド販売量 - 主要メーカー別半導体包装用エポキシ成形コンパウンド売上 - 主要メーカー別半導体包装用エポキシ成形コンパウンド価格 - 競争状況の分析 - 企業M&A動向 ・種類別市場規模（通常型エポキシ成形コンパウンド、グリーンエポキシ成形コンパウンド） - 半導体包装用エポキシ成形コンパウンドの種類別販売量 - 半導体包装用エポキシ成形コンパウンドの種類別売上 - 半導体包装用エポキシ成形コンパウンドの種類別価格 ・用途別市場規模（IC、ダイオード、トランジスタ、フォトカプラ、その他） - 半導体包装用エポキシ成形コンパウンドの用途別販売量 - 半導体包装用エポキシ成形コンパウンドの用途別売上 - 半導体包装用エポキシ成形コンパウンドの用途別価格 ・北米市場 - 北米の半導体包装用エポキシ成形コンパウンド市場規模（種類別、用途別） - 主要国別の半導体包装用エポキシ成形コンパウンド市場規模（アメリカ、カナダ） ・ヨーロッパ市場 - ヨーロッパの半導体包装用エポキシ成形コンパウンド市場規模（種類別、用途別） - 主要国別の半導体包装用エポキシ成形コンパウンド市場規模（ドイツ、フランス、イギリス、イタリア、ロシア） ・アジア太平洋市場 - アジア太平洋の半導体包装用エポキシ成形コンパウンド市場規模（種類別、用途別） - 主要国別の半導体包装用エポキシ成形コンパウンド市場規模（日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア） ・中南米市場 - 中南米の半導体包装用エポキシ成形コンパウンド市場規模（種類別、用途別） - 主要国別の半導体包装用エポキシ成形コンパウンド市場規模（メキシコ、ブラジル、アルゼンチン） ・中東・アフリカ市場 - 中東・アフリカの半導体包装用エポキシ成形コンパウンド市場規模（種類別、用途別） - 主要国別の半導体包装用エポキシ成形コンパウンド市場規模（トルコ、サウジアラビア） ・企業情報 Samsung SDI、Sumitomo Bakelite、Showa Denko、Eternal Materials、Chang Chun Group、KCC、Duresco、Hysol Huawei Electronics、Jiangsu Huahai Chengkexin Material、Beijing Kehua New Materials ・産業チェーン及び販売チャネル分析 - 半導体包装用エポキシ成形コンパウンドの産業チェーン分析 - 半導体包装用エポキシ成形コンパウンドの原材料 - 半導体包装用エポキシ成形コンパウンドの生産プロセス - 半導体包装用エポキシ成形コンパウンドの販売及びマーケティング - 半導体包装用エポキシ成形コンパウンドの主要顧客 ・マーケットドライバー、機会、課題、リスク要因分析 - 半導体包装用エポキシ成形コンパウンドの産業動向 - 半導体包装用エポキシ成形コンパウンドのマーケットドライバー - 半導体包装用エポキシ成形コンパウンドの課題 - 半導体包装用エポキシ成形コンパウンドの阻害要因 ・主な調査結果

Market Analysis and Insights: Global Epoxy Molding Compound in Semiconductor Packaging Market
Due to the COVID-19 pandemic, the global Epoxy Molding Compound in Semiconductor Packaging market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, Normal Epoxy Molding Compound accounting for % of the Epoxy Molding Compound in Semiconductor Packaging global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While IC segment is altered to an % CAGR throughout this forecast period.
China Epoxy Molding Compound in Semiconductor Packaging market size is valued at US$ million in 2021, while the US and Europe Epoxy Molding Compound in Semiconductor Packaging are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe Epoxy Molding Compound in Semiconductor Packaging landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028.
The global key manufacturers of Epoxy Molding Compound in Semiconductor Packaging include Samsung SDI, Sumitomo Bakelite, Showa Denko, Eternal Materials, Chang Chun Group, KCC, Duresco, Hysol Huawei Electronics and Jiangsu Huahai Chengkexin Material and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the Epoxy Molding Compound in Semiconductor Packaging capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Epoxy Molding Compound in Semiconductor Packaging by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Epoxy Molding Compound in Semiconductor Packaging Scope and Segment
Epoxy Molding Compound in Semiconductor Packaging market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Epoxy Molding Compound in Semiconductor Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Normal Epoxy Molding Compound
Green Epoxy Molding Compound
Segment by Application
IC
Diode
Transistor
Photocoupler
Others
By Company
Samsung SDI
Sumitomo Bakelite
Showa Denko
Eternal Materials
Chang Chun Group
KCC
Duresco
Hysol Huawei Electronics
Jiangsu Huahai Chengkexin Material
Beijing Kehua New Materials
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East & Africa
Turkey
Saudi Arabia
UAE

レポート目次

---

1 Study Coverage
1.1 Epoxy Molding Compound in Semiconductor Packaging Product Introduction
1.2 Market by Type
1.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Market Size by Type, 2017 VS 2021 VS 2028
1.2.2 Normal Epoxy Molding Compound
1.2.3 Green Epoxy Molding Compound
1.3 Market by Application
1.3.1 Global Epoxy Molding Compound in Semiconductor Packaging Market Size by Application, 2017 VS 2021 VS 2028
1.3.2 IC
1.3.3 Diode
1.3.4 Transistor
1.3.5 Photocoupler
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
2 Global Epoxy Molding Compound in Semiconductor Packaging Production
2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity (2017-2028)
2.2 Global Epoxy Molding Compound in Semiconductor Packaging Production by Region: 2017 VS 2021 VS 2028
2.3 Global Epoxy Molding Compound in Semiconductor Packaging Production by Region
2.3.1 Global Epoxy Molding Compound in Semiconductor Packaging Historic Production by Region (2017-2022)
2.3.2 Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Production by Region (2023-2028)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
3 Global Epoxy Molding Compound in Semiconductor Packaging Sales in Volume & Value Estimates and Forecasts
3.1 Global Epoxy Molding Compound in Semiconductor Packaging Sales Estimates and Forecasts 2017-2028
3.2 Global Epoxy Molding Compound in Semiconductor Packaging Revenue Estimates and Forecasts 2017-2028
3.3 Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Region: 2017 VS 2021 VS 2028
3.4 Global Epoxy Molding Compound in Semiconductor Packaging Sales by Region
3.4.1 Global Epoxy Molding Compound in Semiconductor Packaging Sales by Region (2017-2022)
3.4.2 Global Sales Epoxy Molding Compound in Semiconductor Packaging by Region (2023-2028)
3.5 Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Region
3.5.1 Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Region (2017-2022)
3.5.2 Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Region (2023-2028)
3.6 North America
3.7 Europe
3.8 Asia-Pacific
3.9 Latin America
3.10 Middle East & Africa
4 Competition by Manufactures
4.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity by Manufacturers
4.2 Global Epoxy Molding Compound in Semiconductor Packaging Sales by Manufacturers
4.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Sales by Manufacturers (2017-2022)
4.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Manufacturers (2017-2022)
4.2.3 Global Top 10 and Top 5 Largest Manufacturers of Epoxy Molding Compound in Semiconductor Packaging in 2021
4.3 Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Manufacturers
4.3.1 Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Manufacturers (2017-2022)
4.3.2 Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Manufacturers (2017-2022)
4.3.3 Global Top 10 and Top 5 Companies by Epoxy Molding Compound in Semiconductor Packaging Revenue in 2021
4.4 Global Epoxy Molding Compound in Semiconductor Packaging Sales Price by Manufacturers
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Epoxy Molding Compound in Semiconductor Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.5.3 Global Epoxy Molding Compound in Semiconductor Packaging Manufacturers Geographical Distribution
4.6 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Epoxy Molding Compound in Semiconductor Packaging Sales by Type
5.1.1 Global Epoxy Molding Compound in Semiconductor Packaging Historical Sales by Type (2017-2022)
5.1.2 Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Sales by Type (2023-2028)
5.1.3 Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Type (2017-2028)
5.2 Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Type
5.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Historical Revenue by Type (2017-2022)
5.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Revenue by Type (2023-2028)
5.2.3 Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Type (2017-2028)
5.3 Global Epoxy Molding Compound in Semiconductor Packaging Price by Type
5.3.1 Global Epoxy Molding Compound in Semiconductor Packaging Price by Type (2017-2022)
5.3.2 Global Epoxy Molding Compound in Semiconductor Packaging Price Forecast by Type (2023-2028)
6 Market Size by Application
6.1 Global Epoxy Molding Compound in Semiconductor Packaging Sales by Application
6.1.1 Global Epoxy Molding Compound in Semiconductor Packaging Historical Sales by Application (2017-2022)
6.1.2 Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Sales by Application (2023-2028)
6.1.3 Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Application (2017-2028)
6.2 Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Application
6.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Historical Revenue by Application (2017-2022)
6.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Revenue by Application (2023-2028)
6.2.3 Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Application (2017-2028)
6.3 Global Epoxy Molding Compound in Semiconductor Packaging Price by Application
6.3.1 Global Epoxy Molding Compound in Semiconductor Packaging Price by Application (2017-2022)
6.3.2 Global Epoxy Molding Compound in Semiconductor Packaging Price Forecast by Application (2023-2028)
7 North America
7.1 North America Epoxy Molding Compound in Semiconductor Packaging Market Size by Type
7.1.1 North America Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2017-2028)
7.1.2 North America Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2017-2028)
7.2 North America Epoxy Molding Compound in Semiconductor Packaging Market Size by Application
7.2.1 North America Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2017-2028)
7.2.2 North America Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2017-2028)
7.3 North America Epoxy Molding Compound in Semiconductor Packaging Sales by Country
7.3.1 North America Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2017-2028)
7.3.2 North America Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2017-2028)
7.3.3 United States
7.3.4 Canada
8 Europe
8.1 Europe Epoxy Molding Compound in Semiconductor Packaging Market Size by Type
8.1.1 Europe Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2017-2028)
8.1.2 Europe Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2017-2028)
8.2 Europe Epoxy Molding Compound in Semiconductor Packaging Market Size by Application
8.2.1 Europe Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2017-2028)
8.2.2 Europe Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2017-2028)
8.3 Europe Epoxy Molding Compound in Semiconductor Packaging Sales by Country
8.3.1 Europe Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2017-2028)
8.3.2 Europe Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2017-2028)
8.3.3 Germany
8.3.4 France
8.3.5 U.K.
8.3.6 Italy
8.3.7 Russia
9 Asia Pacific
9.1 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Market Size by Type
9.1.1 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2017-2028)
9.1.2 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2017-2028)
9.2 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Market Size by Application
9.2.1 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2017-2028)
9.2.2 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2017-2028)
9.3 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales by Region
9.3.1 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales by Region (2017-2028)
9.3.2 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue by Region (2017-2028)
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.3.6 India
9.3.7 Australia
9.3.8 China Taiwan
9.3.9 Indonesia
9.3.10 Thailand
9.3.11 Malaysia
10 Latin America
10.1 Latin America Epoxy Molding Compound in Semiconductor Packaging Market Size by Type
10.1.1 Latin America Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2017-2028)
10.1.2 Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2017-2028)
10.2 Latin America Epoxy Molding Compound in Semiconductor Packaging Market Size by Application
10.2.1 Latin America Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2017-2028)
10.2.2 Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2017-2028)
10.3 Latin America Epoxy Molding Compound in Semiconductor Packaging Sales by Country
10.3.1 Latin America Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2017-2028)
10.3.2 Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2017-2028)
10.3.3 Mexico
10.3.4 Brazil
10.3.5 Argentina
10.3.6 Colombia
11 Middle East and Africa
11.1 Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Market Size by Type
11.1.1 Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2017-2028)
11.1.2 Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2017-2028)
11.2 Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Market Size by Application
11.2.1 Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2017-2028)
11.2.2 Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2017-2028)
11.3 Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales by Country
11.3.1 Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2017-2028)
11.3.2 Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2017-2028)
11.3.3 Turkey
11.3.4 Saudi Arabia
11.3.5 UAE
12 Corporate Profiles
12.1 Samsung SDI
12.1.1 Samsung SDI Corporation Information
12.1.2 Samsung SDI Overview
12.1.3 Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.1.4 Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Samsung SDI Recent Developments
12.2 Sumitomo Bakelite
12.2.1 Sumitomo Bakelite Corporation Information
12.2.2 Sumitomo Bakelite Overview
12.2.3 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.2.4 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Sumitomo Bakelite Recent Developments
12.3 Showa Denko
12.3.1 Showa Denko Corporation Information
12.3.2 Showa Denko Overview
12.3.3 Showa Denko Epoxy Molding Compound in Semiconductor Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.3.4 Showa Denko Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Showa Denko Recent Developments
12.4 Eternal Materials
12.4.1 Eternal Materials Corporation Information
12.4.2 Eternal Materials Overview
12.4.3 Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.4.4 Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Eternal Materials Recent Developments
12.5 Chang Chun Group
12.5.1 Chang Chun Group Corporation Information
12.5.2 Chang Chun Group Overview
12.5.3 Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.5.4 Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Chang Chun Group Recent Developments
12.6 KCC
12.6.1 KCC Corporation Information
12.6.2 KCC Overview
12.6.3 KCC Epoxy Molding Compound in Semiconductor Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.6.4 KCC Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 KCC Recent Developments
12.7 Duresco
12.7.1 Duresco Corporation Information
12.7.2 Duresco Overview
12.7.3 Duresco Epoxy Molding Compound in Semiconductor Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.7.4 Duresco Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Duresco Recent Developments
12.8 Hysol Huawei Electronics
12.8.1 Hysol Huawei Electronics Corporation Information
12.8.2 Hysol Huawei Electronics Overview
12.8.3 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.8.4 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Hysol Huawei Electronics Recent Developments
12.9 Jiangsu Huahai Chengkexin Material
12.9.1 Jiangsu Huahai Chengkexin Material Corporation Information
12.9.2 Jiangsu Huahai Chengkexin Material Overview
12.9.3 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.9.4 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Jiangsu Huahai Chengkexin Material Recent Developments
12.10 Beijing Kehua New Materials
12.10.1 Beijing Kehua New Materials Corporation Information
12.10.2 Beijing Kehua New Materials Overview
12.10.3 Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.10.4 Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Beijing Kehua New Materials Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Epoxy Molding Compound in Semiconductor Packaging Industry Chain Analysis
13.2 Epoxy Molding Compound in Semiconductor Packaging Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Epoxy Molding Compound in Semiconductor Packaging Production Mode & Process
13.4 Epoxy Molding Compound in Semiconductor Packaging Sales and Marketing
13.4.1 Epoxy Molding Compound in Semiconductor Packaging Sales Channels
13.4.2 Epoxy Molding Compound in Semiconductor Packaging Distributors
13.5 Epoxy Molding Compound in Semiconductor Packaging Customers
14 Market Drivers, Opportunities, Challenges and Risks Factors Analysis
14.1 Epoxy Molding Compound in Semiconductor Packaging Industry Trends
14.2 Epoxy Molding Compound in Semiconductor Packaging Market Drivers
14.3 Epoxy Molding Compound in Semiconductor Packaging Market Challenges
14.4 Epoxy Molding Compound in Semiconductor Packaging Market Restraints
15 Key Finding in The Global Epoxy Molding Compound in Semiconductor Packaging Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer

List of Tables
Table 1. Global Epoxy Molding Compound in Semiconductor Packaging Market Size Growth Rate by Type, 2017 VS 2021 VS 2028 (US$ Million)
Table 2. Major Manufacturers of Normal Epoxy Molding Compound
Table 3. Major Manufacturers of Green Epoxy Molding Compound
Table 4. Global Epoxy Molding Compound in Semiconductor Packaging Market Size Growth Rate by Application, 2017 VS 2021 2028 (US$ Million)
Table 5. Global Epoxy Molding Compound in Semiconductor Packaging Production by Region: 2017 VS 2021 VS 2028 (Tons)
Table 6. Global Epoxy Molding Compound in Semiconductor Packaging Production by Region (2017-2022) & (Tons)
Table 7. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Region (2017-2022)
Table 8. Global Epoxy Molding Compound in Semiconductor Packaging Production by Region (2023-2028) & (Tons)
Table 9. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Region (2023-2028)
Table 10. Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Region: 2017 VS 2021 VS 2028 (US$ Million)
Table 11. Global Epoxy Molding Compound in Semiconductor Packaging Sales by Region (2017-2022) & (Tons)
Table 12. Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Region (2017-2022)
Table 13. Global Epoxy Molding Compound in Semiconductor Packaging Sales by Region (2023-2028) & (Tons)
Table 14. Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Region (2023-2028)
Table 15. Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Region (2017-2022) & (US$ Million)
Table 16. Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Region (2017-2022)
Table 17. Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Region (2023-2028) & (US$ Million)
Table 18. Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Region (2023-2028)
Table 19. Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity by Manufacturers (2017-2022) & (Tons)
Table 20. Global Epoxy Molding Compound in Semiconductor Packaging Capacity Market Share by Manufacturers (2017-2022)
Table 21. Global Epoxy Molding Compound in Semiconductor Packaging Sales by Manufacturers (2017-2022) & (Tons)
Table 22. Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Manufacturers (2017-2022)
Table 23. Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Manufacturers (2017-2022) & (US$ Million)
Table 24. Global Epoxy Molding Compound in Semiconductor Packaging Revenue Share by Manufacturers (2017-2022)
Table 25. Epoxy Molding Compound in Semiconductor Packaging Price by Manufacturers 2017-2022 (US$/Ton)
Table 26. Global Epoxy Molding Compound in Semiconductor Packaging Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 27. Global Epoxy Molding Compound in Semiconductor Packaging by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Epoxy Molding Compound in Semiconductor Packaging as of 2021)
Table 28. Epoxy Molding Compound in Semiconductor Packaging Manufacturing Base Distribution and Headquarters
Table 29. Manufacturers Epoxy Molding Compound in Semiconductor Packaging Product Offered
Table 30. Date of Manufacturers Enter into Epoxy Molding Compound in Semiconductor Packaging Market
Table 31. Mergers & Acquisitions, Expansion Plans
Table 32. Global Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2017-2022) & (Tons)
Table 33. Global Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2023-2028) & (Tons)
Table 34. Global Epoxy Molding Compound in Semiconductor Packaging Sales Share by Type (2017-2022)
Table 35. Global Epoxy Molding Compound in Semiconductor Packaging Sales Share by Type (2023-2028)
Table 36. Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2017-2022) & (US$ Million)
Table 37. Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2023-2028) & (US$ Million)
Table 38. Global Epoxy Molding Compound in Semiconductor Packaging Revenue Share by Type (2017-2022)
Table 39. Global Epoxy Molding Compound in Semiconductor Packaging Revenue Share by Type (2023-2028)
Table 40. Epoxy Molding Compound in Semiconductor Packaging Price by Type (2017-2022) & (US$/Ton)
Table 41. Global Epoxy Molding Compound in Semiconductor Packaging Price Forecast by Type (2023-2028) & (US$/Ton)
Table 42. Global Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2017-2022) & (Tons)
Table 43. Global Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2023-2028) & (Tons)
Table 44. Global Epoxy Molding Compound in Semiconductor Packaging Sales Share by Application (2017-2022)
Table 45. Global Epoxy Molding Compound in Semiconductor Packaging Sales Share by Application (2023-2028)
Table 46. Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2017-2022) & (US$ Million)
Table 47. Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2023-2028) & (US$ Million)
Table 48. Global Epoxy Molding Compound in Semiconductor Packaging Revenue Share by Application (2017-2022)
Table 49. Global Epoxy Molding Compound in Semiconductor Packaging Revenue Share by Application (2023-2028)
Table 50. Epoxy Molding Compound in Semiconductor Packaging Price by Application (2017-2022) & (US$/Ton)
Table 51. Global Epoxy Molding Compound in Semiconductor Packaging Price Forecast by Application (2023-2028) & (US$/Ton)
Table 52. North America Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2017-2022) & (Tons)
Table 53. North America Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2023-2028) & (Tons)
Table 54. North America Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2017-2022) & (US$ Million)
Table 55. North America Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2023-2028) & (US$ Million)
Table 56. North America Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2017-2022) & (Tons)
Table 57. North America Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2023-2028) & (Tons)
Table 58. North America Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2017-2022) & (US$ Million)
Table 59. North America Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2023-2028) & (US$ Million)
Table 60. North America Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2017-2022) & (Tons)
Table 61. North America Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2023-2028) & (Tons)
Table 62. North America Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2017-2022) & (US$ Million)
Table 63. North America Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2023-2028) & (US$ Million)
Table 64. Europe Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2017-2022) & (Tons)
Table 65. Europe Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2023-2028) & (Tons)
Table 66. Europe Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2017-2022) & (US$ Million)
Table 67. Europe Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2023-2028) & (US$ Million)
Table 68. Europe Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2017-2022) & (Tons)
Table 69. Europe Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2023-2028) & (Tons)
Table 70. Europe Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2017-2022) & (US$ Million)
Table 71. Europe Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2023-2028) & (US$ Million)
Table 72. Europe Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2017-2022) & (Tons)
Table 73. Europe Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2023-2028) & (Tons)
Table 74. Europe Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2017-2022) & (US$ Million)
Table 75. Europe Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2023-2028) & (US$ Million)
Table 76. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2017-2022) & (Tons)
Table 77. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2023-2028) & (Tons)
Table 78. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2017-2022) & (US$ Million)
Table 79. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2023-2028) & (US$ Million)
Table 80. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2017-2022) & (Tons)
Table 81. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2023-2028) & (Tons)
Table 82. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2017-2022) & (US$ Million)
Table 83. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2023-2028) & (US$ Million)
Table 84. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales by Region (2017-2022) & (Tons)
Table 85. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales by Region (2023-2028) & (Tons)
Table 86. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue by Region (2017-2022) & (US$ Million)
Table 87. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue by Region (2023-2028) & (US$ Million)
Table 88. Latin America Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2017-2022) & (Tons)
Table 89. Latin America Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2023-2028) & (Tons)
Table 90. Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2017-2022) & (US$ Million)
Table 91. Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2023-2028) & (US$ Million)
Table 92. Latin America Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2017-2022) & (Tons)
Table 93. Latin America Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2023-2028) & (Tons)
Table 94. Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2017-2022) & (US$ Million)
Table 95. Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2023-2028) & (US$ Million)
Table 96. Latin America Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2017-2022) & (Tons)
Table 97. Latin America Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2023-2028) & (Tons)
Table 98. Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2017-2022) & (US$ Million)
Table 99. Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2023-2028) & (US$ Million)
Table 100. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2017-2022) & (Tons)
Table 101. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales by Type (2023-2028) & (Tons)
Table 102. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2017-2022) & (US$ Million)
Table 103. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue by Type (2023-2028) & (US$ Million)
Table 104. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2017-2022) & (Tons)
Table 105. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales by Application (2023-2028) & (Tons)
Table 106. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2017-2022) & (US$ Million)
Table 107. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue by Application (2023-2028) & (US$ Million)
Table 108. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2017-2022) & (Tons)
Table 109. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales by Country (2023-2028) & (Tons)
Table 110. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2017-2022) & (US$ Million)
Table 111. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue by Country (2023-2028) & (US$ Million)
Table 112. Samsung SDI Corporation Information
Table 113. Samsung SDI Description and Major Businesses
Table 114. Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2017-2022)
Table 115. Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
Table 116. Samsung SDI Recent Development
Table 117. Sumitomo Bakelite Corporation Information
Table 118. Sumitomo Bakelite Description and Major Businesses
Table 119. Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2017-2022)
Table 120. Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
Table 121. Sumitomo Bakelite Recent Development
Table 122. Showa Denko Corporation Information
Table 123. Showa Denko Description and Major Businesses
Table 124. Showa Denko Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2017-2022)
Table 125. Showa Denko Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
Table 126. Showa Denko Recent Development
Table 127. Eternal Materials Corporation Information
Table 128. Eternal Materials Description and Major Businesses
Table 129. Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2017-2022)
Table 130. Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
Table 131. Eternal Materials Recent Development
Table 132. Chang Chun Group Corporation Information
Table 133. Chang Chun Group Description and Major Businesses
Table 134. Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2017-2022)
Table 135. Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
Table 136. Chang Chun Group Recent Development
Table 137. KCC Corporation Information
Table 138. KCC Description and Major Businesses
Table 139. KCC Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2017-2022)
Table 140. KCC Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
Table 141. KCC Recent Development
Table 142. Duresco Corporation Information
Table 143. Duresco Description and Major Businesses
Table 144. Duresco Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2017-2022)
Table 145. Duresco Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
Table 146. Duresco Recent Development
Table 147. Hysol Huawei Electronics Corporation Information
Table 148. Hysol Huawei Electronics Description and Major Businesses
Table 149. Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2017-2022)
Table 150. Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
Table 151. Hysol Huawei Electronics Recent Development
Table 152. Jiangsu Huahai Chengkexin Material Corporation Information
Table 153. Jiangsu Huahai Chengkexin Material Description and Major Businesses
Table 154. Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2017-2022)
Table 155. Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
Table 156. Jiangsu Huahai Chengkexin Material Recent Development
Table 157. Beijing Kehua New Materials Corporation Information
Table 158. Beijing Kehua New Materials Description and Major Businesses
Table 159. Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2017-2022)
Table 160. Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Product Model Numbers, Pictures, Descriptions and Specifications
Table 161. Beijing Kehua New Materials Recent Development
Table 162. Key Raw Materials Lists
Table 163. Raw Materials Key Suppliers Lists
Table 164. Epoxy Molding Compound in Semiconductor Packaging Distributors List
Table 165. Epoxy Molding Compound in Semiconductor Packaging Customers List
Table 166. Epoxy Molding Compound in Semiconductor Packaging Market Trends
Table 167. Epoxy Molding Compound in Semiconductor Packaging Market Drivers
Table 168. Epoxy Molding Compound in Semiconductor Packaging Market Challenges
Table 169. Epoxy Molding Compound in Semiconductor Packaging Market Restraints
Table 170. Research Programs/Design for This Report
Table 171. Key Data Information from Secondary Sources
Table 172. Key Data Information from Primary Sources
List of Figures
Figure 1. Epoxy Molding Compound in Semiconductor Packaging Product Picture
Figure 2. Global Epoxy Molding Compound in Semiconductor Packaging Market Share by Type in 2021 & 2028
Figure 3. Normal Epoxy Molding Compound Product Picture
Figure 4. Green Epoxy Molding Compound Product Picture
Figure 5. Global Epoxy Molding Compound in Semiconductor Packaging Market Share by Application in 2021 & 2028
Figure 6. IC
Figure 7. Diode
Figure 8. Transistor
Figure 9. Photocoupler
Figure 10. Others
Figure 11. Epoxy Molding Compound in Semiconductor Packaging Report Years Considered
Figure 12. Global Epoxy Molding Compound in Semiconductor Packaging Capacity, Production and Utilization (2017-2028) & (Tons)
Figure 13. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Region in Percentage: 2021 Versus 2028
Figure 14. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Region (2017-2022)
Figure 15. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Region (2023-2028)
Figure 16. Epoxy Molding Compound in Semiconductor Packaging Production Growth Rate in North America (2017-2028) & (Tons)
Figure 17. Epoxy Molding Compound in Semiconductor Packaging Production Growth Rate in Europe (2017-2028) & (Tons)
Figure 18. Epoxy Molding Compound in Semiconductor Packaging Production Growth Rate in China (2017-2028) & (Tons)
Figure 19. Epoxy Molding Compound in Semiconductor Packaging Production Growth Rate in Japan (2017-2028) & (Tons)
Figure 20. Global Epoxy Molding Compound in Semiconductor Packaging Sales 2017-2028 (Tons)
Figure 21. Global Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$ Million), 2017 VS 2021 VS 2028
Figure 22. Global Epoxy Molding Compound in Semiconductor Packaging Revenue 2017-2028 (US$ Million)
Figure 23. Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Region in Percentage: 2021 Versus 2028
Figure 24. Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Region (2017-2022)
Figure 25. Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Region (2023-2028)
Figure 26. North America Epoxy Molding Compound in Semiconductor Packaging Sales YoY (2017-2028) & (Tons)
Figure 27. North America Epoxy Molding Compound in Semiconductor Packaging Revenue YoY (2017-2028) & (US$ Million)
Figure 28. Europe Epoxy Molding Compound in Semiconductor Packaging Sales YoY (2017-2028) & (Tons)
Figure 29. Europe Epoxy Molding Compound in Semiconductor Packaging Revenue YoY (2017-2028) & (US$ Million)
Figure 30. Asia-Pacific Epoxy Molding Compound in Semiconductor Packaging Sales YoY (2017-2028) & (Tons)
Figure 31. Asia-Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue YoY (2017-2028) & (US$ Million)
Figure 32. Latin America Epoxy Molding Compound in Semiconductor Packaging Sales YoY (2017-2028) & (Tons)
Figure 33. Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue YoY (2017-2028) & (US$ Million)
Figure 34. Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Sales YoY (2017-2028) & (Tons)
Figure 35. Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Revenue YoY (2017-2028) & (US$ Million)
Figure 36. The Epoxy Molding Compound in Semiconductor Packaging Market Share of Top 10 and Top 5 Largest Manufacturers Around the World in 2021
Figure 37. The Top 5 and 10 Largest Manufacturers of Epoxy Molding Compound in Semiconductor Packaging in the World: Market Share by Epoxy Molding Compound in Semiconductor Packaging Revenue in 2021
Figure 38. Epoxy Molding Compound in Semiconductor Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2017 VS 2021
Figure 39. Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Type (2017-2028)
Figure 40. Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Type (2017-2028)
Figure 41. Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Application (2017-2028)
Figure 42. Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Application (2017-2028)
Figure 43. North America Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Type (2017-2028)
Figure 44. North America Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Type (2017-2028)
Figure 45. North America Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Application (2017-2028)
Figure 46. North America Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Application (2017-2028)
Figure 47. North America Epoxy Molding Compound in Semiconductor Packaging Sales Share by Country (2017-2028)
Figure 48. North America Epoxy Molding Compound in Semiconductor Packaging Revenue Share by Country (2017-2028)
Figure 49. United States Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 50. Canada Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 51. Europe Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Type (2017-2028)
Figure 52. Europe Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Type (2017-2028)
Figure 53. Europe Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Application (2017-2028)
Figure 54. Europe Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Application (2017-2028)
Figure 55. Europe Epoxy Molding Compound in Semiconductor Packaging Sales Share by Country (2017-2028)
Figure 56. Europe Epoxy Molding Compound in Semiconductor Packaging Revenue Share by Country (2017-2028)
Figure 57. Germany Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 58. France Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 59. U.K. Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 60. Italy Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 61. Russia Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 62. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Type (2017-2028)
Figure 63. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Type (2017-2028)
Figure 64. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Application (2017-2028)
Figure 65. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Application (2017-2028)
Figure 66. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Sales Share by Region (2017-2028)
Figure 67. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Revenue Share by Region (2017-2028)
Figure 68. China Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 69. Japan Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 70. South Korea Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 71. India Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 72. Australia Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 73. China Taiwan Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 74. Indonesia Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 75. Thailand Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 76. Malaysia Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 77. Latin America Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Type (2017-2028)
Figure 78. Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Type (2017-2028)
Figure 79. Latin America Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Application (2017-2028)
Figure 80. Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Application (2017-2028)
Figure 81. Latin America Epoxy Molding Compound in Semiconductor Packaging Sales Share by Country (2017-2028)
Figure 82. Latin America Epoxy Molding Compound in Semiconductor Packaging Revenue Share by Country (2017-2028)
Figure 83. Mexico Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 84. Brazil Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 85. Argentina Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 86. Colombia Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 87. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Type (2017-2028)
Figure 88. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Type (2017-2028)
Figure 89. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales Market Share by Application (2017-2028)
Figure 90. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share by Application (2017-2028)
Figure 91. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Sales Share by Country (2017-2028)
Figure 92. Middle East and Africa Epoxy Molding Compound in Semiconductor Packaging Revenue Share by Country (2017-2028)
Figure 93. Turkey Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 94. Saudi Arabia Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 95. UAE Epoxy Molding Compound in Semiconductor Packaging Revenue (2017-2028) & (US$ Million)
Figure 96. Epoxy Molding Compound in Semiconductor Packaging Value Chain
Figure 97. Epoxy Molding Compound in Semiconductor Packaging Production Process
Figure 98. Channels of Distribution
Figure 99. Distributors Profiles
Figure 100. Bottom-up and Top-down Approaches for This Report
Figure 101. Data Triangulation
Figure 102. Key Executives Interviewed

---