▶ 調査レポート

ICパッケージ基板のグローバル市場インサイト・予測(~2028年)

• 英文タイトル:Global IC Packaging Substrate Market Insights, Forecast to 2028

QYResearchが調査・発行した産業分析レポートです。ICパッケージ基板のグローバル市場インサイト・予測(~2028年) / Global IC Packaging Substrate Market Insights, Forecast to 2028 / QY2207E04490資料のイメージです。• レポートコード:QY2207E04490
• 出版社/出版日:QYResearch / 2022年7月
• レポート形態:英文、PDF、116ページ
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レポート概要
新型コロナウイルス感染症のパンデミックにより、世界のICパッケージ基板の市場規模は2022年にUS$xxxと推定され、調査期間中のCAGRはxxx%で、2028年までに再調整された規模はUS$xxxになると予測されています。この医療危機による経済変化を十分に考慮すると、2021年にICパッケージ基板の世界市場のxxx%を占める「WB CSP」タイプは、2028年までにUS$xxxの規模になり、パンデミック後の修正xxx%CAGRで成長すると予測されています。一方、「スマートフォン」セグメントは、この予測期間を通じてxxx%のCAGRに変更されます。
中国のICパッケージ基板の市場規模は2021年にUS$xxxと分析されており、米国とヨーロッパのICパッケージ基板市場規模はそれぞれUS$xxxとUS$xxxです。米国の割合は2021年にxxx%であり、中国とヨーロッパはそれぞれxxx%とxxx%です。中国の割合は2028年にxxx%に達し、対象期間を通じてxxx%のCAGRを記録すると予測されています。日本、韓国、東南アジアはアジアで注目市場であり、今後6年間のCAGRはそれぞれxxx%、xxx%、xxx%になる見通しです。ヨーロッパのICパッケージ基板市場については、ドイツは2028年までにUS$xxxに達すると予測されており、予測期間中のCAGRはxxx%になる見通しです。

ICパッケージ基板のグローバル主要メーカーには、Ibiden、Kinsus Interconnect Technology、Unimicron、Shinko Electric Industries、Semco、Simmtech、Nanya、Kyocera、LG Innotek、AT&S、ASE、Daeduck、Shennan Circuit、Zhen Ding Technology、KCC (Korea Circuit Company)、ACCESS、Shenzhen Fastprint Circuit Tech、AKM Meadville、Toppan Printingなどがあります。2021年、世界のトップ5プレイヤーは売上ベースで約xxx%の市場シェアを占めています。

ICパッケージ基板市場は、種類と用途によって区分されます。世界のICパッケージ基板市場のプレーヤー、利害関係者、およびその他の参加者は、当レポートを有益なリソースとして使用することで優位に立つことができます。セグメント分析は、2017年~2028年期間のタイプ別および用途別の販売量、売上、予測に焦点を当てています。

【種類別セグメント】
WB CSP、FC BGA、FC CSP、PBGA、SiP、BOC、その他

【用途別セグメント】
スマートフォン、PC(タブレット、ラップトップ)、ウェアラブルデバイス、その他

【掲載地域】
北米:アメリカ、カナダ
ヨーロッパ:ドイツ、フランス、イギリス、イタリア、ロシア
アジア太平洋:日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア
中南米:メキシコ、ブラジル、アルゼンチン
中東・アフリカ:トルコ、サウジアラビア、UAE

【目次(一部)】

・調査の範囲
- ICパッケージ基板製品概要
- 種類別市場(WB CSP、FC BGA、FC CSP、PBGA、SiP、BOC、その他)
- 用途別市場(スマートフォン、PC(タブレット、ラップトップ)、ウェアラブルデバイス、その他)
- 調査の目的
・エグゼクティブサマリー
- 世界のICパッケージ基板販売量予測2017-2028
- 世界のICパッケージ基板売上予測2017-2028
- ICパッケージ基板の地域別販売量
- ICパッケージ基板の地域別売上
- 北米市場
- ヨーロッパ市場
- アジア太平洋市場
- 中南米市場
- 中東・アフリカ市場
・メーカーの競争状況
- 主要メーカー別ICパッケージ基板販売量
- 主要メーカー別ICパッケージ基板売上
- 主要メーカー別ICパッケージ基板価格
- 競争状況の分析
- 企業M&A動向
・種類別市場規模(WB CSP、FC BGA、FC CSP、PBGA、SiP、BOC、その他)
- ICパッケージ基板の種類別販売量
- ICパッケージ基板の種類別売上
- ICパッケージ基板の種類別価格
・用途別市場規模(スマートフォン、PC(タブレット、ラップトップ)、ウェアラブルデバイス、その他)
- ICパッケージ基板の用途別販売量
- ICパッケージ基板の用途別売上
- ICパッケージ基板の用途別価格
・北米市場
- 北米のICパッケージ基板市場規模(種類別、用途別)
- 主要国別のICパッケージ基板市場規模(アメリカ、カナダ)
・ヨーロッパ市場
- ヨーロッパのICパッケージ基板市場規模(種類別、用途別)
- 主要国別のICパッケージ基板市場規模(ドイツ、フランス、イギリス、イタリア、ロシア)
・アジア太平洋市場
- アジア太平洋のICパッケージ基板市場規模(種類別、用途別)
- 主要国別のICパッケージ基板市場規模(日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア)
・中南米市場
- 中南米のICパッケージ基板市場規模(種類別、用途別)
- 主要国別のICパッケージ基板市場規模(メキシコ、ブラジル、アルゼンチン)
・中東・アフリカ市場
- 中東・アフリカのICパッケージ基板市場規模(種類別、用途別)
- 主要国別のICパッケージ基板市場規模(トルコ、サウジアラビア)
・企業情報
Ibiden、Kinsus Interconnect Technology、Unimicron、Shinko Electric Industries、Semco、Simmtech、Nanya、Kyocera、LG Innotek、AT&S、ASE、Daeduck、Shennan Circuit、Zhen Ding Technology、KCC (Korea Circuit Company)、ACCESS、Shenzhen Fastprint Circuit Tech、AKM Meadville、Toppan Printing
・産業チェーン及び販売チャネル分析
- ICパッケージ基板の産業チェーン分析
- ICパッケージ基板の原材料
- ICパッケージ基板の生産プロセス
- ICパッケージ基板の販売及びマーケティング
- ICパッケージ基板の主要顧客
・マーケットドライバー、機会、課題、リスク要因分析
- ICパッケージ基板の産業動向
- ICパッケージ基板のマーケットドライバー
- ICパッケージ基板の課題
- ICパッケージ基板の阻害要因
・主な調査結果

IC packaging substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging.
Market Analysis and Insights: Global IC Packaging Substrate Market
Due to the COVID-19 pandemic, the global IC Packaging Substrate market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, WB CSP accounting for % of the IC Packaging Substrate global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Smart Phones segment is altered to an % CAGR throughout this forecast period.
China IC Packaging Substrate market size is valued at US$ million in 2021, while the US and Europe IC Packaging Substrate are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe IC Packaging Substrate landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028.
The global key manufacturers of IC Packaging Substrate include Ibiden, Kinsus Interconnect Technology, Unimicron, Shinko Electric Industries, Semco, Simmtech, Nanya, Kyocera and LG Innotek, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the IC Packaging Substrate capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of IC Packaging Substrate by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global IC Packaging Substrate Scope and Segment
IC Packaging Substrate market is segmented by Type and by Application. Players, stakeholders, and other participants in the global IC Packaging Substrate market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
WB CSP
FC BGA
FC CSP
PBGA
SiP
BOC
Other
Segment by Application
Smart Phones
PC (Tablet, Laptop)
Wearable Devices
Others
By Company
Ibiden
Kinsus Interconnect Technology
Unimicron
Shinko Electric Industries
Semco
Simmtech
Nanya
Kyocera
LG Innotek
AT&S
ASE
Daeduck
Shennan Circuit
Zhen Ding Technology
KCC (Korea Circuit Company)
ACCESS
Shenzhen Fastprint Circuit Tech
AKM Meadville
Toppan Printing
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East & Africa
Turkey
Saudi Arabia
UAE

レポート目次

1 Study Coverage
1.1 IC Packaging Substrate Product Introduction
1.2 Market by Type
1.2.1 Global IC Packaging Substrate Market Size by Type, 2017 VS 2021 VS 2028
1.2.2 WB CSP
1.2.3 FC BGA
1.2.4 FC CSP
1.2.5 PBGA
1.2.6 SiP
1.2.7 BOC
1.2.8 Other
1.3 Market by Application
1.3.1 Global IC Packaging Substrate Market Size by Application, 2017 VS 2021 VS 2028
1.3.2 Smart Phones
1.3.3 PC (Tablet, Laptop)
1.3.4 Wearable Devices
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
2 Global IC Packaging Substrate Production
2.1 Global IC Packaging Substrate Production Capacity (2017-2028)
2.2 Global IC Packaging Substrate Production by Region: 2017 VS 2021 VS 2028
2.3 Global IC Packaging Substrate Production by Region
2.3.1 Global IC Packaging Substrate Historic Production by Region (2017-2022)
2.3.2 Global IC Packaging Substrate Forecasted Production by Region (2023-2028)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Global IC Packaging Substrate Sales in Volume & Value Estimates and Forecasts
3.1 Global IC Packaging Substrate Sales Estimates and Forecasts 2017-2028
3.2 Global IC Packaging Substrate Revenue Estimates and Forecasts 2017-2028
3.3 Global IC Packaging Substrate Revenue by Region: 2017 VS 2021 VS 2028
3.4 Global IC Packaging Substrate Sales by Region
3.4.1 Global IC Packaging Substrate Sales by Region (2017-2022)
3.4.2 Global Sales IC Packaging Substrate by Region (2023-2028)
3.5 Global IC Packaging Substrate Revenue by Region
3.5.1 Global IC Packaging Substrate Revenue by Region (2017-2022)
3.5.2 Global IC Packaging Substrate Revenue by Region (2023-2028)
3.6 North America
3.7 Europe
3.8 Asia-Pacific
3.9 Latin America
3.10 Middle East & Africa
4 Competition by Manufactures
4.1 Global IC Packaging Substrate Production Capacity by Manufacturers
4.2 Global IC Packaging Substrate Sales by Manufacturers
4.2.1 Global IC Packaging Substrate Sales by Manufacturers (2017-2022)
4.2.2 Global IC Packaging Substrate Sales Market Share by Manufacturers (2017-2022)
4.2.3 Global Top 10 and Top 5 Largest Manufacturers of IC Packaging Substrate in 2021
4.3 Global IC Packaging Substrate Revenue by Manufacturers
4.3.1 Global IC Packaging Substrate Revenue by Manufacturers (2017-2022)
4.3.2 Global IC Packaging Substrate Revenue Market Share by Manufacturers (2017-2022)
4.3.3 Global Top 10 and Top 5 Companies by IC Packaging Substrate Revenue in 2021
4.4 Global IC Packaging Substrate Sales Price by Manufacturers
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global IC Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.5.3 Global IC Packaging Substrate Manufacturers Geographical Distribution
4.6 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global IC Packaging Substrate Sales by Type
5.1.1 Global IC Packaging Substrate Historical Sales by Type (2017-2022)
5.1.2 Global IC Packaging Substrate Forecasted Sales by Type (2023-2028)
5.1.3 Global IC Packaging Substrate Sales Market Share by Type (2017-2028)
5.2 Global IC Packaging Substrate Revenue by Type
5.2.1 Global IC Packaging Substrate Historical Revenue by Type (2017-2022)
5.2.2 Global IC Packaging Substrate Forecasted Revenue by Type (2023-2028)
5.2.3 Global IC Packaging Substrate Revenue Market Share by Type (2017-2028)
5.3 Global IC Packaging Substrate Price by Type
5.3.1 Global IC Packaging Substrate Price by Type (2017-2022)
5.3.2 Global IC Packaging Substrate Price Forecast by Type (2023-2028)
6 Market Size by Application
6.1 Global IC Packaging Substrate Sales by Application
6.1.1 Global IC Packaging Substrate Historical Sales by Application (2017-2022)
6.1.2 Global IC Packaging Substrate Forecasted Sales by Application (2023-2028)
6.1.3 Global IC Packaging Substrate Sales Market Share by Application (2017-2028)
6.2 Global IC Packaging Substrate Revenue by Application
6.2.1 Global IC Packaging Substrate Historical Revenue by Application (2017-2022)
6.2.2 Global IC Packaging Substrate Forecasted Revenue by Application (2023-2028)
6.2.3 Global IC Packaging Substrate Revenue Market Share by Application (2017-2028)
6.3 Global IC Packaging Substrate Price by Application
6.3.1 Global IC Packaging Substrate Price by Application (2017-2022)
6.3.2 Global IC Packaging Substrate Price Forecast by Application (2023-2028)
7 North America
7.1 North America IC Packaging Substrate Market Size by Type
7.1.1 North America IC Packaging Substrate Sales by Type (2017-2028)
7.1.2 North America IC Packaging Substrate Revenue by Type (2017-2028)
7.2 North America IC Packaging Substrate Market Size by Application
7.2.1 North America IC Packaging Substrate Sales by Application (2017-2028)
7.2.2 North America IC Packaging Substrate Revenue by Application (2017-2028)
7.3 North America IC Packaging Substrate Sales by Country
7.3.1 North America IC Packaging Substrate Sales by Country (2017-2028)
7.3.2 North America IC Packaging Substrate Revenue by Country (2017-2028)
7.3.3 United States
7.3.4 Canada
8 Europe
8.1 Europe IC Packaging Substrate Market Size by Type
8.1.1 Europe IC Packaging Substrate Sales by Type (2017-2028)
8.1.2 Europe IC Packaging Substrate Revenue by Type (2017-2028)
8.2 Europe IC Packaging Substrate Market Size by Application
8.2.1 Europe IC Packaging Substrate Sales by Application (2017-2028)
8.2.2 Europe IC Packaging Substrate Revenue by Application (2017-2028)
8.3 Europe IC Packaging Substrate Sales by Country
8.3.1 Europe IC Packaging Substrate Sales by Country (2017-2028)
8.3.2 Europe IC Packaging Substrate Revenue by Country (2017-2028)
8.3.3 Germany
8.3.4 France
8.3.5 U.K.
8.3.6 Italy
8.3.7 Russia
9 Asia Pacific
9.1 Asia Pacific IC Packaging Substrate Market Size by Type
9.1.1 Asia Pacific IC Packaging Substrate Sales by Type (2017-2028)
9.1.2 Asia Pacific IC Packaging Substrate Revenue by Type (2017-2028)
9.2 Asia Pacific IC Packaging Substrate Market Size by Application
9.2.1 Asia Pacific IC Packaging Substrate Sales by Application (2017-2028)
9.2.2 Asia Pacific IC Packaging Substrate Revenue by Application (2017-2028)
9.3 Asia Pacific IC Packaging Substrate Sales by Region
9.3.1 Asia Pacific IC Packaging Substrate Sales by Region (2017-2028)
9.3.2 Asia Pacific IC Packaging Substrate Revenue by Region (2017-2028)
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.3.6 India
9.3.7 Australia
9.3.8 China Taiwan
9.3.9 Indonesia
9.3.10 Thailand
9.3.11 Malaysia
10 Latin America
10.1 Latin America IC Packaging Substrate Market Size by Type
10.1.1 Latin America IC Packaging Substrate Sales by Type (2017-2028)
10.1.2 Latin America IC Packaging Substrate Revenue by Type (2017-2028)
10.2 Latin America IC Packaging Substrate Market Size by Application
10.2.1 Latin America IC Packaging Substrate Sales by Application (2017-2028)
10.2.2 Latin America IC Packaging Substrate Revenue by Application (2017-2028)
10.3 Latin America IC Packaging Substrate Sales by Country
10.3.1 Latin America IC Packaging Substrate Sales by Country (2017-2028)
10.3.2 Latin America IC Packaging Substrate Revenue by Country (2017-2028)
10.3.3 Mexico
10.3.4 Brazil
10.3.5 Argentina
10.3.6 Colombia
11 Middle East and Africa
11.1 Middle East and Africa IC Packaging Substrate Market Size by Type
11.1.1 Middle East and Africa IC Packaging Substrate Sales by Type (2017-2028)
11.1.2 Middle East and Africa IC Packaging Substrate Revenue by Type (2017-2028)
11.2 Middle East and Africa IC Packaging Substrate Market Size by Application
11.2.1 Middle East and Africa IC Packaging Substrate Sales by Application (2017-2028)
11.2.2 Middle East and Africa IC Packaging Substrate Revenue by Application (2017-2028)
11.3 Middle East and Africa IC Packaging Substrate Sales by Country
11.3.1 Middle East and Africa IC Packaging Substrate Sales by Country (2017-2028)
11.3.2 Middle East and Africa IC Packaging Substrate Revenue by Country (2017-2028)
11.3.3 Turkey
11.3.4 Saudi Arabia
11.3.5 UAE
12 Corporate Profiles
12.1 Ibiden
12.1.1 Ibiden Corporation Information
12.1.2 Ibiden Overview
12.1.3 Ibiden IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.1.4 Ibiden IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Ibiden Recent Developments
12.2 Kinsus Interconnect Technology
12.2.1 Kinsus Interconnect Technology Corporation Information
12.2.2 Kinsus Interconnect Technology Overview
12.2.3 Kinsus Interconnect Technology IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.2.4 Kinsus Interconnect Technology IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Kinsus Interconnect Technology Recent Developments
12.3 Unimicron
12.3.1 Unimicron Corporation Information
12.3.2 Unimicron Overview
12.3.3 Unimicron IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.3.4 Unimicron IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Unimicron Recent Developments
12.4 Shinko Electric Industries
12.4.1 Shinko Electric Industries Corporation Information
12.4.2 Shinko Electric Industries Overview
12.4.3 Shinko Electric Industries IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.4.4 Shinko Electric Industries IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Shinko Electric Industries Recent Developments
12.5 Semco
12.5.1 Semco Corporation Information
12.5.2 Semco Overview
12.5.3 Semco IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.5.4 Semco IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Semco Recent Developments
12.6 Simmtech
12.6.1 Simmtech Corporation Information
12.6.2 Simmtech Overview
12.6.3 Simmtech IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.6.4 Simmtech IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Simmtech Recent Developments
12.7 Nanya
12.7.1 Nanya Corporation Information
12.7.2 Nanya Overview
12.7.3 Nanya IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.7.4 Nanya IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Nanya Recent Developments
12.8 Kyocera
12.8.1 Kyocera Corporation Information
12.8.2 Kyocera Overview
12.8.3 Kyocera IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.8.4 Kyocera IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Kyocera Recent Developments
12.9 LG Innotek
12.9.1 LG Innotek Corporation Information
12.9.2 LG Innotek Overview
12.9.3 LG Innotek IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.9.4 LG Innotek IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 LG Innotek Recent Developments
12.10 AT&S
12.10.1 AT&S Corporation Information
12.10.2 AT&S Overview
12.10.3 AT&S IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.10.4 AT&S IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 AT&S Recent Developments
12.11 ASE
12.11.1 ASE Corporation Information
12.11.2 ASE Overview
12.11.3 ASE IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.11.4 ASE IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 ASE Recent Developments
12.12 Daeduck
12.12.1 Daeduck Corporation Information
12.12.2 Daeduck Overview
12.12.3 Daeduck IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.12.4 Daeduck IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 Daeduck Recent Developments
12.13 Shennan Circuit
12.13.1 Shennan Circuit Corporation Information
12.13.2 Shennan Circuit Overview
12.13.3 Shennan Circuit IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.13.4 Shennan Circuit IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 Shennan Circuit Recent Developments
12.14 Zhen Ding Technology
12.14.1 Zhen Ding Technology Corporation Information
12.14.2 Zhen Ding Technology Overview
12.14.3 Zhen Ding Technology IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.14.4 Zhen Ding Technology IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.14.5 Zhen Ding Technology Recent Developments
12.15 KCC (Korea Circuit Company)
12.15.1 KCC (Korea Circuit Company) Corporation Information
12.15.2 KCC (Korea Circuit Company) Overview
12.15.3 KCC (Korea Circuit Company) IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.15.4 KCC (Korea Circuit Company) IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.15.5 KCC (Korea Circuit Company) Recent Developments
12.16 ACCESS
12.16.1 ACCESS Corporation Information
12.16.2 ACCESS Overview
12.16.3 ACCESS IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.16.4 ACCESS IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.16.5 ACCESS Recent Developments
12.17 Shenzhen Fastprint Circuit Tech
12.17.1 Shenzhen Fastprint Circuit Tech Corporation Information
12.17.2 Shenzhen Fastprint Circuit Tech Overview
12.17.3 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.17.4 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.17.5 Shenzhen Fastprint Circuit Tech Recent Developments
12.18 AKM Meadville
12.18.1 AKM Meadville Corporation Information
12.18.2 AKM Meadville Overview
12.18.3 AKM Meadville IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.18.4 AKM Meadville IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.18.5 AKM Meadville Recent Developments
12.19 Toppan Printing
12.19.1 Toppan Printing Corporation Information
12.19.2 Toppan Printing Overview
12.19.3 Toppan Printing IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.19.4 Toppan Printing IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.19.5 Toppan Printing Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 IC Packaging Substrate Industry Chain Analysis
13.2 IC Packaging Substrate Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 IC Packaging Substrate Production Mode & Process
13.4 IC Packaging Substrate Sales and Marketing
13.4.1 IC Packaging Substrate Sales Channels
13.4.2 IC Packaging Substrate Distributors
13.5 IC Packaging Substrate Customers
14 Market Drivers, Opportunities, Challenges and Risks Factors Analysis
14.1 IC Packaging Substrate Industry Trends
14.2 IC Packaging Substrate Market Drivers
14.3 IC Packaging Substrate Market Challenges
14.4 IC Packaging Substrate Market Restraints
15 Key Finding in The Global IC Packaging Substrate Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer

List of Tables
Table 1. Global IC Packaging Substrate Market Size Growth Rate by Type, 2017 VS 2021 VS 2028 (US$ Million)
Table 2. Major Manufacturers of WB CSP
Table 3. Major Manufacturers of FC BGA
Table 4. Major Manufacturers of FC CSP
Table 5. Major Manufacturers of PBGA
Table 6. Major Manufacturers of SiP
Table 7. Major Manufacturers of BOC
Table 8. Major Manufacturers of Other
Table 9. Global IC Packaging Substrate Market Size Growth Rate by Application, 2017 VS 2021 2028 (US$ Million)
Table 10. Global IC Packaging Substrate Production by Region: 2017 VS 2021 VS 2028 (K Sqm)
Table 11. Global IC Packaging Substrate Production by Region (2017-2022) & (K Sqm)
Table 12. Global IC Packaging Substrate Production Market Share by Region (2017-2022)
Table 13. Global IC Packaging Substrate Production by Region (2023-2028) & (K Sqm)
Table 14. Global IC Packaging Substrate Production Market Share by Region (2023-2028)
Table 15. Global IC Packaging Substrate Revenue by Region: 2017 VS 2021 VS 2028 (US$ Million)
Table 16. Global IC Packaging Substrate Sales by Region (2017-2022) & (K Sqm)
Table 17. Global IC Packaging Substrate Sales Market Share by Region (2017-2022)
Table 18. Global IC Packaging Substrate Sales by Region (2023-2028) & (K Sqm)
Table 19. Global IC Packaging Substrate Sales Market Share by Region (2023-2028)
Table 20. Global IC Packaging Substrate Revenue by Region (2017-2022) & (US$ Million)
Table 21. Global IC Packaging Substrate Revenue Market Share by Region (2017-2022)
Table 22. Global IC Packaging Substrate Revenue by Region (2023-2028) & (US$ Million)
Table 23. Global IC Packaging Substrate Revenue Market Share by Region (2023-2028)
Table 24. Global IC Packaging Substrate Production Capacity by Manufacturers (2017-2022) & (K Sqm)
Table 25. Global IC Packaging Substrate Capacity Market Share by Manufacturers (2017-2022)
Table 26. Global IC Packaging Substrate Sales by Manufacturers (2017-2022) & (K Sqm)
Table 27. Global IC Packaging Substrate Sales Market Share by Manufacturers (2017-2022)
Table 28. Global IC Packaging Substrate Revenue by Manufacturers (2017-2022) & (US$ Million)
Table 29. Global IC Packaging Substrate Revenue Share by Manufacturers (2017-2022)
Table 30. IC Packaging Substrate Price by Manufacturers 2017-2022 (US$/Sqm)
Table 31. Global IC Packaging Substrate Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 32. Global IC Packaging Substrate by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in IC Packaging Substrate as of 2021)
Table 33. IC Packaging Substrate Manufacturing Base Distribution and Headquarters
Table 34. Manufacturers IC Packaging Substrate Product Offered
Table 35. Date of Manufacturers Enter into IC Packaging Substrate Market
Table 36. Mergers & Acquisitions, Expansion Plans
Table 37. Global IC Packaging Substrate Sales by Type (2017-2022) & (K Sqm)
Table 38. Global IC Packaging Substrate Sales by Type (2023-2028) & (K Sqm)
Table 39. Global IC Packaging Substrate Sales Share by Type (2017-2022)
Table 40. Global IC Packaging Substrate Sales Share by Type (2023-2028)
Table 41. Global IC Packaging Substrate Revenue by Type (2017-2022) & (US$ Million)
Table 42. Global IC Packaging Substrate Revenue by Type (2023-2028) & (US$ Million)
Table 43. Global IC Packaging Substrate Revenue Share by Type (2017-2022)
Table 44. Global IC Packaging Substrate Revenue Share by Type (2023-2028)
Table 45. IC Packaging Substrate Price by Type (2017-2022) & (US$/Sqm)
Table 46. Global IC Packaging Substrate Price Forecast by Type (2023-2028) & (US$/Sqm)
Table 47. Global IC Packaging Substrate Sales by Application (2017-2022) & (K Sqm)
Table 48. Global IC Packaging Substrate Sales by Application (2023-2028) & (K Sqm)
Table 49. Global IC Packaging Substrate Sales Share by Application (2017-2022)
Table 50. Global IC Packaging Substrate Sales Share by Application (2023-2028)
Table 51. Global IC Packaging Substrate Revenue by Application (2017-2022) & (US$ Million)
Table 52. Global IC Packaging Substrate Revenue by Application (2023-2028) & (US$ Million)
Table 53. Global IC Packaging Substrate Revenue Share by Application (2017-2022)
Table 54. Global IC Packaging Substrate Revenue Share by Application (2023-2028)
Table 55. IC Packaging Substrate Price by Application (2017-2022) & (US$/Sqm)
Table 56. Global IC Packaging Substrate Price Forecast by Application (2023-2028) & (US$/Sqm)
Table 57. North America IC Packaging Substrate Sales by Type (2017-2022) & (K Sqm)
Table 58. North America IC Packaging Substrate Sales by Type (2023-2028) & (K Sqm)
Table 59. North America IC Packaging Substrate Revenue by Type (2017-2022) & (US$ Million)
Table 60. North America IC Packaging Substrate Revenue by Type (2023-2028) & (US$ Million)
Table 61. North America IC Packaging Substrate Sales by Application (2017-2022) & (K Sqm)
Table 62. North America IC Packaging Substrate Sales by Application (2023-2028) & (K Sqm)
Table 63. North America IC Packaging Substrate Revenue by Application (2017-2022) & (US$ Million)
Table 64. North America IC Packaging Substrate Revenue by Application (2023-2028) & (US$ Million)
Table 65. North America IC Packaging Substrate Sales by Country (2017-2022) & (K Sqm)
Table 66. North America IC Packaging Substrate Sales by Country (2023-2028) & (K Sqm)
Table 67. North America IC Packaging Substrate Revenue by Country (2017-2022) & (US$ Million)
Table 68. North America IC Packaging Substrate Revenue by Country (2023-2028) & (US$ Million)
Table 69. Europe IC Packaging Substrate Sales by Type (2017-2022) & (K Sqm)
Table 70. Europe IC Packaging Substrate Sales by Type (2023-2028) & (K Sqm)
Table 71. Europe IC Packaging Substrate Revenue by Type (2017-2022) & (US$ Million)
Table 72. Europe IC Packaging Substrate Revenue by Type (2023-2028) & (US$ Million)
Table 73. Europe IC Packaging Substrate Sales by Application (2017-2022) & (K Sqm)
Table 74. Europe IC Packaging Substrate Sales by Application (2023-2028) & (K Sqm)
Table 75. Europe IC Packaging Substrate Revenue by Application (2017-2022) & (US$ Million)
Table 76. Europe IC Packaging Substrate Revenue by Application (2023-2028) & (US$ Million)
Table 77. Europe IC Packaging Substrate Sales by Country (2017-2022) & (K Sqm)
Table 78. Europe IC Packaging Substrate Sales by Country (2023-2028) & (K Sqm)
Table 79. Europe IC Packaging Substrate Revenue by Country (2017-2022) & (US$ Million)
Table 80. Europe IC Packaging Substrate Revenue by Country (2023-2028) & (US$ Million)
Table 81. Asia Pacific IC Packaging Substrate Sales by Type (2017-2022) & (K Sqm)
Table 82. Asia Pacific IC Packaging Substrate Sales by Type (2023-2028) & (K Sqm)
Table 83. Asia Pacific IC Packaging Substrate Revenue by Type (2017-2022) & (US$ Million)
Table 84. Asia Pacific IC Packaging Substrate Revenue by Type (2023-2028) & (US$ Million)
Table 85. Asia Pacific IC Packaging Substrate Sales by Application (2017-2022) & (K Sqm)
Table 86. Asia Pacific IC Packaging Substrate Sales by Application (2023-2028) & (K Sqm)
Table 87. Asia Pacific IC Packaging Substrate Revenue by Application (2017-2022) & (US$ Million)
Table 88. Asia Pacific IC Packaging Substrate Revenue by Application (2023-2028) & (US$ Million)
Table 89. Asia Pacific IC Packaging Substrate Sales by Region (2017-2022) & (K Sqm)
Table 90. Asia Pacific IC Packaging Substrate Sales by Region (2023-2028) & (K Sqm)
Table 91. Asia Pacific IC Packaging Substrate Revenue by Region (2017-2022) & (US$ Million)
Table 92. Asia Pacific IC Packaging Substrate Revenue by Region (2023-2028) & (US$ Million)
Table 93. Latin America IC Packaging Substrate Sales by Type (2017-2022) & (K Sqm)
Table 94. Latin America IC Packaging Substrate Sales by Type (2023-2028) & (K Sqm)
Table 95. Latin America IC Packaging Substrate Revenue by Type (2017-2022) & (US$ Million)
Table 96. Latin America IC Packaging Substrate Revenue by Type (2023-2028) & (US$ Million)
Table 97. Latin America IC Packaging Substrate Sales by Application (2017-2022) & (K Sqm)
Table 98. Latin America IC Packaging Substrate Sales by Application (2023-2028) & (K Sqm)
Table 99. Latin America IC Packaging Substrate Revenue by Application (2017-2022) & (US$ Million)
Table 100. Latin America IC Packaging Substrate Revenue by Application (2023-2028) & (US$ Million)
Table 101. Latin America IC Packaging Substrate Sales by Country (2017-2022) & (K Sqm)
Table 102. Latin America IC Packaging Substrate Sales by Country (2023-2028) & (K Sqm)
Table 103. Latin America IC Packaging Substrate Revenue by Country (2017-2022) & (US$ Million)
Table 104. Latin America IC Packaging Substrate Revenue by Country (2023-2028) & (US$ Million)
Table 105. Middle East and Africa IC Packaging Substrate Sales by Type (2017-2022) & (K Sqm)
Table 106. Middle East and Africa IC Packaging Substrate Sales by Type (2023-2028) & (K Sqm)
Table 107. Middle East and Africa IC Packaging Substrate Revenue by Type (2017-2022) & (US$ Million)
Table 108. Middle East and Africa IC Packaging Substrate Revenue by Type (2023-2028) & (US$ Million)
Table 109. Middle East and Africa IC Packaging Substrate Sales by Application (2017-2022) & (K Sqm)
Table 110. Middle East and Africa IC Packaging Substrate Sales by Application (2023-2028) & (K Sqm)
Table 111. Middle East and Africa IC Packaging Substrate Revenue by Application (2017-2022) & (US$ Million)
Table 112. Middle East and Africa IC Packaging Substrate Revenue by Application (2023-2028) & (US$ Million)
Table 113. Middle East and Africa IC Packaging Substrate Sales by Country (2017-2022) & (K Sqm)
Table 114. Middle East and Africa IC Packaging Substrate Sales by Country (2023-2028) & (K Sqm)
Table 115. Middle East and Africa IC Packaging Substrate Revenue by Country (2017-2022) & (US$ Million)
Table 116. Middle East and Africa IC Packaging Substrate Revenue by Country (2023-2028) & (US$ Million)
Table 117. Ibiden Corporation Information
Table 118. Ibiden Description and Major Businesses
Table 119. Ibiden IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 120. Ibiden IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 121. Ibiden Recent Development
Table 122. Kinsus Interconnect Technology Corporation Information
Table 123. Kinsus Interconnect Technology Description and Major Businesses
Table 124. Kinsus Interconnect Technology IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 125. Kinsus Interconnect Technology IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 126. Kinsus Interconnect Technology Recent Development
Table 127. Unimicron Corporation Information
Table 128. Unimicron Description and Major Businesses
Table 129. Unimicron IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 130. Unimicron IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 131. Unimicron Recent Development
Table 132. Shinko Electric Industries Corporation Information
Table 133. Shinko Electric Industries Description and Major Businesses
Table 134. Shinko Electric Industries IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 135. Shinko Electric Industries IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 136. Shinko Electric Industries Recent Development
Table 137. Semco Corporation Information
Table 138. Semco Description and Major Businesses
Table 139. Semco IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 140. Semco IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 141. Semco Recent Development
Table 142. Simmtech Corporation Information
Table 143. Simmtech Description and Major Businesses
Table 144. Simmtech IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 145. Simmtech IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 146. Simmtech Recent Development
Table 147. Nanya Corporation Information
Table 148. Nanya Description and Major Businesses
Table 149. Nanya IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 150. Nanya IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 151. Nanya Recent Development
Table 152. Kyocera Corporation Information
Table 153. Kyocera Description and Major Businesses
Table 154. Kyocera IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 155. Kyocera IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 156. Kyocera Recent Development
Table 157. LG Innotek Corporation Information
Table 158. LG Innotek Description and Major Businesses
Table 159. LG Innotek IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 160. LG Innotek IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 161. LG Innotek Recent Development
Table 162. AT&S Corporation Information
Table 163. AT&S Description and Major Businesses
Table 164. AT&S IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 165. AT&S IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 166. AT&S Recent Development
Table 167. ASE Corporation Information
Table 168. ASE Description and Major Businesses
Table 169. ASE IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 170. ASE IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 171. ASE Recent Development
Table 172. Daeduck Corporation Information
Table 173. Daeduck Description and Major Businesses
Table 174. Daeduck IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 175. Daeduck IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 176. Daeduck Recent Development
Table 177. Shennan Circuit Corporation Information
Table 178. Shennan Circuit Description and Major Businesses
Table 179. Shennan Circuit IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 180. Shennan Circuit IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 181. Shennan Circuit Recent Development
Table 182. Zhen Ding Technology Corporation Information
Table 183. Zhen Ding Technology Description and Major Businesses
Table 184. Zhen Ding Technology IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 185. Zhen Ding Technology IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 186. Zhen Ding Technology Recent Development
Table 187. KCC (Korea Circuit Company) Corporation Information
Table 188. KCC (Korea Circuit Company) Description and Major Businesses
Table 189. KCC (Korea Circuit Company) IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 190. KCC (Korea Circuit Company) IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 191. KCC (Korea Circuit Company) Recent Development
Table 192. ACCESS Corporation Information
Table 193. ACCESS Description and Major Businesses
Table 194. ACCESS IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 195. ACCESS IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 196. ACCESS Recent Development
Table 197. Shenzhen Fastprint Circuit Tech Corporation Information
Table 198. Shenzhen Fastprint Circuit Tech Description and Major Businesses
Table 199. Shenzhen Fastprint Circuit Tech IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 200. Shenzhen Fastprint Circuit Tech IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 201. Shenzhen Fastprint Circuit Tech Recent Development
Table 202. AKM Meadville Corporation Information
Table 203. AKM Meadville Description and Major Businesses
Table 204. AKM Meadville IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 205. AKM Meadville IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 206. AKM Meadville Recent Development
Table 207. Toppan Printing Corporation Information
Table 208. Toppan Printing Description and Major Businesses
Table 209. Toppan Printing IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2017-2022)
Table 210. Toppan Printing IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
Table 211. Toppan Printing Recent Development
Table 212. Key Raw Materials Lists
Table 213. Raw Materials Key Suppliers Lists
Table 214. IC Packaging Substrate Distributors List
Table 215. IC Packaging Substrate Customers List
Table 216. IC Packaging Substrate Market Trends
Table 217. IC Packaging Substrate Market Drivers
Table 218. IC Packaging Substrate Market Challenges
Table 219. IC Packaging Substrate Market Restraints
Table 220. Research Programs/Design for This Report
Table 221. Key Data Information from Secondary Sources
Table 222. Key Data Information from Primary Sources
List of Figures
Figure 1. IC Packaging Substrate Product Picture
Figure 2. Global IC Packaging Substrate Market Share by Type in 2021 & 2028
Figure 3. WB CSP Product Picture
Figure 4. FC BGA Product Picture
Figure 5. FC CSP Product Picture
Figure 6. PBGA Product Picture
Figure 7. SiP Product Picture
Figure 8. BOC Product Picture
Figure 9. Other Product Picture
Figure 10. Global IC Packaging Substrate Market Share by Application in 2021 & 2028
Figure 11. Smart Phones
Figure 12. PC (Tablet, Laptop)
Figure 13. Wearable Devices
Figure 14. Others
Figure 15. IC Packaging Substrate Report Years Considered
Figure 16. Global IC Packaging Substrate Capacity, Production and Utilization (2017-2028) & (K Sqm)
Figure 17. Global IC Packaging Substrate Production Market Share by Region in Percentage: 2021 Versus 2028
Figure 18. Global IC Packaging Substrate Production Market Share by Region (2017-2022)
Figure 19. Global IC Packaging Substrate Production Market Share by Region (2023-2028)
Figure 20. IC Packaging Substrate Production Growth Rate in North America (2017-2028) & (K Sqm)
Figure 21. IC Packaging Substrate Production Growth Rate in Europe (2017-2028) & (K Sqm)
Figure 22. IC Packaging Substrate Production Growth Rate in China (2017-2028) & (K Sqm)
Figure 23. IC Packaging Substrate Production Growth Rate in Japan (2017-2028) & (K Sqm)
Figure 24. IC Packaging Substrate Production Growth Rate in South Korea (2017-2028) & (K Sqm)
Figure 25. Global IC Packaging Substrate Sales 2017-2028 (K Sqm)
Figure 26. Global IC Packaging Substrate Revenue, (US$ Million), 2017 VS 2021 VS 2028
Figure 27. Global IC Packaging Substrate Revenue 2017-2028 (US$ Million)
Figure 28. Global IC Packaging Substrate Revenue Market Share by Region in Percentage: 2021 Versus 2028
Figure 29. Global IC Packaging Substrate Sales Market Share by Region (2017-2022)
Figure 30. Global IC Packaging Substrate Sales Market Share by Region (2023-2028)
Figure 31. North America IC Packaging Substrate Sales YoY (2017-2028) & (K Sqm)
Figure 32. North America IC Packaging Substrate Revenue YoY (2017-2028) & (US$ Million)
Figure 33. Europe IC Packaging Substrate Sales YoY (2017-2028) & (K Sqm)
Figure 34. Europe IC Packaging Substrate Revenue YoY (2017-2028) & (US$ Million)
Figure 35. Asia-Pacific IC Packaging Substrate Sales YoY (2017-2028) & (K Sqm)
Figure 36. Asia-Pacific IC Packaging Substrate Revenue YoY (2017-2028) & (US$ Million)
Figure 37. Latin America IC Packaging Substrate Sales YoY (2017-2028) & (K Sqm)
Figure 38. Latin America IC Packaging Substrate Revenue YoY (2017-2028) & (US$ Million)
Figure 39. Middle East & Africa IC Packaging Substrate Sales YoY (2017-2028) & (K Sqm)
Figure 40. Middle East & Africa IC Packaging Substrate Revenue YoY (2017-2028) & (US$ Million)
Figure 41. The IC Packaging Substrate Market Share of Top 10 and Top 5 Largest Manufacturers Around the World in 2021
Figure 42. The Top 5 and 10 Largest Manufacturers of IC Packaging Substrate in the World: Market Share by IC Packaging Substrate Revenue in 2021
Figure 43. IC Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2017 VS 2021
Figure 44. Global IC Packaging Substrate Sales Market Share by Type (2017-2028)
Figure 45. Global IC Packaging Substrate Revenue Market Share by Type (2017-2028)
Figure 46. Global IC Packaging Substrate Sales Market Share by Application (2017-2028)
Figure 47. Global IC Packaging Substrate Revenue Market Share by Application (2017-2028)
Figure 48. North America IC Packaging Substrate Sales Market Share by Type (2017-2028)
Figure 49. North America IC Packaging Substrate Revenue Market Share by Type (2017-2028)
Figure 50. North America IC Packaging Substrate Sales Market Share by Application (2017-2028)
Figure 51. North America IC Packaging Substrate Revenue Market Share by Application (2017-2028)
Figure 52. North America IC Packaging Substrate Sales Share by Country (2017-2028)
Figure 53. North America IC Packaging Substrate Revenue Share by Country (2017-2028)
Figure 54. United States IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 55. Canada IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 56. Europe IC Packaging Substrate Sales Market Share by Type (2017-2028)
Figure 57. Europe IC Packaging Substrate Revenue Market Share by Type (2017-2028)
Figure 58. Europe IC Packaging Substrate Sales Market Share by Application (2017-2028)
Figure 59. Europe IC Packaging Substrate Revenue Market Share by Application (2017-2028)
Figure 60. Europe IC Packaging Substrate Sales Share by Country (2017-2028)
Figure 61. Europe IC Packaging Substrate Revenue Share by Country (2017-2028)
Figure 62. Germany IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 63. France IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 64. U.K. IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 65. Italy IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 66. Russia IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 67. Asia Pacific IC Packaging Substrate Sales Market Share by Type (2017-2028)
Figure 68. Asia Pacific IC Packaging Substrate Revenue Market Share by Type (2017-2028)
Figure 69. Asia Pacific IC Packaging Substrate Sales Market Share by Application (2017-2028)
Figure 70. Asia Pacific IC Packaging Substrate Revenue Market Share by Application (2017-2028)
Figure 71. Asia Pacific IC Packaging Substrate Sales Share by Region (2017-2028)
Figure 72. Asia Pacific IC Packaging Substrate Revenue Share by Region (2017-2028)
Figure 73. China IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 74. Japan IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 75. South Korea IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 76. India IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 77. Australia IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 78. China Taiwan IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 79. Indonesia IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 80. Thailand IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 81. Malaysia IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 82. Latin America IC Packaging Substrate Sales Market Share by Type (2017-2028)
Figure 83. Latin America IC Packaging Substrate Revenue Market Share by Type (2017-2028)
Figure 84. Latin America IC Packaging Substrate Sales Market Share by Application (2017-2028)
Figure 85. Latin America IC Packaging Substrate Revenue Market Share by Application (2017-2028)
Figure 86. Latin America IC Packaging Substrate Sales Share by Country (2017-2028)
Figure 87. Latin America IC Packaging Substrate Revenue Share by Country (2017-2028)
Figure 88. Mexico IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 89. Brazil IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 90. Argentina IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 91. Colombia IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 92. Middle East and Africa IC Packaging Substrate Sales Market Share by Type (2017-2028)
Figure 93. Middle East and Africa IC Packaging Substrate Revenue Market Share by Type (2017-2028)
Figure 94. Middle East and Africa IC Packaging Substrate Sales Market Share by Application (2017-2028)
Figure 95. Middle East and Africa IC Packaging Substrate Revenue Market Share by Application (2017-2028)
Figure 96. Middle East and Africa IC Packaging Substrate Sales Share by Country (2017-2028)
Figure 97. Middle East and Africa IC Packaging Substrate Revenue Share by Country (2017-2028)
Figure 98. Turkey IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 99. Saudi Arabia IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 100. UAE IC Packaging Substrate Revenue (2017-2028) & (US$ Million)
Figure 101. IC Packaging Substrate Value Chain
Figure 102. IC Packaging Substrate Production Process
Figure 103. Channels of Distribution
Figure 104. Distributors Profiles
Figure 105. Bottom-up and Top-down Approaches for This Report
Figure 106. Data Triangulation
Figure 107. Key Executives Interviewed