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レポート概要
| グローバル調査会社のIMARC社は、2022年371億ドルであった世界の先進パッケージング市場規模が2028年には747億ドルに達し、予測期間中（2023年-2028年）、年平均11.2％成長すると予測しています。当調査資料では、先進パッケージングの世界市場を調査・分析し、序論、範囲・調査手法、エグゼクティブサマリー、イントロダクション、種類別（フリップチップ型ボールグリッドアレイ、フリップチップCSP、ウェハーレベルCSP、5D/3D、その他）分析、エンドユーザー別（家電、自動車、工業、医療、その他）分析、地域別（北米、アジア、欧州、中南米、中東/アフリカ）分析、SWOT分析（強み・弱み・機会・脅威）、バリューチェーン分析、ファイブフォース分析、価格分析、競争状況などの項目を掲載しています。なお、当市場の主要企業には、Advanced Semiconductor Engineering Inc.、Amkor Technology Inc.、Analog Devices Inc.、Brewer Science、ChipMOS Technologies Inc.、Microchip Technology Inc.、Powertech Technology Inc.、Samsung Electronics Co. Ltd、SÜSS MicroTec SE、Taiwan Semiconductor Manufacturing Company Limited、Texas Instruments Incorporated and Universal Instruments Corporation (CBA Group Inc.)などが含まれています。 ・序論 ・範囲・調査手法 ・エグゼクティブサマリー ・イントロダクション ・世界の先進パッケージング市場規模：種類別 - フリップチップ型ボールグリッドアレイ先進パッケージングの市場規模 - フリップチップCSP先進パッケージングの市場規模 - ウェハーレベルCSP先進パッケージングの市場規模 - 5D/3D先進パッケージングの市場規模 - その他種類の市場規模 ・世界の先進パッケージング市場規模：エンドユーザー別 - 家電における市場規模 - 自動車における市場規模 - 工業における市場規模 - 医療における市場規模 - その他エンドユーザーにおける市場規模 ・世界の先進パッケージング市場規模：地域別 - 北米の先進パッケージング市場規模 - アジアの先進パッケージング市場規模 - 欧州の先進パッケージング市場規模 - 中南米の先進パッケージング市場規模 - 中東/アフリカの先進パッケージング市場規模 ・SWOT分析（強み・弱み・機会・脅威） ・バリューチェーン分析 ・ファイブフォース分析 ・価格分析 ・競争状況 |
The global advanced packaging market size reached US$ 37.1 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 74.7 Billion by 2028, exhibiting a growth rate (CAGR) of 11.2% during 2023-2028.
Advanced packaging is the interconnection and aggregation of components that encloses metallic parts and various devices, including wafers, logic units, and memory, to protect them from physical damage and corrosion during the final procedure of semiconductor manufacturing. It encompasses 2.5D, 3D-IC, system-in, and fan-out-wafer-level-package as a combination of different techniques. These packaging methods are implemented after determining multiple parameters, such as power consumption, operating conditions, measurable size, and costs. Advanced packaging increases the functionality of various electronic devices, ensures lower power consumption, provides better chip connectivity, and shields silicon chips from mechanical stresses or vibrations. As a result, it is extensively used in various electronic gadgets and devices.
Advanced Packaging Market Trends:
The global advanced packaging market is primarily driven by the rapid expansion in the electronics sector, along with the increasing demand for various consumer electronics, including wearables, desktops, smartphones, laptops, and miniaturized devices. In line with this, manufacturers are extensively utilizing advanced packaging to accomplish delicate patterning in wafers by reducing integrated circuit (IC) sizes in the semiconductor, which is acting as another growth-inducing factor. Furthermore, the widespread adoption of nano-sized robotic surgery equipment and sophisticated wearable devices has encouraged leading companies to rely on advanced packaging techniques over conventional procedures to promote system optimization, which is contributing to the market growth. Additionally, the inclination toward fan-out wafer-level packaging, owing to its several benefits, including superior thermal performance, increased wafer-level yield, easier packaging system, and the acceptance of three-dimensional (3D) circuits, is impelling the market growth. Apart from this, strategic collaborations amongst key players to enhance product efficacy and the large-scale usage of artificial intelligence (AI), deep learning, and machine learning (ML) to combine processing elements and memories through high-speed interconnect are supporting the market growth.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global advanced packaging market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on type and end use.
Breakup by Type:
Flip-Chip Ball Grid Array
Flip Chip CSP
Wafer Level CSP
5D/3D
Fan Out WLP
Others
Breakup by End Use:
Consumer Electronics
Automotive
Industrial
Healthcare
Aerospace and Defense
Others
Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Analog Devices Inc., Brewer Science, ChipMOS Technologies Inc., Microchip Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd, SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and Universal Instruments Corporation (CBA Group Inc.).
Key Questions Answered in This Report
1. What was the size of the global advanced packaging market in 2022?
2. What is the expected growth rate of the global advanced packaging market during 2023-2028?
3. What has been the impact of COVID-19 on the global advanced packaging market?
4. What are the key factors driving the global advanced packaging market?
5. What is the breakup of the global advanced packaging market based on the type?
6. What is the breakup of the global advanced packaging market based on the end use?
7. What are the key regions in the global advanced packaging market?
8. Who are the key players/companies in the global advanced packaging market?
1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Advanced Packaging Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Type
6.1 Flip-Chip Ball Grid Array
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 Flip Chip CSP
6.2.1 Market Trends
6.2.2 Market Forecast
6.3 Wafer Level CSP
6.3.1 Market Trends
6.3.2 Market Forecast
6.4 5D/3D
6.4.1 Market Trends
6.4.2 Market Forecast
6.5 Fan Out WLP
6.5.1 Market Trends
6.5.2 Market Forecast
6.6 Others
6.6.1 Market Trends
6.6.2 Market Forecast
7 Market Breakup by End Use
7.1 Consumer Electronics
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Automotive
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 Industrial
7.3.1 Market Trends
7.3.2 Market Forecast
7.4 Healthcare
7.4.1 Market Trends
7.4.2 Market Forecast
7.5 Aerospace and Defense
7.5.1 Market Trends
7.5.2 Market Forecast
7.6 Others
7.6.1 Market Trends
7.6.2 Market Forecast
8 Market Breakup by Region
8.1 North America
8.1.1 United States
8.1.1.1 Market Trends
8.1.1.2 Market Forecast
8.1.2 Canada
8.1.2.1 Market Trends
8.1.2.2 Market Forecast
8.2 Asia-Pacific
8.2.1 China
8.2.1.1 Market Trends
8.2.1.2 Market Forecast
8.2.2 Japan
8.2.2.1 Market Trends
8.2.2.2 Market Forecast
8.2.3 India
8.2.3.1 Market Trends
8.2.3.2 Market Forecast
8.2.4 South Korea
8.2.4.1 Market Trends
8.2.4.2 Market Forecast
8.2.5 Australia
8.2.5.1 Market Trends
8.2.5.2 Market Forecast
8.2.6 Indonesia
8.2.6.1 Market Trends
8.2.6.2 Market Forecast
8.2.7 Others
8.2.7.1 Market Trends
8.2.7.2 Market Forecast
8.3 Europe
8.3.1 Germany
8.3.1.1 Market Trends
8.3.1.2 Market Forecast
8.3.2 France
8.3.2.1 Market Trends
8.3.2.2 Market Forecast
8.3.3 United Kingdom
8.3.3.1 Market Trends
8.3.3.2 Market Forecast
8.3.4 Italy
8.3.4.1 Market Trends
8.3.4.2 Market Forecast
8.3.5 Spain
8.3.5.1 Market Trends
8.3.5.2 Market Forecast
8.3.6 Russia
8.3.6.1 Market Trends
8.3.6.2 Market Forecast
8.3.7 Others
8.3.7.1 Market Trends
8.3.7.2 Market Forecast
8.4 Latin America
8.4.1 Brazil
8.4.1.1 Market Trends
8.4.1.2 Market Forecast
8.4.2 Mexico
8.4.2.1 Market Trends
8.4.2.2 Market Forecast
8.4.3 Others
8.4.3.1 Market Trends
8.4.3.2 Market Forecast
8.5 Middle East and Africa
8.5.1 Market Trends
8.5.2 Market Breakup by Country
8.5.3 Market Forecast
9 SWOT Analysis
9.1 Overview
9.2 Strengths
9.3 Weaknesses
9.4 Opportunities
9.5 Threats
10 Value Chain Analysis
11 Porters Five Forces Analysis
11.1 Overview
11.2 Bargaining Power of Buyers
11.3 Bargaining Power of Suppliers
11.4 Degree of Competition
11.5 Threat of New Entrants
11.6 Threat of Substitutes
12 Price Analysis
13 Competitive Landscape
13.1 Market Structure
13.2 Key Players
13.3 Profiles of Key Players
13.3.1 Advanced Semiconductor Engineering Inc.
13.3.1.1 Company Overview
13.3.1.2 Product Portfolio
13.3.2 Amkor Technology Inc.
13.3.2.1 Company Overview
13.3.2.2 Product Portfolio
13.3.2.3 Financials
13.3.2.4 SWOT Analysis
13.3.3 Analog Devices Inc.
13.3.3.1 Company Overview
13.3.3.2 Product Portfolio
13.3.3.3 Financials
13.3.3.4 SWOT Analysis
13.3.4 Brewer Science
13.3.4.1 Company Overview
13.3.4.2 Product Portfolio
13.3.5 ChipMOS Technologies Inc.
13.3.5.1 Company Overview
13.3.5.2 Product Portfolio
13.3.5.3 Financials
13.3.6 Microchip Technology Inc.
13.3.6.1 Company Overview
13.3.6.2 Product Portfolio
13.3.6.3 Financials
13.3.6.4 SWOT Analysis
13.3.7 Powertech Technology Inc.
13.3.7.1 Company Overview
13.3.7.2 Product Portfolio
13.3.7.3 Financials
13.3.7.4 SWOT Analysis
13.3.8 Samsung Electronics Co. Ltd
13.3.8.1 Company Overview
13.3.8.2 Product Portfolio
13.3.8.3 Financials
13.3.8.4 SWOT Analysis
13.3.9 SÜSS MicroTec SE
13.3.9.1 Company Overview
13.3.9.2 Product Portfolio
13.3.9.3 Financials
13.3.10 Taiwan Semiconductor Manufacturing Company Limited
13.3.10.1 Company Overview
13.3.10.2 Product Portfolio
13.3.10.3 Financials
13.3.10.4 SWOT Analysis
13.3.11 Texas Instruments Incorporated
13.3.11.1 Company Overview
13.3.11.2 Product Portfolio
13.3.11.3 Financials
13.3.11.4 SWOT Analysis
13.3.12 Universal Instruments Corporation (CBA Group Inc.)
13.3.12.1 Company Overview
13.3.12.2 Product Portfolio
Figure 2: Global: Advanced Packaging Market: Sales Value (in Billion US$), 2017-2022
Figure 3: Global: Advanced Packaging Market Forecast: Sales Value (in Billion US$), 2023-2028
Figure 4: Global: Advanced Packaging Market: Breakup by Type (in %), 2022
Figure 5: Global: Advanced Packaging Market: Breakup by End Use (in %), 2022
Figure 6: Global: Advanced Packaging Market: Breakup by Region (in %), 2022
Figure 7: Global: Advanced Packaging (Flip-Chip Ball Grid Array) Market: Sales Value (in Million US$), 2017 & 2022
Figure 8: Global: Advanced Packaging (Flip-Chip Ball Grid Array) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 9: Global: Advanced Packaging (Flip Chip CSP) Market: Sales Value (in Million US$), 2017 & 2022
Figure 10: Global: Advanced Packaging (Flip Chip CSP) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 11: Global: Advanced Packaging (Wafer Level CSP) Market: Sales Value (in Million US$), 2017 & 2022
Figure 12: Global: Advanced Packaging (Wafer Level CSP) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 13: Global: Advanced Packaging (5D/3D) Market: Sales Value (in Million US$), 2017 & 2022
Figure 14: Global: Advanced Packaging (5D/3D) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 15: Global: Advanced Packaging (Fan Out WLP) Market: Sales Value (in Million US$), 2017 & 2022
Figure 16: Global: Advanced Packaging (Fan Out WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 17: Global: Advanced Packaging (Other Types) Market: Sales Value (in Million US$), 2017 & 2022
Figure 18: Global: Advanced Packaging (Other Types) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 19: Global: Advanced Packaging (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
Figure 20: Global: Advanced Packaging (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 21: Global: Advanced Packaging (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
Figure 22: Global: Advanced Packaging (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 23: Global: Advanced Packaging (Industrial) Market: Sales Value (in Million US$), 2017 & 2022
Figure 24: Global: Advanced Packaging (Industrial) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 25: Global: Advanced Packaging (Healthcare) Market: Sales Value (in Million US$), 2017 & 2022
Figure 26: Global: Advanced Packaging (Healthcare) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 27: Global: Advanced Packaging (Aerospace and Defense) Market: Sales Value (in Million US$), 2017 & 2022
Figure 28: Global: Advanced Packaging (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 29: Global: Advanced Packaging (Other End Uses) Market: Sales Value (in Million US$), 2017 & 2022
Figure 30: Global: Advanced Packaging (Other End Uses) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 31: North America: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 32: North America: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 33: United States: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 34: United States: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 35: Canada: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 36: Canada: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 37: Asia-Pacific: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 38: Asia-Pacific: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 39: China: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 40: China: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 41: Japan: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 42: Japan: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 43: India: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 44: India: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 45: South Korea: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 46: South Korea: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 47: Australia: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 48: Australia: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 49: Indonesia: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 50: Indonesia: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 51: Others: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 52: Others: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 53: Europe: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 54: Europe: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 55: Germany: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 56: Germany: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 57: France: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 58: France: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 59: United Kingdom: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 60: United Kingdom: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 61: Italy: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 62: Italy: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 63: Spain: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 64: Spain: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 65: Russia: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 66: Russia: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 67: Others: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 68: Others: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 69: Latin America: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 70: Latin America: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 71: Brazil: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 72: Brazil: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 73: Mexico: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 74: Mexico: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 75: Others: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 76: Others: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 77: Middle East and Africa: Advanced Packaging Market: Sales Value (in Million US$), 2017 & 2022
Figure 78: Middle East and Africa: Advanced Packaging Market: Breakup by Country (in %), 2022
Figure 79: Middle East and Africa: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 80: Global: Advanced Packaging Industry: SWOT Analysis
Figure 81: Global: Advanced Packaging Industry: Value Chain Analysis
Figure 82: Global: Advanced Packaging Industry: Porter's Five Forces Analysis
