 | • レポートコード：MRC-IM31110 • 出版社/出版日：IMARC / 2023年3月 • レポート形態：英文、PDF、142ページ • 納品方法：Eメール • 産業分類：電子 |
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レポート概要
| IMARC社の本調査レポートでは、2022年に82億ドルであった世界の高密度相互接続（HDI）PCB市場規模が、2028年までに115億ドルに拡大し、予測期間中にCAGR5.5%で成長すると予想しています。本書は、高密度相互接続（HDI）PCBの世界市場を調査・分析し、序論、範囲・調査手法、エグゼクティブサマリー、イントロダクション、HDI層数別（4～6層HDI PCB、8～10層HDI PCB、10層以上HDI PCB）分析、産業別（スマートフォン・タブレット、コンピュータ、通信/データコム、家電、その他）分析、地域別（北米、アジア、欧州、中南米、中東・アフリカ）分析、SWOT分析（強み・弱み・機会・脅威）、バリューチェーン分析、ポーターズファイブフォース分析、価格分析、競争状況などの項目を整理しています。また、本書には、AT & S Austria Technologie & Systemtechnik Aktiengesellschaft、Bittele Electronics Inc.、Fineline Ltd.、Meiko Electronics Co. Ltd.、Millennium Circuits Limited、Mistral Solutions Pvt. Ltd.、Shenzhen Kinwong Electronic Co. Ltd.、Sierra Circuits、TTM Technologies Inc.、Unimicron Technology Corporation (United Microelectronics Corporation)、Unitech Printed Circuit Board Corp. and Würth Elektronik GmbH & Co. KGなどの企業情報が含まれています。 ・序論 ・範囲・調査手法 ・エグゼクティブサマリー ・イントロダクション ・世界の高密度相互接続（HDI）PCB市場規模：HDI層数別 - 4～6層HDI PCBの市場規模 - 8～10層HDI PCBの市場規模 - 10層以上HDI PCBの市場規模 ・世界の高密度相互接続（HDI）PCB市場規模：産業別 - スマートフォン・タブレットにおける市場規模 - コンピュータにおける市場規模 - 通信/データコムにおける市場規模 - 家電における市場規模 - その他における市場規模 ・世界の高密度相互接続（HDI）PCB市場規模：地域別 - 北米の高密度相互接続（HDI）PCB市場規模 - アジアの高密度相互接続（HDI）PCB市場規模 - 欧州の高密度相互接続（HDI）PCB市場規模 - 中南米の高密度相互接続（HDI）PCB市場規模 - 中東・アフリカの高密度相互接続（HDI）PCB市場規模 ・SWOT分析（強み・弱み・機会・脅威） ・バリューチェーン分析 ・ポーターズファイブフォース分析 ・価格分析 ・競争状況 |
Market Overview:
The global high-density interconnect (HDI) PCB market size reached US$ 8.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 11.5 Billion by 2028, exhibiting a growth rate (CAGR) of 5.5% during 2023-2028.
Interconnecting printed circuit boards (PCBs) with high-density interconnects (HDIs) are circuit boards having a better wiring density per unit than conventional circuit boards. With blind and buried vias, it contains micro-vias that are smaller in diameter and have a relatively greater pad density than conventional circuit boards while having a higher circuitry density than traditional counterparts. High-density PCB technology has allowed engineers an enhanced design freedom and flexibility, thus allowing them to place smaller and closer components, which reduces signal loss and crossing delays. An interconnect PCB with high density gives designers more surface area to work with. As a result, high-density interconnect PCBs deliver better signal quality and faster signal transmission.
High-Density Interconnect (HDI) PCB Market Trends:
The global market is primarily driven by the escalating product demand in numerous end-use industries, including telecommunication, consumer electronics, and automotive. This can be attributed to the rapid product utilization in various electronic devices like touch-screen devices, mobile phones, laptop computers, and digital cameras. In addition to this, the rising trend of electronic device miniaturization and the increasing demand for high-performance gadgets are also providing an impetus to the market. Besides this, the expanding medical expenditure resulting in a higher uptake of medical devices and equipment is also creating a positive outlook for the market. Furthermore, the augmenting production rates of electronic aircraft parts and components are acting as a significant growth-inducing factor for the market. Some of the other factors contributing to the market growth include the widespread adoption of sophisticated safety systems, the rising trend of autonomous driving, escalating sales of smart devices and gaming consoles, inflating disposable income levels and extensive research and development (R&D) activities.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global high-density interconnect (HDI) PCB market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on number of HDI layer and end use industry.
Breakup by Number of HDI Layer:
4-6 Layers HDI PCBs
8-10 Layer HDI PCBs
10+ Layer HDI PCBs
Breakup by End Use Industry:
Smartphones and Tablets
Computers
Telecom/Datacom
Consumer Electronics
Automotive
Others
Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Würth Elektronik GmbH & Co. KG.
Key Questions Answered in This Report:
How has the global high-density interconnect (HDI) PCB market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the global high-density interconnect (HDI) PCB market?
What are the key regional markets?
What is the breakup of the market based on the number of HDI layer?
What is the breakup of the market based on the end use industry?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the global high-density interconnect (HDI) PCB market and who are the key players?
What is the degree of competition in the industry?
1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global High-Density Interconnect (HDI) PCB Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Number of HDI Layer
6.1 4-6 Layers HDI PCBs
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 8-10 Layer HDI PCBs
6.2.1 Market Trends
6.2.2 Market Forecast
6.3 10+ Layer HDI PCBs
6.3.1 Market Trends
6.3.2 Market Forecast
7 Market Breakup by End Use Industry
7.1 Smartphones and Tablets
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Computers
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 Telecom/Datacom
7.3.1 Market Trends
7.3.2 Market Forecast
7.4 Consumer Electronics
7.4.1 Market Trends
7.4.2 Market Forecast
7.5 Automotive
7.5.1 Market Trends
7.5.2 Market Forecast
7.6 Others
7.6.1 Market Trends
7.6.2 Market Forecast
8 Market Breakup by Region
8.1 North America
8.1.1 United States
8.1.1.1 Market Trends
8.1.1.2 Market Forecast
8.1.2 Canada
8.1.2.1 Market Trends
8.1.2.2 Market Forecast
8.2 Asia-Pacific
8.2.1 China
8.2.1.1 Market Trends
8.2.1.2 Market Forecast
8.2.2 Japan
8.2.2.1 Market Trends
8.2.2.2 Market Forecast
8.2.3 India
8.2.3.1 Market Trends
8.2.3.2 Market Forecast
8.2.4 South Korea
8.2.4.1 Market Trends
8.2.4.2 Market Forecast
8.2.5 Australia
8.2.5.1 Market Trends
8.2.5.2 Market Forecast
8.2.6 Indonesia
8.2.6.1 Market Trends
8.2.6.2 Market Forecast
8.2.7 Others
8.2.7.1 Market Trends
8.2.7.2 Market Forecast
8.3 Europe
8.3.1 Germany
8.3.1.1 Market Trends
8.3.1.2 Market Forecast
8.3.2 France
8.3.2.1 Market Trends
8.3.2.2 Market Forecast
8.3.3 United Kingdom
8.3.3.1 Market Trends
8.3.3.2 Market Forecast
8.3.4 Italy
8.3.4.1 Market Trends
8.3.4.2 Market Forecast
8.3.5 Spain
8.3.5.1 Market Trends
8.3.5.2 Market Forecast
8.3.6 Russia
8.3.6.1 Market Trends
8.3.6.2 Market Forecast
8.3.7 Others
8.3.7.1 Market Trends
8.3.7.2 Market Forecast
8.4 Latin America
8.4.1 Brazil
8.4.1.1 Market Trends
8.4.1.2 Market Forecast
8.4.2 Mexico
8.4.2.1 Market Trends
8.4.2.2 Market Forecast
8.4.3 Others
8.4.3.1 Market Trends
8.4.3.2 Market Forecast
8.5 Middle East and Africa
8.5.1 Market Trends
8.5.2 Market Breakup by Country
8.5.3 Market Forecast
9 SWOT Analysis
9.1 Overview
9.2 Strengths
9.3 Weaknesses
9.4 Opportunities
9.5 Threats
10 Value Chain Analysis
11 Porters Five Forces Analysis
11.1 Overview
11.2 Bargaining Power of Buyers
11.3 Bargaining Power of Suppliers
11.4 Degree of Competition
11.5 Threat of New Entrants
11.6 Threat of Substitutes
12 Price Analysis
13 Competitive Landscape
13.1 Market Structure
13.2 Key Players
13.3 Profiles of Key Players
13.3.1 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.3.1.1 Company Overview
13.3.1.2 Product Portfolio
13.3.1.3 Financials
13.3.2 Bittele Electronics Inc.
13.3.2.1 Company Overview
13.3.2.2 Product Portfolio
13.3.3 Fineline Ltd.
13.3.3.1 Company Overview
13.3.3.2 Product Portfolio
13.3.4 Meiko Electronics Co. Ltd.
13.3.4.1 Company Overview
13.3.4.2 Product Portfolio
13.3.4.3 Financials
13.3.5 Millennium Circuits Limited
13.3.5.1 Company Overview
13.3.5.2 Product Portfolio
13.3.6 Mistral Solutions Pvt. Ltd.
13.3.6.1 Company Overview
13.3.6.2 Product Portfolio
13.3.7 Shenzhen Kinwong Electronic Co. Ltd.
13.3.7.1 Company Overview
13.3.7.2 Product Portfolio
13.3.7.3 Financials
13.3.8 Sierra Circuits
13.3.8.1 Company Overview
13.3.8.2 Product Portfolio
13.3.9 TTM Technologies Inc.
13.3.9.1 Company Overview
13.3.9.2 Product Portfolio
13.3.9.3 Financials
13.3.9.4 SWOT Analysis
13.3.10 Unimicron Technology Corporation (United Microelectronics Corporation)
13.3.10.1 Company Overview
13.3.10.2 Product Portfolio
13.3.10.3 Financials
13.3.11 Unitech Printed Circuit Board Corp.
13.3.11.1 Company Overview
13.3.11.2 Product Portfolio
13.3.11.3 Financials
13.3.12 Würth Elektronik GmbH & Co. KG
13.3.12.1 Company Overview
13.3.12.2 Product Portfolio
Figure 2: Global: High-Density Interconnect PCB Market: Sales Value (in Billion US$), 2017-2022
Figure 3: Global: High-Density Interconnect PCB Market Forecast: Sales Value (in Billion US$), 2023-2028
Figure 4: Global: High-Density Interconnect PCB Market: Breakup by Number of HDI Layer (in %), 2022
Figure 5: Global: High-Density Interconnect PCB Market: Breakup by End Use Industry (in %), 2022
Figure 6: Global: High-Density Interconnect PCB Market: Breakup by Region (in %), 2022
Figure 7: Global: High-Density Interconnect PCB (4-6 Layers HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
Figure 8: Global: High-Density Interconnect PCB (4-6 Layers HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 9: Global: High-Density Interconnect PCB (8-10 Layer HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
Figure 10: Global: High-Density Interconnect PCB (8-10 Layer HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 11: Global: High-Density Interconnect PCB (10+ Layer HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
Figure 12: Global: High-Density Interconnect PCB (10+ Layer HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 13: Global: High-Density Interconnect PCB (Smartphones and Tablets) Market: Sales Value (in Million US$), 2017 & 2022
Figure 14: Global: High-Density Interconnect PCB (Smartphones and Tablets) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 15: Global: High-Density Interconnect PCB (Computers) Market: Sales Value (in Million US$), 2017 & 2022
Figure 16: Global: High-Density Interconnect PCB (Computers) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 17: Global: High-Density Interconnect PCB (Telecom/Datacom) Market: Sales Value (in Million US$), 2017 & 2022
Figure 18: Global: High-Density Interconnect PCB (Telecom/Datacom) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 19: Global: High-Density Interconnect PCB (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
Figure 20: Global: High-Density Interconnect PCB (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 21: Global: High-Density Interconnect PCB (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
Figure 22: Global: High-Density Interconnect PCB (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 23: Global: High-Density Interconnect PCB (Other End Use Industries) Market: Sales Value (in Million US$), 2017 & 2022
Figure 24: Global: High-Density Interconnect PCB (Other End Use Industries) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 25: North America: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 26: North America: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 27: United States: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 28: United States: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 29: Canada: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 30: Canada: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 31: Asia-Pacific: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 32: Asia-Pacific: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 33: China: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 34: China: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 35: Japan: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 36: Japan: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 37: India: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 38: India: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 39: South Korea: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 40: South Korea: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 41: Australia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 42: Australia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 43: Indonesia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 44: Indonesia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 45: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 46: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 47: Europe: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 48: Europe: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 49: Germany: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 50: Germany: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 51: France: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 52: France: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 53: United Kingdom: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 54: United Kingdom: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 55: Italy: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 56: Italy: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 57: Spain: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 58: Spain: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 59: Russia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 60: Russia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 61: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 62: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 63: Latin America: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 64: Latin America: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 65: Brazil: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 66: Brazil: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 67: Mexico: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 68: Mexico: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 69: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 70: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 71: Middle East and Africa: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
Figure 72: Middle East and Africa: High-Density Interconnect PCB Market: Breakup by Country (in %), 2022
Figure 73: Middle East and Africa: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 74: Global: High-Density Interconnect PCB Industry: SWOT Analysis
Figure 75: Global: High-Density Interconnect PCB Industry: Value Chain Analysis
Figure 76: Global: High-Density Interconnect PCB Industry: Porter's Five Forces Analysis