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レポート概要
| 360iResearch社発行の当調査レポートでは、2021年に248.3億ドルであった世界のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模が、2022年に279.8億ドルに達し、2027年には513億ドルまで年平均12.85％で成長すると予測しています。当レポートは、ファンアウト型ウェーハレベルパッケージング（FOWLP）の世界市場について調査し、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、ビジネスモデル別（鋳造所、IDM (アイデンティティ管理)、OSAT (アウトソーシング アセンブリ＆テスト)）分析、技術別（高密度FOWLP、標準密度FOWLP）分析、キャリアタイプ別（200㎜、300㎜、パネル）分析、エンドユーザー別（航空宇宙・防衛、自動車、家電、医療）分析、地域別（南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他）分析、競争状況など、以下の構成でまとめております。なお、当書には、ADL Engineering Ltd、Amkor Technology、ASE Technology Holding、Deca Technologies, Inc.、Fujikura Ltd.、Infineon Technologies AG、Nanium S.A、SAMSUNG ELECTRO-MECHANICS、STATS ChipPAC、Taiwan Semiconductor Manufacturing Companyなどの企業情報が含まれています。 ・序論 ・調査方法 ・エグゼクティブサマリー ・市場概要 ・市場インサイト ・世界のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模：ビジネスモデル別 - 鋳造所の市場規模 - IDM (アイデンティティ管理)の市場規模 - OSAT (アウトソーシング アセンブリ＆テスト)の市場規模 ・世界のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模：技術別 - 高密度FOWLPの市場規模 - 標準密度FOWLPの市場規模 ・世界のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模：キャリアタイプ別 - 200㎜FOWLPの市場規模 - 300㎜FOWLPの市場規模 - パネルFOWLPの市場規模 ・世界のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模：エンドユーザー別 - 航空宇宙・防衛における市場規模 - 自動車における市場規模 - 家電における市場規模 - 医療における市場規模 ・世界のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模：地域別 - 南北アメリカのファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 アメリカのファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 カナダのファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 ブラジルのファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 ... - アジア太平洋のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 日本のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 中国のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 インドのファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 韓国のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 台湾のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 ... - ヨーロッパ/中東/アフリカのファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 イギリスのファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 ドイツのファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 インドのファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 フランスのファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 ロシアのファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 ... - その他地域のファンアウト型ウェーハレベルパッケージング（FOWLP）市場規模 ・競争状況 ・企業情報 |
The Global Fan-out Wafer Level Packaging Market size was estimated at USD 24.83 billion in 2021 and expected to reach USD 27.98 billion in 2022, and is projected to grow at a CAGR 12.85% to reach USD 51.30 billion by 2027.
Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.
Market Segmentation & Coverage:
This research report categorizes the Fan-out Wafer Level Packaging to forecast the revenues and analyze the trends in each of the following sub-markets:
Based on Business Model, the market was studied across Foundry, IDM (Identity Management), and OSAT (Outsourced Assembly and Test).
Based on Technology, the market was studied across High-density FOWLP and Standard Density FOWLP.
Based on Carrier Type, the market was studied across 200mm, 300mm, and Panel.
Based on End-User, the market was studied across Aerospace and Defense, Automotive, Consumer Electronics, Healthcare, Industrial, and IT and Telecommunication.
Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.
Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.
Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Fan-out Wafer Level Packaging market considering the current update on the conflict and its global response.
Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.
FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Fan-out Wafer Level Packaging Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.
Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.
Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.
Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Fan-out Wafer Level Packaging Market, including ADL Engineering Ltd, Amkor Technology, ASE Technology Holding, Deca Technologies, Inc., Fujikura Ltd., Infineon Technologies AG, Nanium S.A, SAMSUNG ELECTRO-MECHANICS, STATS ChipPAC, and Taiwan Semiconductor Manufacturing Company.
The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments
The report answers questions such as:
1. What is the market size and forecast of the Global Fan-out Wafer Level Packaging Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Fan-out Wafer Level Packaging Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Fan-out Wafer Level Packaging Market?
4. What is the competitive strategic window for opportunities in the Global Fan-out Wafer Level Packaging Market?
5. What are the technology trends and regulatory frameworks in the Global Fan-out Wafer Level Packaging Market?
6. What is the market share of the leading vendors in the Global Fan-out Wafer Level Packaging Market?
7. What modes and strategic moves are considered suitable for entering the Global Fan-out Wafer Level Packaging Market?
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Increasing integration of electronic equipment in hybrid vehicles
5.1.1.2. Growing demand for high-power, miniaturized packaged Integrated Circuits
5.1.1.3. Rise in the popularity of compact electronic devices
5.1.2. Restraints
5.1.2.1. Shorter lifespan due to fluctuating coefficient of thermal expansion of materials
5.1.3. Opportunities
5.1.3.1. Technological advancements in the packaging industry
5.1.3.2. Growing number of product launches
5.1.4. Challenges
5.1.4.1. High cost associated with manufacturing
5.2. Cumulative Impact of COVID-19
6. Fan-out Wafer Level Packaging Market, by Business Model
6.1. Introduction
6.2. Foundry
6.3. IDM (Identity Management)
6.4. OSAT (Outsourced Assembly and Test)
7. Fan-out Wafer Level Packaging Market, by Technology
7.1. Introduction
7.2. High-density FOWLP
7.3. Standard Density FOWLP
8. Fan-out Wafer Level Packaging Market, by Carrier Type
8.1. Introduction
8.2. 200mm
8.3. 300mm
8.4. Panel
9. Fan-out Wafer Level Packaging Market, by End-User
9.1. Introduction
9.2. Aerospace and Defense
9.3. Automotive
9.4. Consumer Electronics
9.5. Healthcare
9.6. Industrial
9.7. IT and Telecommunication
10. Americas Fan-out Wafer Level Packaging Market
10.1. Introduction
10.2. Argentina
10.3. Brazil
10.4. Canada
10.5. Mexico
10.6. United States
11. Asia-Pacific Fan-out Wafer Level Packaging Market
11.1. Introduction
11.2. Australia
11.3. China
11.4. India
11.5. Indonesia
11.6. Japan
11.7. Malaysia
11.8. Philippines
11.9. Singapore
11.10. South Korea
11.11. Taiwan
11.12. Thailand
11.13. Vietnam
12. Europe, Middle East & Africa Fan-out Wafer Level Packaging Market
12.1. Introduction
12.2. Denmark
12.3. Egypt
12.4. Finland
12.5. France
12.6. Germany
12.7. Israel
12.8. Italy
12.9. Netherlands
12.10. Nigeria
12.11. Norway
12.12. Poland
12.13. Qatar
12.14. Russia
12.15. Saudi Arabia
12.16. South Africa
12.17. Spain
12.18. Sweden
12.19. Switzerland
12.20. Turkey
12.21. United Arab Emirates
12.22. United Kingdom
13. Competitive Landscape
13.1. FPNV Positioning Matrix
13.1.1. Quadrants
13.1.2. Business Strategy
13.1.3. Product Satisfaction
13.2. Market Ranking Analysis, By Key Player
13.3. Market Share Analysis, By Key Player
13.4. Competitive Scenario
13.4.1. Merger & Acquisition
13.4.2. Agreement, Collaboration, & Partnership
13.4.3. New Product Launch & Enhancement
13.4.4. Investment & Funding
13.4.5. Award, Recognition, & Expansion
14. Company Usability Profiles
14.1. ADL Engineering Ltd
14.1.1. Business Overview
14.1.2. Key Executives
14.1.3. Product & Services
14.2. Amkor Technology
14.2.1. Business Overview
14.2.2. Key Executives
14.2.3. Product & Services
14.3. ASE Technology Holding
14.3.1. Business Overview
14.3.2. Key Executives
14.3.3. Product & Services
14.4. Deca Technologies, Inc.
14.4.1. Business Overview
14.4.2. Key Executives
14.4.3. Product & Services
14.5. Fujikura Ltd.
14.5.1. Business Overview
14.5.2. Key Executives
14.5.3. Product & Services
14.6. Infineon Technologies AG
14.6.1. Business Overview
14.6.2. Key Executives
14.6.3. Product & Services
14.7. Nanium S.A
14.7.1. Business Overview
14.7.2. Key Executives
14.7.3. Product & Services
14.8. SAMSUNG ELECTRO-MECHANICS
14.8.1. Business Overview
14.8.2. Key Executives
14.8.3. Product & Services
14.9. STATS ChipPAC
14.9.1. Business Overview
14.9.2. Key Executives
14.9.3. Product & Services
14.10. Taiwan Semiconductor Manufacturing Company
14.10.1. Business Overview
14.10.2. Key Executives
14.10.3. Product & Services
15. Appendix
15.1. Discussion Guide
15.2. License & Pricing