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レポート概要
| 360iResearch社の本調査レポートでは、2021年に364.3億ドルであった世界のパワー半導体市場規模が、2022年に383.4億ドルになり、2027年には499.7億ドルまで、年平均5.40%で成長すると予測しています。本レポートでは、パワー半導体の世界市場について調査・分析し、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、材料別（GAN、SIC、シリコン・ゲルマニウム）分析、コンポーネント別（ダイオード、IGBT、パワーMOSFET、整流器、サイリスタ）分析、エンドユーザー別（航空＆防衛、自動車、家電、医療、その他）分析、地域別（南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他）分析、競争状況など、以下の構成でお届けします。なお、本書には、ABB Ltd、BYD Co. Ltd.、Device Engineering Inc、Fairchild Semiconductor International, Inc.、Fuji Electric Co., Ltd.、GaN Systems Inc.、Hitachi Ltd、INFINEON TECHNOLOGIES、Infineon Technologies AG、Littelfuse, Inc、Maxim Integrated Products, Inc.、Microchip Technology Inc、Mitsubishi Electric Corp.、NXP Semiconductor N.V、On Semiconductor Corp.、Qualcomm, Inc.、Renesas Electronics Corp、Rohm Semiconductor、Semikron、STMicroelectronics N.V.、Sungrow、Texas Instruments, Inc.、Toshiba Corporation、Transphorm Inc.、United Silicon Carbide, Inc.、Vishay Intertechnology, Inc.、Wolfspeed, Inc.などの企業情報が含まれています。 ・序論 ・調査方法 ・エグゼクティブサマリー ・市場概要 ・市場インサイト ・世界のパワー半導体市場規模：材料別 - GANの市場規模 - SICの市場規模 - シリコン・ゲルマニウムの市場規模 ・世界のパワー半導体市場規模：コンポーネント別 - ダイオードの市場規模 - IGBTの市場規模 - パワーMOSFETの市場規模 - 整流器の市場規模 - サイリスタの市場規模 ・世界のパワー半導体市場規模：エンドユーザー別 - 航空＆防衛における市場規模 - 自動車における市場規模 - 家電における市場規模 - 医療における市場規模 - その他エンドユーザーにおける市場規模 ・世界のパワー半導体市場規模：地域別 - 南北アメリカのパワー半導体市場規模 アメリカのパワー半導体市場規模 カナダのパワー半導体市場規模 ブラジルのパワー半導体市場規模 ... - アジア太平洋のパワー半導体市場規模 日本のパワー半導体市場規模 中国のパワー半導体市場規模 インドのパワー半導体市場規模 韓国のパワー半導体市場規模 台湾のパワー半導体市場規模 ... - ヨーロッパ/中東/アフリカのパワー半導体市場規模 イギリスのパワー半導体市場規模 ドイツのパワー半導体市場規模 インドのパワー半導体市場規模 フランスのパワー半導体市場規模 ロシアのパワー半導体市場規模 ... - その他地域のパワー半導体市場規模 ・競争状況 ・企業情報 |
The Global Power Semiconductor Market size was estimated at USD 36.43 billion in 2021 and expected to reach USD 38.34 billion in 2022, and is projected to grow at a CAGR 5.40% to reach USD 49.97 billion by 2027.
Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.
Market Segmentation & Coverage:
This research report categorizes the Power Semiconductor to forecast the revenues and analyze the trends in each of the following sub-markets:
Based on Material, the market was studied across Gallium Nitride (GAN), Silicon Carbide (SIC), and Silicon/ Germanium.
Based on Component, the market was studied across Diode, IGBT, Power MOSFET, Rectifiers, and Thyristors.
Based on End-User, the market was studied across Aerospace & Defense, Automotive, Consumer Electronics, Healthcare, Industrial, and Telecommunication.
Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.
Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.
Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Power Semiconductor market considering the current update on the conflict and its global response.
Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.
FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Power Semiconductor Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.
Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.
Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.
Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Power Semiconductor Market, including ABB Ltd, BYD Co. Ltd., Device Engineering Inc, Fairchild Semiconductor International, Inc., Fuji Electric Co., Ltd., GaN Systems Inc., Hitachi Ltd, INFINEON TECHNOLOGIES, Infineon Technologies AG, Littelfuse, Inc, Maxim Integrated Products, Inc., Microchip Technology Inc, Mitsubishi Electric Corp., NXP Semiconductor N.V, On Semiconductor Corp., Qualcomm, Inc., Renesas Electronics Corp, Rohm Semiconductor, Semikron, STMicroelectronics N.V., Sungrow, Texas Instruments, Inc., Toshiba Corporation, Transphorm Inc., United Silicon Carbide, Inc., Vishay Intertechnology, Inc., and Wolfspeed, Inc..
The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments
The report answers questions such as:
1. What is the market size and forecast of the Global Power Semiconductor Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Power Semiconductor Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Power Semiconductor Market?
4. What is the competitive strategic window for opportunities in the Global Power Semiconductor Market?
5. What are the technology trends and regulatory frameworks in the Global Power Semiconductor Market?
6. What is the market share of the leading vendors in the Global Power Semiconductor Market?
7. What modes and strategic moves are considered suitable for entering the Global Power Semiconductor Market?
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Growing use of power electronic devices in consumer electronics products
5.1.1.2. High demand for portable, battery powered devices
5.1.1.3. Significant use of power electronics for renewable energy systems
5.1.1.4. Increasing application of Power ICs in smart phones and medical devices
5.1.2. Restraints
5.1.2.1. Issues in designing a power electronic system such as EMI, Losses, and harmonics
5.1.3. Opportunities
5.1.3.1. Growing electrification of vehicles
5.1.3.2. RF power semiconductors for 5G industry
5.1.3.3. Gallium Nitride (GaN) advancement in the miniaturization of chargers and adapters
5.1.4. Challenges
5.1.4.1. Shortage of silicon wafers
5.1.4.2. Power electronic controllers with low overhead capacity
5.2. Cumulative Impact of COVID-19
6. Power Semiconductor Market, by Material
6.1. Introduction
6.2. Gallium Nitride (GAN)
6.3. Silicon Carbide (SIC)
6.4. Silicon/ Germanium
7. Power Semiconductor Market, by Component
7.1. Introduction
7.2. Diode
7.3. IGBT
7.4. Power MOSFET
7.5. Rectifiers
7.6. Thyristors
8. Power Semiconductor Market, by End-User
8.1. Introduction
8.2. Aerospace & Defense
8.3. Automotive
8.4. Consumer Electronics
8.5. Healthcare
8.6. Industrial
8.7. Telecommunication
9. Americas Power Semiconductor Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific Power Semiconductor Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa Power Semiconductor Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.1.1. Quadrants
12.1.2. Business Strategy
12.1.3. Product Satisfaction
12.2. Market Ranking Analysis, By Key Player
12.3. Market Share Analysis, By Key Player
12.4. Competitive Scenario
12.4.1. Merger & Acquisition
12.4.2. Agreement, Collaboration, & Partnership
12.4.3. New Product Launch & Enhancement
12.4.4. Investment & Funding
12.4.5. Award, Recognition, & Expansion
13. Company Usability Profiles
13.1. ABB Ltd
13.1.1. Business Overview
13.1.2. Key Executives
13.1.3. Product & Services
13.2. BYD Co. Ltd.
13.2.1. Business Overview
13.2.2. Key Executives
13.2.3. Product & Services
13.3. Device Engineering Inc
13.3.1. Business Overview
13.3.2. Key Executives
13.3.3. Product & Services
13.4. Fairchild Semiconductor International, Inc.
13.4.1. Business Overview
13.4.2. Key Executives
13.4.3. Product & Services
13.5. Fuji Electric Co., Ltd.
13.5.1. Business Overview
13.5.2. Key Executives
13.5.3. Product & Services
13.6. GaN Systems Inc.
13.6.1. Business Overview
13.6.2. Key Executives
13.6.3. Product & Services
13.7. Hitachi Ltd
13.7.1. Business Overview
13.7.2. Key Executives
13.7.3. Product & Services
13.8. INFINEON TECHNOLOGIES
13.8.1. Business Overview
13.8.2. Key Executives
13.8.3. Product & Services
13.9. Infineon Technologies AG
13.9.1. Business Overview
13.9.2. Key Executives
13.9.3. Product & Services
13.10. Littelfuse, Inc
13.10.1. Business Overview
13.10.2. Key Executives
13.10.3. Product & Services
13.11. Maxim Integrated Products, Inc.
13.11.1. Business Overview
13.11.2. Key Executives
13.11.3. Product & Services
13.12. Microchip Technology Inc
13.12.1. Business Overview
13.12.2. Key Executives
13.12.3. Product & Services
13.13. Mitsubishi Electric Corp.
13.13.1. Business Overview
13.13.2. Key Executives
13.13.3. Product & Services
13.14. NXP Semiconductor N.V
13.14.1. Business Overview
13.14.2. Key Executives
13.14.3. Product & Services
13.15. On Semiconductor Corp.
13.15.1. Business Overview
13.15.2. Key Executives
13.15.3. Product & Services
13.16. Qualcomm, Inc.
13.16.1. Business Overview
13.16.2. Key Executives
13.16.3. Product & Services
13.17. Renesas Electronics Corp
13.17.1. Business Overview
13.17.2. Key Executives
13.17.3. Product & Services
13.18. Rohm Semiconductor
13.18.1. Business Overview
13.18.2. Key Executives
13.18.3. Product & Services
13.19. Semikron
13.19.1. Business Overview
13.19.2. Key Executives
13.19.3. Product & Services
13.20. STMicroelectronics N.V.
13.20.1. Business Overview
13.20.2. Key Executives
13.20.3. Product & Services
13.21. Sungrow
13.21.1. Business Overview
13.21.2. Key Executives
13.21.3. Product & Services
13.22. Texas Instruments, Inc.
13.22.1. Business Overview
13.22.2. Key Executives
13.22.3. Product & Services
13.23. Toshiba Corporation
13.23.1. Business Overview
13.23.2. Key Executives
13.23.3. Product & Services
13.24. Transphorm Inc.
13.24.1. Business Overview
13.24.2. Key Executives
13.24.3. Product & Services
13.25. United Silicon Carbide, Inc.
13.25.1. Business Overview
13.25.2. Key Executives
13.25.3. Product & Services
13.26. Vishay Intertechnology, Inc.
13.26.1. Business Overview
13.26.2. Key Executives
13.26.3. Product & Services
13.27. Wolfspeed, Inc.
13.27.1. Business Overview
13.27.2. Key Executives
13.27.3. Product & Services
14. Appendix
14.1. Discussion Guide
14.2. License & Pricing