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レポート概要
| 360iResearch社の本調査レポートでは、2021年に5,291.22百万ドルであった世界の3D半導体パッケージング市場規模が、2022年に6,236.24百万ドルになり、2027年まで年平均18.11%で成長して14,367.67百万ドルまで拡大すると予測しています。本レポートは、3D半導体パッケージングの世界市場について調査し、市場の動向を明らかにした資料であり、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、技術別（3Dファンアウトベース、3Dパッケージオンパッケージ、3Dスルーシリコンビア、3Dワイヤーボンディング）分析、材料別（ボンディングワイヤ、セラミックパッケージ、ダイアタッチ材、封止材、その他）分析、用途別（航空宇宙・防衛、自動車、家電、医療、その他）分析、地域別（南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他）分析、競争状況、企業情報など以下の構成でまとめています。また、3M Company、Advanced Micro Devices, Inc.、Amkor Technology、ASE Technology Holding Co., Ltd、Intel Corporation、International Business Machines Corporation (Ibm)、Jiangsu Changjiang Electronics Technology Co., Ltd.、Micron Technology, Inc.などの企業情報が含まれています。 ・序論 ・調査方法 ・エグゼクティブサマリー ・市場概要 ・市場インサイト ・世界の3D半導体パッケージング市場規模：技術別 - 3Dファンアウトベースにおける市場規模 - 3Dパッケージオンパッケージにおける市場規模 - 3Dスルーシリコンビアにおける市場規模 - 3Dワイヤーボンディングにおける市場規模 ・世界の3D半導体パッケージング市場規模：材料別 - ボンディングワイヤにおける市場規模 - セラミックパッケージにおける市場規模 - ダイアタッチ材における市場規模 - 封止材における市場規模 - その他における市場規模 ・世界の3D半導体パッケージング市場規模：用途別 - 航空宇宙・防衛における市場規模 - 自動車における市場規模 - 家電における市場規模 - 医療における市場規模 - その他における市場規模 ・世界の3D半導体パッケージング市場規模：地域別 - 南北アメリカの3D半導体パッケージング市場規模 アメリカの3D半導体パッケージング市場規模 カナダの3D半導体パッケージング市場規模 ブラジルの3D半導体パッケージング市場規模 … - アジア太平洋の3D半導体パッケージング市場規模 日本の3D半導体パッケージング市場規模 中国の3D半導体パッケージング市場規模 インドの3D半導体パッケージング市場規模 韓国の3D半導体パッケージング市場規模 台湾の3D半導体パッケージング市場規模 … - ヨーロッパ/中東/アフリカの3D半導体パッケージング市場規模 イギリスの3D半導体パッケージング市場規模 ドイツの3D半導体パッケージング市場規模 フランスの3D半導体パッケージング市場規模 ロシアの3D半導体パッケージング市場規模 … - その他地域の3D半導体パッケージング市場規模 ・競争状況 ・企業情報 |
The Global 3D Semiconductor Packaging Market size was estimated at USD 5,291.22 million in 2021 and expected to reach USD 6,236.24 million in 2022, and is projected to grow at a CAGR 18.11% to reach USD 14,367.67 million by 2027.
Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.
Market Segmentation & Coverage:
This research report categorizes the 3D Semiconductor Packaging to forecast the revenues and analyze the trends in each of the following sub-markets:
Based on Technology, the market was studied across 3D Fan Out Based, 3D Package on Package, 3D Through Silicon Via, and 3D Wire Bonded.
Based on Material, the market was studied across Bonding Wire, Ceramic Packages, Die Attach Material, Encapsulation, Leadframe, Organic Substrate, and Resins.
Based on Application, the market was studied across Aerospace & Defense, Automotive, Consumer Electronics, Healthcare, Industrial, and IT & Telecommunication.
Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.
Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.
Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for 3D Semiconductor Packaging market considering the current update on the conflict and its global response.
Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.
FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the 3D Semiconductor Packaging Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.
Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.
Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.
Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global 3D Semiconductor Packaging Market, including 3M Company, Advanced Micro Devices, Inc., Amkor Technology, ASE Technology Holding Co., Ltd, Intel Corporation, International Business Machines Corporation (Ibm), Jiangsu Changjiang Electronics Technology Co., Ltd., Micron Technology, Inc., Qualcomm Technologies, Inc., Samsung Electronics Co., Ltd., Siliconware Precision Industries Co., Ltd., SPTS Technologies Ltd., Stmicroelectronics N.V., SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Ltd., Tokyo Electron Limited, Toshiba Corporation, and United Microelectronics Corporation.
The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments
The report answers questions such as:
1. What is the market size and forecast of the Global 3D Semiconductor Packaging Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global 3D Semiconductor Packaging Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global 3D Semiconductor Packaging Market?
4. What is the competitive strategic window for opportunities in the Global 3D Semiconductor Packaging Market?
5. What are the technology trends and regulatory frameworks in the Global 3D Semiconductor Packaging Market?
6. What is the market share of the leading vendors in the Global 3D Semiconductor Packaging Market?
7. What modes and strategic moves are considered suitable for entering the Global 3D Semiconductor Packaging Market?
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Significant growth in requirement of miniaturized electronics worldwide
5.1.1.2. Potential need to reduce power consumption and improve overall performance of semiconductors
5.1.1.3. Proliferation in usage of consumer electronics and smart devices
5.1.2. Restraints
5.1.2.1. High cost of manufacturing
5.1.3. Opportunities
5.1.3.1. Technological advancements in 3D semiconductor packaging
5.1.3.2. Governmental initiatives and investments for digitalization and automation of industrial sector
5.1.4. Challenges
5.1.4.1. Complex development procedures and thermal issues
5.2. Cumulative Impact of COVID-19
6. 3D Semiconductor Packaging Market, by Technology
6.1. Introduction
6.2. 3D Fan Out Based
6.3. 3D Package on Package
6.4. 3D Through Silicon Via
6.5. 3D Wire Bonded
7. 3D Semiconductor Packaging Market, by Material
7.1. Introduction
7.2. Bonding Wire
7.3. Ceramic Packages
7.4. Die Attach Material
7.5. Encapsulation
7.6. Leadframe
7.7. Organic Substrate
7.8. Resins
8. 3D Semiconductor Packaging Market, by Application
8.1. Introduction
8.2. Aerospace & Defense
8.3. Automotive
8.4. Consumer Electronics
8.5. Healthcare
8.6. Industrial
8.7. IT & Telecommunication
9. Americas 3D Semiconductor Packaging Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific 3D Semiconductor Packaging Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa 3D Semiconductor Packaging Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.1.1. Quadrants
12.1.2. Business Strategy
12.1.3. Product Satisfaction
12.2. Market Ranking Analysis, By Key Player
12.3. Market Share Analysis, By Key Player
12.4. Competitive Scenario
12.4.1. Merger & Acquisition
12.4.2. Agreement, Collaboration, & Partnership
12.4.3. New Product Launch & Enhancement
12.4.4. Investment & Funding
12.4.5. Award, Recognition, & Expansion
13. Company Usability Profiles
13.1. 3M Company
13.1.1. Business Overview
13.1.2. Key Executives
13.1.3. Product & Services
13.2. Advanced Micro Devices, Inc.
13.2.1. Business Overview
13.2.2. Key Executives
13.2.3. Product & Services
13.3. Amkor Technology
13.3.1. Business Overview
13.3.2. Key Executives
13.3.3. Product & Services
13.4. ASE Technology Holding Co., Ltd
13.4.1. Business Overview
13.4.2. Key Executives
13.4.3. Product & Services
13.5. Intel Corporation
13.5.1. Business Overview
13.5.2. Key Executives
13.5.3. Product & Services
13.6. International Business Machines Corporation (Ibm)
13.6.1. Business Overview
13.6.2. Key Executives
13.6.3. Product & Services
13.7. Jiangsu Changjiang Electronics Technology Co., Ltd.
13.7.1. Business Overview
13.7.2. Key Executives
13.7.3. Product & Services
13.8. Micron Technology, Inc.
13.8.1. Business Overview
13.8.2. Key Executives
13.8.3. Product & Services
13.9. Qualcomm Technologies, Inc.
13.9.1. Business Overview
13.9.2. Key Executives
13.9.3. Product & Services
13.10. Samsung Electronics Co., Ltd.
13.10.1. Business Overview
13.10.2. Key Executives
13.10.3. Product & Services
13.11. Siliconware Precision Industries Co., Ltd.
13.11.1. Business Overview
13.11.2. Key Executives
13.11.3. Product & Services
13.12. SPTS Technologies Ltd.
13.12.1. Business Overview
13.12.2. Key Executives
13.12.3. Product & Services
13.13. Stmicroelectronics N.V.
13.13.1. Business Overview
13.13.2. Key Executives
13.13.3. Product & Services
13.14. SÜSS MicroTec SE
13.14.1. Business Overview
13.14.2. Key Executives
13.14.3. Product & Services
13.15. Taiwan Semiconductor Manufacturing Company Ltd.
13.15.1. Business Overview
13.15.2. Key Executives
13.15.3. Product & Services
13.16. Tokyo Electron Limited
13.16.1. Business Overview
13.16.2. Key Executives
13.16.3. Product & Services
13.17. Toshiba Corporation
13.17.1. Business Overview
13.17.2. Key Executives
13.17.3. Product & Services
13.18. United Microelectronics Corporation
13.18.1. Business Overview
13.18.2. Key Executives
13.18.3. Product & Services
14. Appendix
14.1. Discussion Guide
14.2. License & Pricing