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レポート概要
| 360iResearch社の本調査レポートは、2021年に815.3億ドルであった世界のプリント基板（PCB）市場規模が、2022年に856.1億ドルになり、2027年まで年平均5.18%で成長して1104億ドルに達すると予測しています。本レポートでは、プリント基板（PCB）の世界市場について調査し、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、指標分析別（銅箔、エポキシ樹脂、ガラス繊維、フェノール樹脂）分析、種類別（両面プリント基板、フレックスPCB、多層PCB、リジッドPCB、リジッドフレックスPCB）分析、エンドユーザー別（車載用電子機器、家電、防衛＆航空宇宙、医療、軍事）分析、地域別（南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他）分析、競争状況、企業情報などの項目を掲載しています。また、本書には、Advanced Circuits Inc.、AT & S Austria Technologie & Systemtechnik AG、Becker & Müller Schaltungsdruck GmbH、CMK Corporation、Compeq Manufacturing Co. Ltd.、DAEDUCK ELECTRONICS Co.,Ltd.、Dynamic Electronics Co., Ltd.、Epitome Components Limited、Fujikura Ltd.、Hi-Q Electronics Private Limited、India Circuits Pvt . Ltd、Jabil Inc.、Molex, LLC、Multi-Fineline Electronix, Inc.、Murrietta Circuits、Nan Ya Printed Circuit Board Corporation、Nippon Mektron Ltd.、Nitto Denko Corporationなどの企業情報が含まれています。 ・序論 ・調査方法 ・エグゼクティブサマリー ・市場概要 ・市場インサイト ・世界のプリント基板（PCB）市場規模：指標分析別 - 銅箔における市場規模 - エポキシ樹脂における市場規模 - ガラス繊維における市場規模 - フェノール樹脂における市場規模 ・世界のプリント基板（PCB）市場規模：種類別 - 両面プリント基板の市場規模 - フレックスPCBの市場規模 - 多層PCBの市場規模 - リジッドPCBの市場規模 - リジッドフレックスPCBの市場規模 ・世界のプリント基板（PCB）市場規模：エンドユーザー別 - 車載用電子機器における市場規模 - 家電における市場規模 - 防衛＆航空宇宙における市場規模 - 医療における市場規模 - 軍事における市場規模 ・世界のプリント基板（PCB）市場規模：地域別 - 南北アメリカのプリント基板（PCB）市場規模 アメリカのプリント基板（PCB）市場規模 カナダのプリント基板（PCB）市場規模 ブラジルのプリント基板（PCB）市場規模 ... - アジア太平洋のプリント基板（PCB）市場規模 日本のプリント基板（PCB）市場規模 中国のプリント基板（PCB）市場規模 インドのプリント基板（PCB）市場規模 韓国のプリント基板（PCB）市場規模 台湾のプリント基板（PCB）市場規模 ... -ヨーロッパ/中東/アフリカのプリント基板（PCB）市場規模 イギリスのプリント基板（PCB）市場規模 ドイツのプリント基板（PCB）市場規模 フランスのプリント基板（PCB）市場規模 ロシアのプリント基板（PCB）市場規模 ... -その他地域のプリント基板（PCB）市場規模 ・競争状況 ・企業情報 |
The Global Printed Circuit Board Market size was estimated at USD 81.53 billion in 2021 and expected to reach USD 85.61 billion in 2022, and is projected to grow at a CAGR 5.18% to reach USD 110.40 billion by 2027.
Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.
Market Segmentation & Coverage:
This research report categorizes the Printed Circuit Board to forecast the revenues and analyze the trends in each of the following sub-markets:
Based on Indicator Analysis, the market was studied across Copper Foil, Epoxy Resin, Glass Fiber, and Phenolic Resin.
Based on Type, the market was studied across Double-sided PCBs, Flex PCBs, Multi-layer PCBs, Rigid PCBs, Rigid-flex PCBs., and Single-sided PCBs.
Based on End User, the market was studied across Automotive Electronics, Consumer Electronics, Defense and Aerospace, Healthcare, Military, and Telecommunications.
Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.
Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.
Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Printed Circuit Board market considering the current update on the conflict and its global response.
Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.
FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Printed Circuit Board Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.
Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.
Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.
Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Printed Circuit Board Market, including Advanced Circuits Inc., AT & S Austria Technologie & Systemtechnik AG, Becker & Müller Schaltungsdruck GmbH, CMK Corporation, Compeq Manufacturing Co. Ltd., DAEDUCK ELECTRONICS Co.,Ltd., Dynamic Electronics Co., Ltd., Epitome Components Limited, Fujikura Ltd., Hi-Q Electronics Private Limited, India Circuits Pvt . Ltd, Jabil Inc., Molex, LLC, Multi-Fineline Electronix, Inc., Murrietta Circuits, Nan Ya Printed Circuit Board Corporation, Nippon Mektron Ltd., Nitto Denko Corporation, Shogini Technoarts Private Limited, Sumitomo Electric Industries, Ltd., TE Connectivity, Tripod Technology Corporation, TTM Technologies, Inc., Unimicron Technology Corporation, and Würth Elektronik GmbH & Co. KG.
The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments
The report answers questions such as:
1. What is the market size and forecast of the Global Printed Circuit Board Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Printed Circuit Board Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Printed Circuit Board Market?
4. What is the competitive strategic window for opportunities in the Global Printed Circuit Board Market?
5. What are the technology trends and regulatory frameworks in the Global Printed Circuit Board Market?
6. What is the market share of the leading vendors in the Global Printed Circuit Board Market?
7. What modes and strategic moves are considered suitable for entering the Global Printed Circuit Board Market?
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Rising demand for consumer electronic devices
5.1.1.2. Growing demand for miniaturization of technology
5.1.1.3. Increasing demand for high-speed data and signal transmission
5.1.2. Restraints
5.1.2.1. High initial investment cost and complex assembly process
5.1.3. Opportunities
5.1.3.1. Continuous technological development
5.1.3.2. Growing recycling of PCB and PCB design developments
5.1.4. Challenges
5.1.4.1. Variability in the raw material prices
5.2. Cumulative Impact of COVID-19
6. Printed Circuit Board Market, by Indicator Analysis
6.1. Introduction
6.2. Copper Foil
6.3. Epoxy Resin
6.4. Glass Fiber
6.5. Phenolic Resin
7. Printed Circuit Board Market, by Type
7.1. Introduction
7.2. Double-sided PCBs
7.3. Flex PCBs
7.4. Multi-layer PCBs
7.5. Rigid PCBs
7.6. Rigid-flex PCBs.
7.7. Single-sided PCBs
8. Printed Circuit Board Market, by End User
8.1. Introduction
8.2. Automotive Electronics
8.3. Consumer Electronics
8.4. Defense and Aerospace
8.5. Healthcare
8.6. Military
8.7. Telecommunications
9. Americas Printed Circuit Board Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific Printed Circuit Board Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa Printed Circuit Board Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.1.1. Quadrants
12.1.2. Business Strategy
12.1.3. Product Satisfaction
12.2. Market Ranking Analysis, By Key Player
12.3. Market Share Analysis, By Key Player
12.4. Competitive Scenario
12.4.1. Merger & Acquisition
12.4.2. Agreement, Collaboration, & Partnership
12.4.3. New Product Launch & Enhancement
12.4.4. Investment & Funding
12.4.5. Award, Recognition, & Expansion
13. Company Usability Profiles
13.1. Advanced Circuits Inc.
13.1.1. Business Overview
13.1.2. Key Executives
13.1.3. Product & Services
13.2. AT & S Austria Technologie & Systemtechnik AG
13.2.1. Business Overview
13.2.2. Key Executives
13.2.3. Product & Services
13.3. Becker & Müller Schaltungsdruck GmbH
13.3.1. Business Overview
13.3.2. Key Executives
13.3.3. Product & Services
13.4. CMK Corporation
13.4.1. Business Overview
13.4.2. Key Executives
13.4.3. Product & Services
13.5. Compeq Manufacturing Co. Ltd.
13.5.1. Business Overview
13.5.2. Key Executives
13.5.3. Product & Services
13.6. DAEDUCK ELECTRONICS Co.,Ltd.
13.6.1. Business Overview
13.6.2. Key Executives
13.6.3. Product & Services
13.7. Dynamic Electronics Co., Ltd.
13.7.1. Business Overview
13.7.2. Key Executives
13.7.3. Product & Services
13.8. Epitome Components Limited
13.8.1. Business Overview
13.8.2. Key Executives
13.8.3. Product & Services
13.9. Fujikura Ltd.
13.9.1. Business Overview
13.9.2. Key Executives
13.9.3. Product & Services
13.10. Hi-Q Electronics Private Limited
13.10.1. Business Overview
13.10.2. Key Executives
13.10.3. Product & Services
13.11. India Circuits Pvt . Ltd
13.11.1. Business Overview
13.11.2. Key Executives
13.11.3. Product & Services
13.12. Jabil Inc.
13.12.1. Business Overview
13.12.2. Key Executives
13.12.3. Product & Services
13.13. Molex, LLC
13.13.1. Business Overview
13.13.2. Key Executives
13.13.3. Product & Services
13.14. Multi-Fineline Electronix, Inc.
13.14.1. Business Overview
13.14.2. Key Executives
13.14.3. Product & Services
13.15. Murrietta Circuits
13.15.1. Business Overview
13.15.2. Key Executives
13.15.3. Product & Services
13.16. Nan Ya Printed Circuit Board Corporation
13.16.1. Business Overview
13.16.2. Key Executives
13.16.3. Product & Services
13.17. Nippon Mektron Ltd.
13.17.1. Business Overview
13.17.2. Key Executives
13.17.3. Product & Services
13.18. Nitto Denko Corporation
13.18.1. Business Overview
13.18.2. Key Executives
13.18.3. Product & Services
13.19. Shogini Technoarts Private Limited
13.19.1. Business Overview
13.19.2. Key Executives
13.19.3. Product & Services
13.20. Sumitomo Electric Industries, Ltd.
13.20.1. Business Overview
13.20.2. Key Executives
13.20.3. Product & Services
13.21. TE Connectivity
13.21.1. Business Overview
13.21.2. Key Executives
13.21.3. Product & Services
13.22. Tripod Technology Corporation
13.22.1. Business Overview
13.22.2. Key Executives
13.22.3. Product & Services
13.23. TTM Technologies, Inc.
13.23.1. Business Overview
13.23.2. Key Executives
13.23.3. Product & Services
13.24. Unimicron Technology Corporation
13.24.1. Business Overview
13.24.2. Key Executives
13.24.3. Product & Services
13.25. Würth Elektronik GmbH & Co. KG
13.25.1. Business Overview
13.25.2. Key Executives
13.25.3. Product & Services
14. Appendix
14.1. Discussion Guide
14.2. License & Pricing