 | • レポートコード：MRC2304I0223 • 出版社/出版日：Persistence Market Research / 2023年2月21日 • レポート形態：英文、PDF、250ページ • 納品方法：Eメール • 産業分類：半導体 |
| Single User | ￥735,000 (USD4,900) | ▷ お問い合わせ |
| Site Licence | ￥1,140,000 (USD7,600) | ▷ お問い合わせ |
| Enterprisewide | ￥1,590,000 (USD10,600) | ▷ お問い合わせ |
• お支払方法：銀行振込（納品後、ご請求書送付）
レポート概要
| Persistence Market Research社の本調査資料では、世界のファンアウト型ウェハレベルパッケージング（FOWLP）市場について調査・分析を行い、市場の現状と今後の展望を整理しています。本書は、エグゼクティブサマリー、市場概要、市場背景、種類別（高密度ファンアウトパッケージ、コアファンアウトパッケージ）分析、用途別（CMOSイメージセンサ、ワイヤレス接続、ロジック・メモリ集積回路、MEMS・センサ、その他）分析、地域別（北米、中南米、ヨーロッパ、アジア太平洋、中東・アフリカ）分析、市場構造分析、競争分析、仮定、調査手法など、以下の構成で掲載しています。また、TSMC、ASE Technology Holding Co.、JCET Group、Amkor Technology、Nepes、Infineon Technologies、NXP Semiconductors NV、Samsung Electro-Mechanics、Powertech Technology Inc、Taiwan Semiconductor Manufacturing Company、Renesas Electronics Corporationなどの企業情報が含まれています。 ・エグゼクティブサマリー ・市場概要 ・市場背景 ・世界のファンアウト型ウェハレベルパッケージング（FOWLP）市場規模：種類別 - 高密度ファンアウトパッケージの市場規模 - コアファンアウトパッケージの市場規模 ・世界のファンアウト型ウェハレベルパッケージング（FOWLP）市場規模：用途別 - CMOSイメージセンサにおける市場規模 - ワイヤレス接続における市場規模 - ロジック・メモリ集積回路における市場規模 - MEMS・センサにおける市場規模 - その他用途における市場規模 ・世界のファンアウト型ウェハレベルパッケージング（FOWLP）市場規模：地域別 - 北米のファンアウト型ウェハレベルパッケージング（FOWLP）市場規模 - 中南米のファンアウト型ウェハレベルパッケージング（FOWLP）市場規模 - ヨーロッパのファンアウト型ウェハレベルパッケージング（FOWLP）市場規模 - アジア太平洋のファンアウト型ウェハレベルパッケージング（FOWLP）市場規模 - 中東・アフリカのファンアウト型ウェハレベルパッケージング（FOWLP）市場規模 ・市場構造分析 ・競争分析 ・仮定 ・調査手法 |
Fan-Out Wafer Level Packaging Market: Global Industry Analysis 2018 to 2022 and Opportunity Assessment 2023 to 2033
A recent market study published by Future Market Insights on the Fan-Out Wafer Level Packaging Market offers global industry analysis for 2018 to 2022 and opportunity assessment for 2023 to 2033. The study offers a comprehensive assessment of the most important market dynamics. After conducting a thorough research on the historical, as well as current growth parameters, the growth prospects of the market are obtained with maximum precision.
Market Segmentation
The global Fan-Out Wafer Level Packaging Market is segmented in detail to cover every aspect of the market and present complete market intelligence to readers.
By Type
High density Fan-Out Package
Core Fan-Out Package
By Application
CMOS Image Sensor
Wireless Connection
Logic and Memory Integrated Circuits
Mems and Sensors
Hybrid and Integrated Circuits
Others
By Region
North America
Latin America
Europe
Asia Pacific
Middle East and Africa
Report Chapters
Chapter 01 – Executive Summary
The executive summary of the Fan-Out Wafer Level Packaging Market includes the global market analysis, proprietary wheel of fortune, demand-side and supply-side trends, opportunity assessment, and recommendations on the global Fan-Out Wafer Level Packaging Market.
Chapter 02 – Market Overview
Readers can find the detailed segmentation and definition of the Fan-Out Wafer Level Packaging Market in this chapter, which will help them understand basic information about the Fan-Out Wafer Level Packaging Market. This section also highlights the inclusions and exclusions, which help the reader to understand the scope of the Fan-Out Wafer Level Packaging Market report.
Chapter 03 – Market Background
The associated industry assessment of the global Fan-Out Wafer Level Packaging Market is carried out in this section. In addition, this chapter explains key macroeconomic factors that are expected to influence the growth of the global Fan-Out Wafer Level Packaging Market over the forecast period. Along with macroeconomic factors, this section also highlights the opportunity analysis, social media sentiment analysis, and consumer behavior analysis for the market. It provides key market dynamics of the Fan-Out Wafer Level Packaging Market, which include drivers, restraints, and opportunities.
Chapter 04 – Global Fan-Out Wafer Level Packaging Market Demand Analysis 2018 to 2022 and Forecast, 2023 to 2033
This section provides detailed analysis of the historical custom Fan-Out Wafer Level Packaging Market value, along with an opportunity analysis of the future. Readers can also find the incremental opportunity for the current year (2023) and an absolute opportunity for the forecast period (2023 to 2033).
Chapter 05 – Global Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Type
Based on Type, the Fan-Out Wafer Level Packaging Market is segmented in high density fan-out package and core fan-out package. In this chapter, readers can find market attractiveness analysis, based on type.
Chapter 06 – Global Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Application
This chapter provides details about the Fan-Out Wafer Level Packaging Market on the basis of application which is segmented into CMOS image sensor, wireless connection, logic and memory integrated circuits, MEMS and sensors, analog and hybrid integrated circuits and others along with market attractiveness analysis.
Chapter 07 – Global Security Market Analysis 2018 to 2022 and Opportunity Assessment 2023 to 2033 By region
This chapter explains how the Fan-Out Wafer Level Packaging Market will grow across various geographic regions, such as North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa.
Chapter 08 – North America Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033
This chapter includes a detailed analysis of the growth of the Fan-Out Wafer Level Packaging Market in the North America region, along with a country-wise assessment that includes the USA and Canada. Readers can also find regional trends, opportunities, and market growth in the North America region.
Chapter 09 – Latin America Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033
Readers can find detailed information about several factors, such as the pricing analysis and regional trends, which are impacting growth of the Fan-Out Wafer Level Packaging Market in the Latin America region. This chapter also includes growth prospects of the Fan-Out Wafer Level Packaging Market in leading LATAM countries such as Brazil, Mexico, Argentina and Rest of Latin America.
Chapter 10 – Europe Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033
Important growth prospects of the Fan-Out Wafer Level Packaging Market in several countries such as Germany, Italy, France, United Kingdom, Spain, Belgium and Rest of Europe are included in this chapter.
Chapter 11 –Asia Pacific Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033
This chapter includes a detailed analysis of the growth of the Fan-Out Wafer Level Packaging Market in the Asia Pacific region, along with a country-wise assessment that includes China, Japan, South Korea, India, Australia and rest of Asia Pacific. Readers can also find regional trends, restraints, and market growth of countries in the Asia Pacific region.
Chapter 12 – Middle East and Africa Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033
This chapter offers insights into how the Fan-Out Wafer Level Packaging Market is expected to grow in major countries in the Middle East & Africa region such as South Africa, Saudi Arabia, United Arab Emirates and Rest of Middle East & Africa during the forecast period 2023 to 2033.
Chapter 13 – Key Countries Fan-Out Wafer Level Packaging Market Analysis
This chapter offers insights into how the Fan-Out Wafer Level Packaging Market is expected to grow in key countries such as USA, Canada, Brazil, Mexico, Argentina, Germany, Italy, France, United Kingdom, Spain, Belgium, China, Japan, South Korea, India, Australia, Saudi Arabia, South Africa, and United Arab Emirates during the forecast period 2023 to 2033.
Chapter 14 – Market Structure Analysis
In this chapter, readers can find detailed information about tier analysis and market concentration of the key players in the Fan-Out Wafer Level Packaging Market along with their market presence analysis by region and product portfolio.
Chapter 15 – Competition Analysis
In this chapter, readers can find a comprehensive list of manufacturers/players in Fan-Out Wafer Level Packaging Market, along with detailed information about each company, which includes company overview, revenue shares, strategic overview, and recent company developments. Some of the market players featured in the report are TSMC, ASE Technology Holding Co., JCET Group, Amkor Technology, Nepes, Infineon Technologies, NXP Semiconductors NV, Samsung Electro-Mechanics, Powertech Technology Inc, Taiwan Semiconductor Manufacturing Company, and Renesas Electronics Corporation
Chapter 16 – Assumptions and Acronyms
This chapter includes a list of acronyms and assumptions that provide a based to the information and statistics included in the Fan-Out Wafer Level Packaging Market report.
Chapter 17 – Research Methodology
This chapter helps readers understand the research methodology followed to obtain various conclusions, as well as important qualitative and quantitative information, on the Fan-Out Wafer Level Packaging Market.
レポート目次1. Executive Summary
1.1. Global Market Outlook
1.2. Demand-side Trends
1.3. Supply-side Trends
1.4. Technology Roadmap Analysis
1.5. Analysis and Recommendations
2. Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
3. Market Background
3.1. Market Dynamics
3.1.1. Drivers
3.1.2. Restraints
3.1.3. Opportunity
3.1.4. Trends
3.2. Scenario Forecast
3.2.1. Demand in Optimistic Scenario
3.2.2. Demand in Likely Scenario
3.2.3. Demand in Conservative Scenario
3.3. Opportunity Map Analysis
3.4. Investment Feasibility Matrix
3.5. PESTLE and Porter’s Analysis
3.6. Regulatory Landscape
3.6.1. By Key Regions
3.6.2. By Key Countries
3.7. Regional Parent Market Outlook
4. Global Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast, 2023 to 2033
4.1. Historical Market Size Value (US$ Million) Analysis, 2018 to 2022
4.2. Current and Future Market Size Value (US$ Million) Projections, 2023 to 2033
4.2.1. Y-o-Y Growth Trend Analysis
4.2.2. Absolute $ Opportunity Analysis
5. Global Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Type
5.1. Introduction / Key Findings
5.2. Historical Market Size Value (US$ Million) Analysis By Type, 2018 to 2022
5.3. Current and Future Market Size Value (US$ Million) Analysis and Forecast By Type, 2023 to 2033
5.3.1. High Density Fan-Out Package
5.3.2. Core Fan-Out Package
5.4. Y-o-Y Growth Trend Analysis By Type, 2018 to 2022
5.5. Absolute $ Opportunity Analysis By Type, 2023 to 2033
6. Global Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033,
6.1. By Application
6.2. Introduction / Key Findings
6.3. Historical Market Size Value (US$ Million) Analysis By Application, 2018 to 2022
6.4. Current and Future Market Size Value (US$ Million) Analysis and Forecast By Application, 2023 to 2033
6.4.1. CMOS Image Sensor
6.4.2. Wireless Connection
6.4.3. Logic and Memory Integrated Circuits
6.4.4. Mems and Sensors
6.4.5. Analog and Hybrid Integrated Circuits
6.4.6. Others
6.5. Y-o-Y Growth Trend Analysis By Application, 2018 to 2022
6.6. Absolute $ Opportunity Analysis By Application, 2023 to 2033
7. Global Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033,
7.1. By Region
7.2. Introduction
7.3. Historical Market Size Value (US$ Million) Analysis By Region, 2018 to 2022
7.4. Current Market Size Value (US$ Million) Analysis and Forecast By Region, 2023 to 2033
7.4.1. North America
7.4.2. Latin America
7.4.3. Europe
7.4.4. Asia Pacific
7.4.5. Middle East & Africa
7.5. Market Attractiveness Analysis By Region
8. North America Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033,
8.1. By Country
8.2. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
8.3. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
8.3.1. By Country
8.3.1.1. USA
8.3.1.2. Canada
8.3.2. By Type
8.3.3. By Application
8.4. Market Attractiveness Analysis
8.4.1. By Country
8.4.2. By Type
8.4.3. By Application
8.5. Key Takeaways
9. Latin America Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033,
9.1. By Country
9.2. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
9.3. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
9.3.1. By Country
9.3.1.1. Brazil
9.3.1.2. Mexico
9.3.1.3. Rest of Latin America
9.3.2. By Type
9.3.3. By Application
9.4. Market Attractiveness Analysis
9.4.1. By Country
9.4.2. By Type
9.4.3. By Application
9.5. Key Takeaways
10. Europe Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033,
10.1. By Country
10.2. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
10.3. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
10.3.1. By Country
10.3.1.1. Germany
10.3.1.2. United Kingdom
10.3.1.3. France
10.3.1.4. Spain
10.3.1.5. Italy
10.3.1.6. Rest of Europe
10.3.2. By Type
10.3.3. By Application
10.4. Market Attractiveness Analysis
10.4.1. By Country
10.4.2. By Type
10.4.3. By Application
10.5. Key Takeaways
11. Asia Pacific Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033,
11.1. By Country
11.2. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
11.3. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
11.3.1. By Country
11.3.1.1. China
11.3.1.2. Japan
11.3.1.3. South Korea
11.3.1.4. Singapore
11.3.1.5. Thailand
11.3.1.6. Indonesia
11.3.1.7. Australia
11.3.1.8. New Zealand
11.3.1.9. Rest of Asia Pacific
11.3.2. By Type
11.3.3. By Application
11.4. Market Attractiveness Analysis
11.4.1. By Country
11.4.2. By Type
11.4.3. By Application
11.5. Key Takeaways
12. Middle East & Africa Fan-Out Wafer Level Packaging Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
12.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
12.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
12.2.1. By Country
12.2.1.1. GCC Countries
12.2.1.2. South Africa
12.2.1.3. Israel
12.2.1.4. Rest of Middle East & Africa
12.2.2. By Type
12.2.3. By Application
12.3. Market Attractiveness Analysis
12.3.1. By Country
12.3.2. By Type
12.3.3. By Application
12.4. Key Takeaways
13. Key Countries Fan-Out Wafer Level Packaging Market Analysis
13.1. USA
13.1.1. Pricing Analysis
13.1.2. Market Share Analysis, 2022
13.1.2.1. By Type
13.1.2.2. By Application
13.2. Canada
13.2.1. Pricing Analysis
13.2.2. Market Share Analysis, 2022
13.2.2.1. By Type
13.2.2.2. By Application
13.3. Brazil
13.3.1. Pricing Analysis
13.3.2. Market Share Analysis, 2022
13.3.2.1. By Type
13.3.2.2. By Application
13.4. Mexico
13.4.1. Pricing Analysis
13.4.2. Market Share Analysis, 2022
13.4.2.1. By Type
13.4.2.2. By Application
13.5. Germany
13.5.1. Pricing Analysis
13.5.2. Market Share Analysis, 2022
13.5.2.1. By Type
13.5.2.2. By Application
13.6. United Kingdom
13.6.1. Pricing Analysis
13.6.2. Market Share Analysis, 2022
13.6.2.1. By Type
13.6.2.2. By Application
13.7. France
13.7.1. Pricing Analysis
13.7.2. Market Share Analysis, 2022
13.7.2.1. By Type
13.7.2.2. By Application
13.8. Spain
13.8.1. Pricing Analysis
13.8.2. Market Share Analysis, 2022
13.8.2.1. By Type
13.8.2.2. By Application
13.9. Italy
13.9.1. Pricing Analysis
13.9.2. Market Share Analysis, 2022
13.9.2.1. By Type
13.9.2.2. By Application
13.10. China
13.10.1. Pricing Analysis
13.10.2. Market Share Analysis, 2022
13.10.2.1. By Type
13.10.2.2. By Application
13.11. Japan
13.11.1. Pricing Analysis
13.11.2. Market Share Analysis, 2022
13.11.2.1. By Type
13.11.2.2. By Application
13.12. South Korea
13.12.1. Pricing Analysis
13.12.2. Market Share Analysis, 2022
13.12.2.1. By Type
13.12.2.2. By Application
13.13. Singapore
13.13.1. Pricing Analysis
13.13.2. Market Share Analysis, 2022
13.13.2.1. By Type
13.13.2.2. By Application
13.14. Thailand
13.14.1. Pricing Analysis
13.14.2. Market Share Analysis, 2022
13.14.2.1. By Type
13.14.2.2. By Application
13.15. Indonesia
13.15.1. Pricing Analysis
13.15.2. Market Share Analysis, 2022
13.15.2.1. By Type
13.15.2.2. By Application
13.16. Australia
13.16.1. Pricing Analysis
13.16.2. Market Share Analysis, 2022
13.16.2.1. By Type
13.16.2.2. By Application
13.17. New Zealand
13.17.1. Pricing Analysis
13.17.2. Market Share Analysis, 2022
13.17.2.1. By Type
13.17.2.2. By Application
13.18. GCC Countries
13.18.1. Pricing Analysis
13.18.2. Market Share Analysis, 2022
13.18.2.1. By Type
13.18.2.2. By Application
13.19. South Africa
13.19.1. Pricing Analysis
13.19.2. Market Share Analysis, 2022
13.19.2.1. By Type
13.19.2.2. By Application
13.20. Israel
13.20.1. Pricing Analysis
13.20.2. Market Share Analysis, 2022
13.20.2.1. By Type
13.20.2.2. By Application
14. Market Structure Analysis
14.1. Competition Dashboard
14.2. Competition Benchmarking
14.3. Market Share Analysis of Top Players
14.3.1. By Regional
14.3.2. By Type
14.3.3. By Application
15. Competition Analysis
15.1. Competition Deep Dive
15.1.1. TSMC
15.1.1.1. Overview
15.1.1.2. Product Portfolio
15.1.1.3. Profitability by Market Segments
15.1.1.4. Sales Footprint
15.1.1.5. Strategy Overview
15.1.1.5.1. Marketing Strategy
15.1.2. ASE Technology Holding Co.
15.1.2.1. Overview
15.1.2.2. Product Portfolio
15.1.2.3. Profitability by Market Segments
15.1.2.4. Sales Footprint
15.1.2.5. Strategy Overview
15.1.2.5.1. Marketing Strategy
15.1.3. JCET Group
15.1.3.1. Overview
15.1.3.2. Product Portfolio
15.1.3.3. Profitability by Market Segments
15.1.3.4. Sales Footprint
15.1.3.5. Strategy Overview
15.1.3.5.1. Marketing Strategy
15.1.4. Amkor Technology
15.1.4.1. Overview
15.1.4.2. Product Portfolio
15.1.4.3. Profitability by Market Segments
15.1.4.4. Sales Footprint
15.1.4.5. Strategy Overview
15.1.4.5.1. Marketing Strategy
15.1.5. Nepes
15.1.5.1. Overview
15.1.5.2. Product Portfolio
15.1.5.3. Profitability by Market Segments
15.1.5.4. Sales Footprint
15.1.5.5. Strategy Overview
15.1.5.5.1. Marketing Strategy
15.1.6. Infineon Technologies
15.1.6.1. Overview
15.1.6.2. Product Portfolio
15.1.6.3. Profitability by Market Segments
15.1.6.4. Sales Footprint
15.1.6.5. Strategy Overview
15.1.6.5.1. Marketing Strategy
15.1.7. NXP Semiconductors NV
15.1.7.1. Overview
15.1.7.2. Product Portfolio
15.1.7.3. Profitability by Market Segments
15.1.7.4. Sales Footprint
15.1.7.5. Strategy Overview
15.1.7.5.1. Marketing Strategy
15.1.8. Samsung Electro-Mechanics
15.1.8.1. Overview
15.1.8.2. Product Portfolio
15.1.8.3. Profitability by Market Segments
15.1.8.4. Sales Footprint
15.1.8.5. Strategy Overview
15.1.8.5.1. Marketing Strategy
15.1.9. Powertech Technology Inc
15.1.9.1. Overview
15.1.9.2. Product Portfolio
15.1.9.3. Profitability by Market Segments
15.1.9.4. Sales Footprint
15.1.9.5. Strategy Overview
15.1.9.5.1. Marketing Strategy
15.1.10. Taiwan Semiconductor Manufacturing Company
15.1.10.1. Overview
15.1.10.2. Product Portfolio
15.1.10.3. Profitability by Market Segments
15.1.10.4. Sales Footprint
15.1.10.5. Strategy Overview
15.1.10.5.1. Marketing Strategy
15.1.11. Renesas Electronics Corporation
15.1.11.1. Overview
15.1.11.2. Product Portfolio
15.1.11.3. Profitability by Market Segments
15.1.11.4. Sales Footprint
15.1.11.5. Strategy Overview
15.1.11.5.1. Marketing Strategy
16. Assumptions & Acronyms Used
17. Research Methodology