▶ 調査レポート

世界の半導体パッケージング材料市場(~2027):種類別、パッケージング技術別、地域別

• 英文タイトル:Semiconductor Packaging Materials Market Research Report by Type, Packaging Technology, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19

360iResearchが調査・発行した産業分析レポートです。世界の半導体パッケージング材料市場(~2027):種類別、パッケージング技術別、地域別 / Semiconductor Packaging Materials Market Research Report by Type, Packaging Technology, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19 / MRC2304J0169資料のイメージです。• レポートコード:MRC2304J0169
• 出版社/出版日:360iResearch / 2022年10月
• レポート形態:英語、PDF、220ページ
• 納品方法:Eメール(受注後2-3日)
• 産業分類:半導体
• 販売価格(消費税別)
  Single User(1名利用、印刷可)¥742,350 (USD4,949)▷ お問い合わせ
  Enterprise License(企業利用、印刷可)¥1,492,350 (USD9,949)▷ お問い合わせ
• ご注文方法:お問い合わせフォーム記入又はEメールでご連絡ください。
• お支払方法:銀行振込(納品後、ご請求書送付)
レポート概要
360iResearch社の当市場調査レポートでは、世界の半導体パッケージング材料市場規模が、2021年329.9億ドルから2022年365.8億ドルへと成長し、更に年平均11.11%増大して2027年までに621.0億ドルに達すると予測しています。当書は、半導体パッケージング材料の世界市場を総合的に分析し、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、種類別(ボンディングワイヤー、セラミックパッケージ、ダイアタッチ材料、封止樹脂、リードフレーム)分析、パッケージング技術別(デュアルフラットノーリード、デュアルインラインパッケージ、グリッドアレイ、クワッドフラットパッケージ、スモールアウトラインパッケージ)分析、地域別(南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他)分析、競争状況、企業情報などの項目をまとめています。なお、当書に掲載されている企業情報には、Amkor Technology Inc.、ASM International NV、BASF SE、ChipMOS TECHNOLOGIES Inc.、DuPont de Nemours Inc.、Henkel AG & Co. KGaA、Heraeus Holding GmbH、Hitachi Ltd.、Honeywell International Inc.、Indium Corporationなどが含まれています。
・序論
・調査方法
・エグゼクティブサマリー
・市場概要
・市場インサイト
・世界の半導体パッケージング材料市場規模:種類別
- ボンディングワイヤーの市場規模
- セラミックパッケージの市場規模
- ダイアタッチ材料の市場規模
- 封止樹脂の市場規模
- リードフレームの市場規模
・世界の半導体パッケージング材料市場規模:パッケージング技術別
- デュアルフラットノーリードの市場規模
- デュアルインラインパッケージの市場規模
- グリッドアレイの市場規模
- クワッドフラットパッケージの市場規模
- スモールアウトラインパッケージの市場規模
・世界の半導体パッケージング材料市場規模:地域別
- 南北アメリカの半導体パッケージング材料市場規模
アメリカの半導体パッケージング材料市場規模
カナダの半導体パッケージング材料市場規模
ブラジルの半導体パッケージング材料市場規模
...
- アジア太平洋の半導体パッケージング材料市場規模
日本の半導体パッケージング材料市場規模
中国の半導体パッケージング材料市場規模
インドの半導体パッケージング材料市場規模
韓国の半導体パッケージング材料市場規模
台湾の半導体パッケージング材料市場規模
...
- ヨーロッパ/中東/アフリカの半導体パッケージング材料市場規模
イギリスの半導体パッケージング材料市場規模
ドイツの半導体パッケージング材料市場規模
フランスの半導体パッケージング材料市場規模
ロシアの半導体パッケージング材料市場規模
...
- その他地域の半導体パッケージング材料市場規模
・競争状況
・企業情報

The Global Semiconductor Packaging Materials Market size was estimated at USD 32.99 billion in 2021 and expected to reach USD 36.58 billion in 2022, and is projected to grow at a CAGR 11.11% to reach USD 62.10 billion by 2027.

Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.

Market Segmentation & Coverage:
This research report categorizes the Semiconductor Packaging Materials to forecast the revenues and analyze the trends in each of the following sub-markets:

Based on Type, the market was studied across Bonding wires, Ceramic Packages, Die Attach Materials, Encapsulation Resins, Leadframes, Organic Substrates, Solder Balls, and Thermal Interface Materials.

Based on Packaging Technology, the market was studied across Dual Flat No Leads, Dual In Line Package, Grid Array, Quad Flat Package, and Small Outline Package.

Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Semiconductor Packaging Materials market considering the current update on the conflict and its global response.

Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Semiconductor Packaging Materials Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.

Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Semiconductor Packaging Materials Market, including Amkor Technology Inc., ASM International NV, BASF SE, ChipMOS TECHNOLOGIES Inc., DuPont de Nemours Inc., Henkel AG & Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corporation, IQE PLC, KC Co., Ltd., Kyocera Corp., LG Innotek, LINTEC Corporation, Mitsui & Co. Ltd., Nan Ya PCB Co. Ltd., Nippon Steel Corp., Powertech Technology Inc., and Shin Etsu Chemical Co., Ltd..

The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:
1. What is the market size and forecast of the Global Semiconductor Packaging Materials Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Semiconductor Packaging Materials Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Semiconductor Packaging Materials Market?
4. What is the competitive strategic window for opportunities in the Global Semiconductor Packaging Materials Market?
5. What are the technology trends and regulatory frameworks in the Global Semiconductor Packaging Materials Market?
6. What is the market share of the leading vendors in the Global Semiconductor Packaging Materials Market?
7. What modes and strategic moves are considered suitable for entering the Global Semiconductor Packaging Materials Market?

レポート目次

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Increasing demand for consumer electronic and wearable devices
5.1.1.2. Rapid digitalization of manufacturing sectors
5.1.1.3. Rising investments in semiconductor production
5.1.2. Restraints
5.1.2.1. Price volatility of semiconductor packaging materials
5.1.3. Opportunities
5.1.3.1. Developments and improvements in semiconductor packaging technology through research
5.1.3.2. Demand for miniaturization of devices and electronic components
5.1.4. Challenges
5.1.4.1. Technical complexities involved in packaging technologies
5.2. Cumulative Impact of COVID-19

6. Semiconductor Packaging Materials Market, by Type
6.1. Introduction
6.2. Bonding wires
6.3. Ceramic Packages
6.4. Die Attach Materials
6.5. Encapsulation Resins
6.6. Leadframes
6.7. Organic Substrates
6.8. Solder Balls
6.9. Thermal Interface Materials

7. Semiconductor Packaging Materials Market, by Packaging Technology
7.1. Introduction
7.2. Dual Flat No Leads
7.3. Dual In Line Package
7.4. Grid Array
7.5. Quad Flat Package
7.6. Small Outline Package

8. Americas Semiconductor Packaging Materials Market
8.1. Introduction
8.2. Argentina
8.3. Brazil
8.4. Canada
8.5. Mexico
8.6. United States

9. Asia-Pacific Semiconductor Packaging Materials Market
9.1. Introduction
9.2. Australia
9.3. China
9.4. India
9.5. Indonesia
9.6. Japan
9.7. Malaysia
9.8. Philippines
9.9. Singapore
9.10. South Korea
9.11. Taiwan
9.12. Thailand
9.13. Vietnam

10. Europe, Middle East & Africa Semiconductor Packaging Materials Market
10.1. Introduction
10.2. Denmark
10.3. Egypt
10.4. Finland
10.5. France
10.6. Germany
10.7. Israel
10.8. Italy
10.9. Netherlands
10.10. Nigeria
10.11. Norway
10.12. Poland
10.13. Qatar
10.14. Russia
10.15. Saudi Arabia
10.16. South Africa
10.17. Spain
10.18. Sweden
10.19. Switzerland
10.20. Turkey
10.21. United Arab Emirates
10.22. United Kingdom

11. Competitive Landscape
11.1. FPNV Positioning Matrix
11.1.1. Quadrants
11.1.2. Business Strategy
11.1.3. Product Satisfaction
11.2. Market Ranking Analysis, By Key Player
11.3. Market Share Analysis, By Key Player
11.4. Competitive Scenario
11.4.1. Merger & Acquisition
11.4.2. Agreement, Collaboration, & Partnership
11.4.3. New Product Launch & Enhancement
11.4.4. Investment & Funding
11.4.5. Award, Recognition, & Expansion

12. Company Usability Profiles
12.1. Amkor Technology Inc.
12.1.1. Business Overview
12.1.2. Key Executives
12.1.3. Product & Services
12.2. ASM International NV
12.2.1. Business Overview
12.2.2. Key Executives
12.2.3. Product & Services
12.3. BASF SE
12.3.1. Business Overview
12.3.2. Key Executives
12.3.3. Product & Services
12.4. ChipMOS TECHNOLOGIES Inc.
12.4.1. Business Overview
12.4.2. Key Executives
12.4.3. Product & Services
12.5. DuPont de Nemours Inc.
12.5.1. Business Overview
12.5.2. Key Executives
12.5.3. Product & Services
12.6. Henkel AG & Co. KGaA
12.6.1. Business Overview
12.6.2. Key Executives
12.6.3. Product & Services
12.7. Heraeus Holding GmbH
12.7.1. Business Overview
12.7.2. Key Executives
12.7.3. Product & Services
12.8. Hitachi Ltd.
12.8.1. Business Overview
12.8.2. Key Executives
12.8.3. Product & Services
12.9. Honeywell International Inc.
12.9.1. Business Overview
12.9.2. Key Executives
12.9.3. Product & Services
12.10. Indium Corporation
12.10.1. Business Overview
12.10.2. Key Executives
12.10.3. Product & Services
12.11. IQE PLC
12.11.1. Business Overview
12.11.2. Key Executives
12.11.3. Product & Services
12.12. KC Co., Ltd.
12.12.1. Business Overview
12.12.2. Key Executives
12.12.3. Product & Services
12.13. Kyocera Corp.
12.13.1. Business Overview
12.13.2. Key Executives
12.13.3. Product & Services
12.14. LG Innotek
12.14.1. Business Overview
12.14.2. Key Executives
12.14.3. Product & Services
12.15. LINTEC Corporation
12.15.1. Business Overview
12.15.2. Key Executives
12.15.3. Product & Services
12.16. Mitsui & Co. Ltd.
12.16.1. Business Overview
12.16.2. Key Executives
12.16.3. Product & Services
12.17. Nan Ya PCB Co. Ltd.
12.17.1. Business Overview
12.17.2. Key Executives
12.17.3. Product & Services
12.18. Nippon Steel Corp.
12.18.1. Business Overview
12.18.2. Key Executives
12.18.3. Product & Services
12.19. Powertech Technology Inc.
12.19.1. Business Overview
12.19.2. Key Executives
12.19.3. Product & Services
12.20. Shin Etsu Chemical Co., Ltd.
12.20.1. Business Overview
12.20.2. Key Executives
12.20.3. Product & Services

13. Appendix
13.1. Discussion Guide
13.2. License & Pricing