▶ 調査レポート

世界のはんだ材料市場(~2027):製品別、種類別、プロセス別、エンドユーザー別、地域別

• 英文タイトル:Solder Materials Market Research Report by Product, Type, Process, End-user, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19

360iResearchが調査・発行した産業分析レポートです。世界のはんだ材料市場(~2027):製品別、種類別、プロセス別、エンドユーザー別、地域別 / Solder Materials Market Research Report by Product, Type, Process, End-user, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19 / MRC2304J0232資料のイメージです。• レポートコード:MRC2304J0232
• 出版社/出版日:360iResearch / 2022年10月
• レポート形態:英語、PDF、258ページ
• 納品方法:Eメール(受注後2-3日)
• 産業分類:材料
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レポート概要
360iResearch社の当市場調査レポートでは、世界のはんだ材料市場規模が、2021年5,198.34百万ドルから2022年6,086.73百万ドルへと成長し、更に年平均17.34%増大して2027年までに13,572.24百万ドルに達すると予測しています。当書は、はんだ材料の世界市場を総合的に分析し、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、製品別(バー、フラックス、ペースト、ワイヤー)分析、種類別(無鉛、有鉛)分析、プロセス別(レーザー、ロボット、スクリーン印刷、ウェーブ/リフロー)分析、エンドユーザー別(自動車、家電、工業)分析、地域別(南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他)分析、競争状況、企業情報などの項目をまとめています。なお、当書に掲載されている企業情報には、AIM Metals & Alloys LP、Electronics Is Fun、Element Solutions Inc、Fusion Inc.、GENMA Europe GmbH、Henkel AG & Co. KGaA、Indium Corporation、Koki Company Limited、Lucas Milhaupt, Inc.、Qualitek International, Inc.、Senju Metal Industry Co., Ltd.などが含まれています。
・序論
・調査方法
・エグゼクティブサマリー
・市場概要
・市場インサイト
・世界のはんだ材料市場規模:製品別
- バーの市場規模
- フラックスの市場規模
- ペーストの市場規模
- ワイヤーの市場規模
・世界のはんだ材料市場規模:種類別
- 無鉛はんだ材料の市場規模
- 有鉛はんだ材料の市場規模
・世界のはんだ材料市場規模:プロセス別
- レーザープロセスの市場規模
- ロボットプロセスの市場規模
- スクリーン印刷プロセスの市場規模
- ウェーブ/リフロープロセスの市場規模
・世界のはんだ材料市場規模:エンドユーザー別
- 自動車における市場規模
- 家電における市場規模
- 工業における市場規模
・世界のはんだ材料市場規模:地域別
- 南北アメリカのはんだ材料市場規模
アメリカのはんだ材料市場規模
カナダのはんだ材料市場規模
ブラジルのはんだ材料市場規模
...
- アジア太平洋のはんだ材料市場規模
日本のはんだ材料市場規模
中国のはんだ材料市場規模
インドのはんだ材料市場規模
韓国のはんだ材料市場規模
台湾のはんだ材料市場規模
...
- ヨーロッパ/中東/アフリカのはんだ材料市場規模
イギリスのはんだ材料市場規模
ドイツのはんだ材料市場規模
フランスのはんだ材料市場規模
ロシアのはんだ材料市場規模
...
- その他地域のはんだ材料市場規模
・競争状況
・企業情報

The Global Solder Materials Market size was estimated at USD 5,198.34 million in 2021 and expected to reach USD 6,086.73 million in 2022, and is projected to grow at a CAGR 17.34% to reach USD 13,572.24 million by 2027.

Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.

Market Segmentation & Coverage:
This research report categorizes the Solder Materials to forecast the revenues and analyze the trends in each of the following sub-markets:

Based on Product, the market was studied across Bar, Flux, Paste, and Wire.

Based on Type, the market was studied across Lead-Free and With Lead.

Based on Process, the market was studied across Laser, Robotic, Screen Printing, and Wave/Reflow.

Based on End-user, the market was studied across Automotive, Consumer Electronics, and Industrial.

Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Solder Materials market considering the current update on the conflict and its global response.

Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Solder Materials Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.

Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Solder Materials Market, including AIM Metals & Alloys LP, Electronics Is Fun, Element Solutions Inc, Fusion Inc., GENMA Europe GmbH, Henkel AG & Co. KGaA, Indium Corporation, Koki Company Limited, Lucas Milhaupt, Inc., Qualitek International, Inc., Senju Metal Industry Co., Ltd., Stannol GmbH & Co. K.G., Tameson BV, Tamura Corporation, and The Dow Chemical Company.

The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:
1. What is the market size and forecast of the Global Solder Materials Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Solder Materials Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Solder Materials Market?
4. What is the competitive strategic window for opportunities in the Global Solder Materials Market?
5. What are the technology trends and regulatory frameworks in the Global Solder Materials Market?
6. What is the market share of the leading vendors in the Global Solder Materials Market?
7. What modes and strategic moves are considered suitable for entering the Global Solder Materials Market?

レポート目次

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Surge in consumer electronics devices and electronics refurbishing industry
5.1.1.2. Demand for lead-free solder alloys
5.1.1.3. Strong growth in the automotive industry
5.1.2. Restraints
5.1.2.1. Limitations of lead-free solders
5.1.3. Opportunities
5.1.3.1. R&D to create advanced solder materials
5.1.3.2. Rising potential of innovative solder materials in EVs
5.1.4. Challenges
5.1.4.1. Fluctuation in raw material prices
5.2. Cumulative Impact of COVID-19

6. Solder Materials Market, by Product
6.1. Introduction
6.2. Bar
6.3. Flux
6.4. Paste
6.5. Wire

7. Solder Materials Market, by Type
7.1. Introduction
7.2. Lead-Free
7.3. With Lead

8. Solder Materials Market, by Process
8.1. Introduction
8.2. Laser
8.3. Robotic
8.4. Screen Printing
8.5. Wave/Reflow

9. Solder Materials Market, by End-user
9.1. Introduction
9.2. Automotive
9.3. Consumer Electronics
9.4. Industrial

10. Americas Solder Materials Market
10.1. Introduction
10.2. Argentina
10.3. Brazil
10.4. Canada
10.5. Mexico
10.6. United States

11. Asia-Pacific Solder Materials Market
11.1. Introduction
11.2. Australia
11.3. China
11.4. India
11.5. Indonesia
11.6. Japan
11.7. Malaysia
11.8. Philippines
11.9. Singapore
11.10. South Korea
11.11. Taiwan
11.12. Thailand
11.13. Vietnam

12. Europe, Middle East & Africa Solder Materials Market
12.1. Introduction
12.2. Denmark
12.3. Egypt
12.4. Finland
12.5. France
12.6. Germany
12.7. Israel
12.8. Italy
12.9. Netherlands
12.10. Nigeria
12.11. Norway
12.12. Poland
12.13. Qatar
12.14. Russia
12.15. Saudi Arabia
12.16. South Africa
12.17. Spain
12.18. Sweden
12.19. Switzerland
12.20. Turkey
12.21. United Arab Emirates
12.22. United Kingdom

13. Competitive Landscape
13.1. FPNV Positioning Matrix
13.1.1. Quadrants
13.1.2. Business Strategy
13.1.3. Product Satisfaction
13.2. Market Ranking Analysis, By Key Player
13.3. Market Share Analysis, By Key Player
13.4. Competitive Scenario
13.4.1. Merger & Acquisition
13.4.2. Agreement, Collaboration, & Partnership
13.4.3. New Product Launch & Enhancement
13.4.4. Investment & Funding
13.4.5. Award, Recognition, & Expansion

14. Company Usability Profiles
14.1. AIM Metals & Alloys LP
14.1.1. Business Overview
14.1.2. Key Executives
14.1.3. Product & Services
14.2. Electronics Is Fun
14.2.1. Business Overview
14.2.2. Key Executives
14.2.3. Product & Services
14.3. Element Solutions Inc
14.3.1. Business Overview
14.3.2. Key Executives
14.3.3. Product & Services
14.4. Fusion Inc.
14.4.1. Business Overview
14.4.2. Key Executives
14.4.3. Product & Services
14.5. GENMA Europe GmbH
14.5.1. Business Overview
14.5.2. Key Executives
14.5.3. Product & Services
14.6. Henkel AG & Co. KGaA
14.6.1. Business Overview
14.6.2. Key Executives
14.6.3. Product & Services
14.7. Indium Corporation
14.7.1. Business Overview
14.7.2. Key Executives
14.7.3. Product & Services
14.8. Koki Company Limited
14.8.1. Business Overview
14.8.2. Key Executives
14.8.3. Product & Services
14.9. Lucas Milhaupt, Inc.
14.9.1. Business Overview
14.9.2. Key Executives
14.9.3. Product & Services
14.10. Qualitek International, Inc.
14.10.1. Business Overview
14.10.2. Key Executives
14.10.3. Product & Services
14.11. Senju Metal Industry Co., Ltd.
14.11.1. Business Overview
14.11.2. Key Executives
14.11.3. Product & Services
14.12. Stannol GmbH & Co. K.G.
14.12.1. Business Overview
14.12.2. Key Executives
14.12.3. Product & Services
14.13. Tameson BV
14.13.1. Business Overview
14.13.2. Key Executives
14.13.3. Product & Services
14.14. Tamura Corporation
14.14.1. Business Overview
14.14.2. Key Executives
14.14.3. Product & Services
14.15. The Dow Chemical Company
14.15.1. Business Overview
14.15.2. Key Executives
14.15.3. Product & Services

15. Appendix
15.1. Discussion Guide
15.2. License & Pricing