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レポート概要
| Transparency Market Research社の本市場調査資料によると、世界の耐放射線エレクトロニクス市場規模が、2023年の15億ドルから2031年には21億ドルまで年平均4.1%成長すると見込まれています。本資料は耐放射線エレクトロニクスの世界市場について広く調査し、序論、仮定、調査方法、エグゼクティブサマリー、市場概要、新型コロナウイルス感染症分析、コンポーネント別（ミックスドシグナルIC、プロセッサー&コントローラー、メモリー、パワーマネージメント、その他）分析、製造技術別（RHBD、RHBP、RHBS）分析、ソリューション別（COTS、カスタム）分析、用途別（宇宙、航空宇宙&防衛、原子力発電所、その他）分析、地域別（北米、ヨーロッパ、アジア太平洋、中東・アフリカ、南米）分析、競争状況、主要ポイントなどをまとめています。また、本資料には、BAE Systems、Cobham Advanced Electronic Solutions (CAES)、Honeywell International Inc.、Infineon Technologies AG、Microchip Technology Inc.、Renesas Electronics Corporation、Solitron Devices, Inc.、STMicroelectronics、Teledyne Technologies Inc.、Texas Instruments Incorporated、TTM Technologies Inc.、Xilinx Inc.などの企業情報が含まれています。 ・序論 ・仮定 ・調査方法 ・エグゼクティブサマリー ・市場概要 ・新型コロナウイルス感染症分析 ・世界の耐放射線エレクトロニクス市場規模：コンポーネント別 - ミックスドシグナルICの市場規模 - プロセッサー&コントローラーの市場規模 - メモリーの市場規模 - パワーマネージメントの市場規模 - その他コンポーネントの市場規模 ・世界の耐放射線エレクトロニクス市場規模：製造技術別 - RHBD技術の市場規模 - RHBP技術の市場規模 - RHBS技術の市場規模 ・世界の耐放射線エレクトロニクス市場規模：ソリューション別 - COTSの市場規模 - オーダーメイドの市場規模 ・世界の耐放射線エレクトロニクス市場規模：用途別 - 宇宙における市場規模 - 航空宇宙&防衛における市場規模 - 原子力発電所における市場規模 - その他用途における市場規模 ・世界の耐放射線エレクトロニクス市場規模：地域別 - 北米の耐放射線エレクトロニクス市場規模 - ヨーロッパの耐放射線エレクトロニクス市場規模 - アジア太平洋の耐放射線エレクトロニクス市場規模 - 中東・アフリカの耐放射線エレクトロニクス市場規模 - 南米の耐放射線エレクトロニクス市場規模 ・競争状況 ・企業情報 ・主要ポイント |
Radiation Hardened Electronics Market – Scope of Report
TMR’s report on the global radiation hardened electronics market studies the past as well as the current growth trends and opportunities to gain valuable insights of the indicators of the market during the forecast period from 2023 to 2031. The report provides revenue of the global radiation hardened electronics market for the period 2017–2031, considering 2023 as the base year and 2031 as the forecast year. The report also provides the compound annual growth rate (CAGR %) of the global radiation hardened electronics market from 2023 to 2031.
The report has been prepared after an extensive research. Primary research involved bulk of the research efforts, wherein analysts carried out interviews with key opinion leaders, industry leaders, and opinion makers. Secondary research involved referring to key players’ product literature, annual reports, press releases, and relevant documents to understand the radiation hardened electronics market.
Secondary research also included Internet sources, statistical data from government agencies, websites, and trade associations. Analysts employed a combination of top-down and bottom-up approaches to study various attributes of the global radiation hardened electronics market.
The report includes an elaborate executive summary, along with a snapshot of the growth behavior of various segments included in the scope of the study. Moreover, the report throws light on the changing competitive dynamics in the global radiation hardened electronics market. These serve as valuable tools for existing market players as well as for entities interested in participating in the global radiation hardened electronics market.
The report delves into the competitive landscape of the global radiation hardened electronics market. Key players operating in the global radiation hardened electronics market have been identified and each one of these has been profiled in terms of various attributes. Company overview, financial standings, recent developments, and SWOT are the attributes of players in the global radiation hardened electronics market profiled in this report.
Key Questions Answered in Global Radiation Hardened Electronics Market Report
• What is the sales/revenue generated by radiation hardened electronics across all regions during the forecast period?
• What are the opportunities in the global radiation hardened electronics market?
• What are the major drivers, restraints, opportunities, and threats in the market?
• Which regional market is set to expand at the fastest CAGR during the forecast period?
• Which segment is expected to generate the highest revenue globally in 2031?
• Which segment is projected to expand at the highest CAGR during the forecast period?
• What are the market positions of different companies operating in the global market?
Radiation Hardened Electronics Market – Research Objectives and Research Approach
The comprehensive report on the global radiation hardened electronics market begins with an overview, followed by the scope and objectives of the study. The report provides detailed explanation of the objectives behind this study and key vendors and distributors operating in the market and regulatory scenario for approval of products.
For reading comprehensibility, the report has been compiled in a chapter-wise layout, with each section divided into smaller ones. The report comprises an exhaustive collection of graphs and tables that are appropriately interspersed. Pictorial representation of actual and projected values of key segments is visually appealing to readers. This also allows comparison of the market shares of key segments in the past and at the end of the forecast period.
The report analyzes the global radiation hardened electronics market in terms of product, end-user, and region. Key segments under each criterion have been studied at length, and the market share for each of these at the end of 2031 has been provided. Such valuable insights enable market stakeholders in making informed business decisions for investment in the global radiation hardened electronics market.
レポート目次1. Preface
1.1. Market Introduction
1.2. Market and Segments Definition
1.3. Market Taxonomy
1.4. Research Methodology
1.5. Assumption and Acronyms
2. Executive Summary
2.1. Global Radiation Hardened Electronics Market Overview
2.2. Regional Outline
2.3. Industry Outline
2.4. Market Dynamics Snapshot
2.5. Competition Blueprint
3. Market Dynamics
3.1. Macro-economic Factors
3.2. Drivers
3.3. Restraints
3.4. Opportunities
3.5. Key Trends
3.6. Regulatory Framework
4. Associated Industry and Key Indicator Assessment
4.1. Parent Industry Overview – Global High Reliability Electronics Industry Overview
4.2. Supply Chain Analysis
4.3. Pricing Analysis
4.4. Technology Roadmap Analysis
4.5. Industry SWOT Analysis
4.6. Porter’s Five Forces Analysis
4.7. COVID-19 Impact and Recovery Analysis
5. Global Radiation Hardened Electronics Market Analysis, By Component
5.1. Radiation Hardened Electronics Market Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Component, 2017–2031
5.1.1. Mixed Signal ICs
5.1.2. Processors & Controllers
5.1.3. Memory
5.1.4. Power Management
5.1.5. Logic
5.1.6. Others (Sensors, etc.)
5.2. Market Attractiveness Analysis, By Component
6. Global Radiation Hardened Electronics Market Analysis, By Manufacturing Technique
6.1. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Manufacturing Technique, 2017–2031
6.1.1. Radiation Hardening by Design (RHBD)
6.1.2. Radiation Hardening by Process (RHBP)
6.1.3. Radiation Hardening by Shielding (RHBS)
6.2. Market Attractiveness Analysis, By Manufacturing Technique
7. Global Radiation Hardened Electronics Market Analysis, By Solution
7.1. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Solution, 2017–2031
7.1.1. Commercial-off-the-Shelf (COTS)
7.1.2. Custom-made
7.2. Market Attractiveness Analysis, By Solution
8. Global Radiation Hardened Electronics Market Analysis, By Application
8.1. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Application, 2017–2031
8.1.1. Space
8.1.2. Aerospace & Defense
8.1.3. Nuclear Power Plant
8.1.4. Others (Research & Development, Metal & Mining, etc.)
8.2. Market Attractiveness Analysis, By Application
9. Global Radiation Hardened Electronics Market Analysis and Forecast, By Region
9.1. Radiation Hardened Electronics Market Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Region, 2017–2031
9.1.1. North America
9.1.2. Europe
9.1.3. Asia Pacific
9.1.4. Middle East & Africa
9.1.5. South America
9.2. Market Attractiveness Analysis, By Region
10. North America Radiation Hardened Electronics Market Analysis and Forecast
10.1. Market Snapshot
10.2. Drivers and Restraints: Impact Analysis
10.3. Radiation Hardened Electronics Market Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Component, 2017–2031
10.3.1. Mixed Signal ICs
10.3.2. Processors & Controllers
10.3.3. Memory
10.3.4. Power Management
10.3.5. Logic
10.3.6. Others (Sensors, etc.)
10.4. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Manufacturing Technique, 2017–2031
10.4.1. Radiation Hardening by Design (RHBD)
10.4.2. Radiation Hardening by Process (RHBP)
10.4.3. Radiation Hardening by Shielding (RHBS)
10.5. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Solution, 2017–2031
10.5.1. Commercial-off-the-Shelf (COTS)
10.5.2. Custom-made
10.6. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Application, 2017–2031
10.6.1. Space
10.6.2. Aerospace & Defense
10.6.3. Nuclear Power Plant
10.6.4. Others (Research & Development, Metal & Mining, etc.)
10.7. Radiation Hardened Electronics Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Country and Sub-region, 2017–2031
10.7.1. U.S.
10.7.2. Canada
10.7.3. Rest of North America
10.8. Market Attractiveness Analysis
10.8.1. By Component
10.8.2. By Manufacturing Technique
10.8.3. By Solution
10.8.4. By Application
10.8.5. By Country/Sub-region
11. Europe Radiation Hardened Electronics Market Analysis and Forecast
11.1. Market Snapshot
11.2. Drivers and Restraints: Impact Analysis
11.3. Radiation Hardened Electronics Market Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Component, 2017–2031
11.3.1. Mixed Signal ICs
11.3.2. Processors & Controllers
11.3.3. Memory
11.3.4. Power Management
11.3.5. Logic
11.3.6. Others (Sensors, etc.)
11.4. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Manufacturing Technique, 2017–2031
11.4.1. Radiation Hardening by Design (RHBD)
11.4.2. Radiation Hardening by Process (RHBP)
11.4.3. Radiation Hardening by Shielding (RHBS)
11.5. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Solution, 2017–2031
11.5.1. Commercial-off-the-Shelf (COTS)
11.5.2. Custom-made
11.6. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Application, 2017–2031
11.6.1. Space
11.6.2. Aerospace & Defense
11.6.3. Nuclear Power Plant
11.6.4. Others (Research & Development, Metal & Mining, etc.)
11.7. Radiation Hardened Electronics Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Country and Sub-region, 2017–2031
11.7.1. U.K.
11.7.2. Germany
11.7.3. France
11.7.4. Rest of Europe
11.8. Market Attractiveness Analysis
11.8.1. By Component
11.8.2. By Manufacturing Technique
11.8.3. By Solution
11.8.4. By Application
11.8.5. By Country/Sub-region
12. Asia Pacific Radiation Hardened Electronics Market Analysis and Forecast
12.1. Market Snapshot
12.2. Drivers and Restraints: Impact Analysis
12.3. Radiation Hardened Electronics Market Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Component, 2017–2031
12.3.1. Mixed Signal ICs
12.3.2. Processors & Controllers
12.3.3. Memory
12.3.4. Power Management
12.3.5. Logic
12.3.6. Others (Sensors, etc.)
12.4. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Manufacturing Technique, 2017–2031
12.4.1. Radiation Hardening by Design (RHBD)
12.4.2. Radiation Hardening by Process (RHBP)
12.4.3. Radiation Hardening by Shielding (RHBS)
12.5. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Solution, 2017–2031
12.5.1. Commercial-off-the-Shelf (COTS)
12.5.2. Custom-made
12.6. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Application, 2017–2031
12.6.1. Space Application
12.6.2. Aerospace & Defense
12.6.3. Nuclear Power Plant
12.6.4. Others (Research & Development, Metal & Mining, etc.)
12.7. Radiation Hardened Electronics Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Country and Sub-region, 2017–2031
12.7.1. China
12.7.2. India
12.7.3. Japan
12.7.4. South Korea
12.7.5. ASEAN
12.7.6. Rest of Asia Pacific
12.8. Market Attractiveness Analysis
12.8.1. By Component
12.8.2. By Manufacturing Technique
12.8.3. By Solution
12.8.4. By Application
12.8.5. By Country/Sub-region
13. Middle East & Africa Radiation Hardened Electronics Market Analysis and Forecast
13.1. Market Snapshot
13.2. Drivers and Restraints: Impact Analysis
13.3. Radiation Hardened Electronics Market Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Component, 2017–2031
13.3.1. Mixed Signal ICs
13.3.2. Processors & Controllers
13.3.3. Memory
13.3.4. Power Management
13.3.5. Logic
13.3.6. Others (Sensors, etc.)
13.4. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Manufacturing Technique, 2017–2031
13.4.1. Radiation Hardening by Design (RHBD)
13.4.2. Radiation Hardening by Process (RHBP)
13.4.3. Radiation Hardening by Shielding (RHBS)
13.5. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Solution, 2017–2031
13.5.1. Commercial-off-the-Shelf (COTS)
13.5.2. Custom-made
13.6. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Application, 2017–2031
13.6.1. Space Application
13.6.2. Aerospace & Defense
13.6.3. Nuclear Power Plant
13.6.4. Others (Research & Development, Metal & Mining, etc.)
13.7. Radiation Hardened Electronics Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Country and Sub-region, 2017–2031
13.7.1. GCC
13.7.2. South Africa
13.7.3. Rest of Middle East & Africa
13.8. Market Attractiveness Analysis
13.8.1. By Component
13.8.2. By Manufacturing Technique
13.8.3. By Solution
13.8.4. By Application
13.8.5. By Country/Sub-region
14. South America Radiation Hardened Electronics Market Analysis and Forecast
14.1. Market Snapshot
14.2. Drivers and Restraints: Impact Analysis
14.3. Radiation Hardened Electronics Market Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Component, 2017–2031
14.3.1. Mixed Signal ICs
14.3.2. Processors & Controllers
14.3.3. Memory
14.3.4. Power Management
14.3.5. Logic
14.3.6. Others (Sensors, etc.)
14.4. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Manufacturing Technique, 2017–2031
14.4.1. Radiation Hardening by Design (RHBD)
14.4.2. Radiation Hardening by Process (RHBP)
14.4.3. Radiation Hardening by Shielding (RHBS)
14.5. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Solution, 2017–2031
14.5.1. Commercial-off-the-Shelf (COTS)
14.5.2. Custom-made
14.6. Radiation Hardened Electronics Market Value (US$ Mn) Analysis & Forecast, By Application, 2017–2031
14.6.1. Space Application
14.6.2. Aerospace & Defense
14.6.3. Nuclear Power Plant
14.6.4. Others (Research & Development, Metal & Mining, etc.)
14.7. Radiation Hardened Electronics Value (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Country and Sub-region, 2017–2031
14.7.1. Brazil
14.7.2. Rest of South America
14.8. Market Attractiveness Analysis
14.8.1. By Component
14.8.2. By Manufacturing Technique
14.8.3. By Solution
14.8.4. By Application
14.8.5. By Country/Sub-region
15. Competition Assessment
15.1. Global Radiation Hardened Electronics Market Competition Matrix – a Dashboard View
15.1.1. Global Radiation Hardened Electronics Market Company Share Analysis, by Value (2022)
15.1.2. Technological Differentiator
16. Company Profiles (Global Manufacturers/Suppliers)
16.1. BAE Systems
16.1.1. Overview
16.1.2. Product Portfolio
16.1.3. Sales Footprint
16.1.4. Key Subsidiaries or Distributors
16.1.5. Strategy and Recent Developments
16.1.6. Key Financials
16.2. Cobham Advanced Electronic Solutions (CAES)
16.2.1. Overview
16.2.2. Product Portfolio
16.2.3. Sales Footprint
16.2.4. Key Subsidiaries or Distributors
16.2.5. Strategy and Recent Developments
16.2.6. Key Financials
16.3. Honeywell International Inc.
16.3.1. Overview
16.3.2. Product Portfolio
16.3.3. Sales Footprint
16.3.4. Key Subsidiaries or Distributors
16.3.5. Strategy and Recent Developments
16.3.6. Key Financials
16.4. Infineon Technologies AG
16.4.1. Overview
16.4.2. Product Portfolio
16.4.3. Sales Footprint
16.4.4. Key Subsidiaries or Distributors
16.4.5. Strategy and Recent Developments
16.4.6. Key Financials
16.5. Microchip Technology Inc.
16.5.1. Overview
16.5.2. Product Portfolio
16.5.3. Sales Footprint
16.5.4. Key Subsidiaries or Distributors
16.5.5. Strategy and Recent Developments
16.5.6. Key Financials
16.6. Renesas Electronics Corporation.
16.6.1. Overview
16.6.2. Product Portfolio
16.6.3. Sales Footprint
16.6.4. Key Subsidiaries or Distributors
16.6.5. Strategy and Recent Developments
16.6.6. Key Financials
16.7. Solitron Devices, Inc.
16.7.1. Overview
16.7.2. Product Portfolio
16.7.3. Sales Footprint
16.7.4. Key Subsidiaries or Distributors
16.7.5. Strategy and Recent Developments
16.7.6. Key Financials
16.8. STMicroelectronics
16.8.1. Overview
16.8.2. Product Portfolio
16.8.3. Sales Footprint
16.8.4. Key Subsidiaries or Distributors
16.8.5. Strategy and Recent Developments
16.8.6. Key Financials
16.9. Teledyne Technologies Inc.
16.9.1. Overview
16.9.2. Product Portfolio
16.9.3. Sales Footprint
16.9.4. Key Subsidiaries or Distributors
16.9.5. Strategy and Recent Developments
16.9.6. Key Financials
16.10. Texas Instruments Incorporated
16.10.1. Overview
16.10.2. Product Portfolio
16.10.3. Sales Footprint
16.10.4. Key Subsidiaries or Distributors
16.10.5. Strategy and Recent Developments
16.10.6. Key Financials
16.11. TTM Technologies Inc.
16.11.1. Overview
16.11.2. Product Portfolio
16.11.3. Sales Footprint
16.11.4. Key Subsidiaries or Distributors
16.11.5. Strategy and Recent Developments
16.11.6. Key Financials
16.12. Xilinx Inc.
16.12.1. Overview
16.12.2. Product Portfolio
16.12.3. Sales Footprint
16.12.4. Key Subsidiaries or Distributors
16.12.5. Strategy and Recent Developments
16.12.6. Key Financials
17. Recommendation
17.1. Opportunity Assessment
17.1.1. By Component
17.1.2. By Manufacturing Technique
17.1.3. By Solution
17.1.4. By Application
17.1.5. By Region