 | • レポートコード：MRC2312MG07629 • 出版社/出版日：Market Monitor Global / 2023年12月 • レポート形態：英文、PDF、64ページ • 納品方法：Eメール（納期：3営業日） • 産業分類：電子＆半導体 |
| Single User | ￥487,500 (USD3,250) | ▷ お問い合わせ |
| Enterprise User | ￥731,250 (USD4,875) | ▷ お問い合わせ |
• お支払方法：銀行振込（納品後、ご請求書送付）
レポート概要
| 当調査レポートは次の情報を含め、世界のMEMSセンサパッケージング市場規模と予測を収録しています。・世界のMEMSセンサパッケージング市場：売上、2018年-2023年、2024年-2029年 ・世界のMEMSセンサパッケージング市場：販売量、2018年-2023年、2024年-2029年 ・世界のトップ5企業、2022年 世界のMEMSセンサパッケージング市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。米国市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「チップレベルパッケージング」セグメントは今後6年間、000%のCAGRで2029年までに000Mドルに成長すると予測されています。 MEMSセンサパッケージングのグローバル主要企業は、Amkor Technology、 Hana Microelectronics、 ASE、 ChipMos Technologies、 Orbotech、 Kyocera Corporation、 AAC Technologies、 JCET Group、 Powertech Technology、 HT-tech、 China Wafer Level CSPなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。 MARKET MONITOR GLOBAL（MMG）は、MEMSセンサパッケージングのメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。 【セグメント別市場分析】 世界のMEMSセンサパッケージング市場：タイプ別、2018年-2023年、2024年-2029年 世界のMEMSセンサパッケージング市場：タイプ別市場シェア、2022年 ・チップレベルパッケージング、デバイスレベルパッケージング、ボードレベルパッケージング、マスターレベルパッケージング 世界のMEMSセンサパッケージング市場：用途別、2018年-2023年、2024年-2029年 世界のMEMSセンサパッケージング市場：用途別市場シェア、2022年 ・ウェアラブルデバイス、スマートホーム、医療、インダストリアル4.0、自動車、スマートシティ、その他 世界のMEMSセンサパッケージング市場：地域・国別、2018年-2023年、2024年-2029年 世界のMEMSセンサパッケージング市場：地域別市場シェア、2022年 ・北米：アメリカ、カナダ、メキシコ ・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア ・アジア：中国、日本、韓国、東南アジア、インド ・南米：ブラジル、アルゼンチン ・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE 【競合分析】 また、当レポートは主要な市場参加者の分析を提供します。 ・主要企業におけるMEMSセンサパッケージングのグローバル売上、2018年-2023年 ・主要企業におけるMEMSセンサパッケージングのグローバル売上シェア、2022年 ・主要企業におけるMEMSセンサパッケージングのグローバル販売量、2018年-2023年 ・主要企業におけるMEMSセンサパッケージングのグローバル販売量シェア、2022年 さらに、当レポートは主要企業のプロファイルを提示します。 Amkor Technology、 Hana Microelectronics、 ASE、 ChipMos Technologies、 Orbotech、 Kyocera Corporation、 AAC Technologies、 JCET Group、 Powertech Technology、 HT-tech、 China Wafer Level CSP ************************************************************* ・調査・分析レポートの概要 MEMSセンサパッケージング市場の定義 市場セグメント 世界のMEMSセンサパッケージング市場概要 当レポートの特徴・ベネフィット 調査手法と情報源 ・世界のMEMSセンサパッケージング市場規模 世界のMEMSセンサパッケージング市場規模：2022年 VS 2029年 世界のMEMSセンサパッケージング市場規模と予測 2018年-2029年 ・競争状況 グローバルトップ企業 売上ベースでのグローバルトップ企業 企業別グローバルでのMEMSセンサパッケージングの売上 グローバルトップ3およびトップ5企業、2022年売上ベース グローバル企業のMEMSセンサパッケージング製品タイプ グローバルにおけるティア1、ティア2、ティア3企業 ・タイプ別市場分析 タイプ区分：チップレベルパッケージング、デバイスレベルパッケージング、ボードレベルパッケージング、マスターレベルパッケージング MEMSセンサパッケージングのタイプ別グローバル売上・予測 ・用途別市場分析 用途区分：ウェアラブルデバイス、スマートホーム、医療、インダストリアル4.0、自動車、スマートシティ、その他 MEMSセンサパッケージングの用途別グローバル売上・予測 ・地域別市場分析 地域別MEMSセンサパッケージング市場規模 2022年と2029年 地域別MEMSセンサパッケージング売上・予測 北米市場：アメリカ、カナダ、メキシコ ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア アジア市場：中国、日本、韓国、東南アジア、インド 南米市場：ブラジル、アルゼンチン 中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE ・主要企業のプロファイル（企業概要、事業概要、主要製品、売上、ニュースなど） Amkor Technology、 Hana Microelectronics、 ASE、 ChipMos Technologies、 Orbotech、 Kyocera Corporation、 AAC Technologies、 JCET Group、 Powertech Technology、 HT-tech、 China Wafer Level CSP ... |
This research report provides a comprehensive analysis of the MEMS Sensor Packaging market, focusing on the current trends, market dynamics, and future prospects. The report explores the global MEMS Sensor Packaging market, including major regions such as North America, Europe, Asia-Pacific, and emerging markets. It also examines key factors driving the growth of MEMS Sensor Packaging, challenges faced by the industry, and potential opportunities for market players.
The global MEMS Sensor Packaging market has witnessed rapid growth in recent years, driven by increasing environmental concerns, government incentives, and advancements in technology. The MEMS Sensor Packaging market presents opportunities for various stakeholders, including Wearable Devices, Smart Home. Collaboration between the private sector and governments can accelerate the development of supportive policies, research and development efforts, and investment in MEMS Sensor Packaging market. Additionally, the growing consumer demand present avenues for market expansion.
The global MEMS Sensor Packaging market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The trend of miniaturization in MEMS is to reduce packaging size. In the wafer level packaging development process of MEMS sensors, the packaging cost accounts for approximately 30% to 40% of the total cost of MEMS sensors. Reducing the packaging size and area can reduce the cost of MEMS sensors and improve their sensitivity.
Key Features:
The research report on the MEMS Sensor Packaging market includes several key features to provide comprehensive insights and facilitate decision-making for stakeholders.
Executive Summary: The report provides overview of the key findings, market trends, and major insights of the MEMS Sensor Packaging market.
Market Overview: The report provides a comprehensive overview of the MEMS Sensor Packaging market, including its definition, historical development, and current market size. It covers market segmentation by Type (e.g., Chip Level Packaging, Device Level Packaging), region, and application, highlighting the key drivers, challenges, and opportunities within each segment.
Market Dynamics: The report analyses the market dynamics driving the growth and development of the MEMS Sensor Packaging market. The report includes an assessment of government policies and regulations, technological advancements, consumer trends and preferences, infrastructure development, and industry collaborations. This analysis helps stakeholders understand the factors influencing the MEMS Sensor Packaging market’s trajectory.
Competitive Landscape: The report provides an in-depth analysis of the competitive landscape within the MEMS Sensor Packaging market. It includes profiles of major market players, their market share, strategies, product portfolios, and recent developments.
Market Segmentation and Forecast: The report segment the MEMS Sensor Packaging market based on various parameters, such as by Type, region, and by Application. It provides market size and growth forecasts for each segment, supported by quantitative data and analysis. This helps stakeholders identify growth opportunities and make informed investment decisions.
Technological Trends: The report should highlight the key technological trends shaping the MEMS Sensor Packaging market, such as advancements in Type One technology and emerging substitutes. It analyses the impact of these trends on market growth, adoption rates, and consumer preferences.
Market Challenges and Opportunities: The report identify and analyses the major challenges faced by the MEMS Sensor Packaging market, such as technical bottleneck, cost limitations, and high entry barrier. It also highlights the opportunities for market growth, such as government incentives, emerging markets, and collaborations between stakeholders.
Regulatory and Policy Analysis: The report should assess the regulatory and policy landscape for MEMS Sensor Packaging, including government incentives, emission standards, and infrastructure development plans. It should analyse the impact of these policies on market growth and provide insights into future regulatory developments.
Recommendations and Conclusion: The report conclude with actionable recommendations for stakeholders, such as Application One Consumer, policymakers, investors, and infrastructure providers. These recommendations should be based on the research findings and address key challenges and opportunities within the MEMS Sensor Packaging market.
Supporting Data and Appendices: The report include supporting data, charts, and graphs to substantiate the analysis and findings. It also includes appendices with additional detailed information, such as data sources, survey questionnaires, and detailed market forecasts.
Market Segmentation
MEMS Sensor Packaging market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Market segment by Type
Chip Level Packaging
Device Level Packaging
Board Level Packaging
Master Level Packaging
Market segment by Application
Wearable Devices
Smart Home
Medical Treatment
Industrial 4.0
Automobile
Smart City
Others
Global MEMS Sensor Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Major players covered
Amkor Technology
Hana Microelectronics
ASE
ChipMos Technologies
Orbotech
Kyocera Corporation
AAC Technologies
JCET Group
Powertech Technology
HT-tech
China Wafer Level CSP
Outline of Major Chapters:
Chapter 1: Introduces the definition of MEMS Sensor Packaging, market overview.
Chapter 2: Global MEMS Sensor Packaging market size in revenue.
Chapter 3: Detailed analysis of MEMS Sensor Packaging company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of MEMS Sensor Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
1 Introduction to Research & Analysis Reports
1.1 MEMS Sensor Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global MEMS Sensor Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global MEMS Sensor Packaging Overall Market Size
2.1 Global MEMS Sensor Packaging Market Size: 2022 VS 2029
2.2 Global MEMS Sensor Packaging Market Size, Prospects & Forecasts: 2018-2029
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top MEMS Sensor Packaging Players in Global Market
3.2 Top Global MEMS Sensor Packaging Companies Ranked by Revenue
3.3 Global MEMS Sensor Packaging Revenue by Companies
3.4 Top 3 and Top 5 MEMS Sensor Packaging Companies in Global Market, by Revenue in 2022
3.5 Global Companies MEMS Sensor Packaging Product Type
3.6 Tier 1, Tier 2 and Tier 3 MEMS Sensor Packaging Players in Global Market
3.6.1 List of Global Tier 1 MEMS Sensor Packaging Companies
3.6.2 List of Global Tier 2 and Tier 3 MEMS Sensor Packaging Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type – Global MEMS Sensor Packaging Market Size Markets, 2022 & 2029
4.1.2 Chip Level Packaging
4.1.3 Device Level Packaging
4.1.4 Board Level Packaging
4.1.5 Master Level Packaging
4.2 By Type – Global MEMS Sensor Packaging Revenue & Forecasts
4.2.1 By Type – Global MEMS Sensor Packaging Revenue, 2018-2023
4.2.2 By Type – Global MEMS Sensor Packaging Revenue, 2024-2029
4.2.3 By Type – Global MEMS Sensor Packaging Revenue Market Share, 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global MEMS Sensor Packaging Market Size, 2022 & 2029
5.1.2 Wearable Devices
5.1.3 Smart Home
5.1.4 Medical Treatment
5.1.5 Industrial 4.0
5.1.6 Automobile
5.1.7 Smart City
5.1.8 Others
5.2 By Application – Global MEMS Sensor Packaging Revenue & Forecasts
5.2.1 By Application – Global MEMS Sensor Packaging Revenue, 2018-2023
5.2.2 By Application – Global MEMS Sensor Packaging Revenue, 2024-2029
5.2.3 By Application – Global MEMS Sensor Packaging Revenue Market Share, 2018-2029
6 Sights by Region
6.1 By Region – Global MEMS Sensor Packaging Market Size, 2022 & 2029
6.2 By Region – Global MEMS Sensor Packaging Revenue & Forecasts
6.2.1 By Region – Global MEMS Sensor Packaging Revenue, 2018-2023
6.2.2 By Region – Global MEMS Sensor Packaging Revenue, 2024-2029
6.2.3 By Region – Global MEMS Sensor Packaging Revenue Market Share, 2018-2029
6.3 North America
6.3.1 By Country – North America MEMS Sensor Packaging Revenue, 2018-2029
6.3.2 US MEMS Sensor Packaging Market Size, 2018-2029
6.3.3 Canada MEMS Sensor Packaging Market Size, 2018-2029
6.3.4 Mexico MEMS Sensor Packaging Market Size, 2018-2029
6.4 Europe
6.4.1 By Country – Europe MEMS Sensor Packaging Revenue, 2018-2029
6.4.2 Germany MEMS Sensor Packaging Market Size, 2018-2029
6.4.3 France MEMS Sensor Packaging Market Size, 2018-2029
6.4.4 U.K. MEMS Sensor Packaging Market Size, 2018-2029
6.4.5 Italy MEMS Sensor Packaging Market Size, 2018-2029
6.4.6 Russia MEMS Sensor Packaging Market Size, 2018-2029
6.4.7 Nordic Countries MEMS Sensor Packaging Market Size, 2018-2029
6.4.8 Benelux MEMS Sensor Packaging Market Size, 2018-2029
6.5 Asia
6.5.1 By Region – Asia MEMS Sensor Packaging Revenue, 2018-2029
6.5.2 China MEMS Sensor Packaging Market Size, 2018-2029
6.5.3 Japan MEMS Sensor Packaging Market Size, 2018-2029
6.5.4 South Korea MEMS Sensor Packaging Market Size, 2018-2029
6.5.5 Southeast Asia MEMS Sensor Packaging Market Size, 2018-2029
6.5.6 India MEMS Sensor Packaging Market Size, 2018-2029
6.6 South America
6.6.1 By Country – South America MEMS Sensor Packaging Revenue, 2018-2029
6.6.2 Brazil MEMS Sensor Packaging Market Size, 2018-2029
6.6.3 Argentina MEMS Sensor Packaging Market Size, 2018-2029
6.7 Middle East & Africa
6.7.1 By Country – Middle East & Africa MEMS Sensor Packaging Revenue, 2018-2029
6.7.2 Turkey MEMS Sensor Packaging Market Size, 2018-2029
6.7.3 Israel MEMS Sensor Packaging Market Size, 2018-2029
6.7.4 Saudi Arabia MEMS Sensor Packaging Market Size, 2018-2029
6.7.5 UAE MEMS Sensor Packaging Market Size, 2018-2029
7 MEMS Sensor Packaging Companies Profiles
7.1 Amkor Technology
7.1.1 Amkor Technology Company Summary
7.1.2 Amkor Technology Business Overview
7.1.3 Amkor Technology MEMS Sensor Packaging Major Product Offerings
7.1.4 Amkor Technology MEMS Sensor Packaging Revenue in Global Market (2018-2023)
7.1.5 Amkor Technology Key News & Latest Developments
7.2 Hana Microelectronics
7.2.1 Hana Microelectronics Company Summary
7.2.2 Hana Microelectronics Business Overview
7.2.3 Hana Microelectronics MEMS Sensor Packaging Major Product Offerings
7.2.4 Hana Microelectronics MEMS Sensor Packaging Revenue in Global Market (2018-2023)
7.2.5 Hana Microelectronics Key News & Latest Developments
7.3 ASE
7.3.1 ASE Company Summary
7.3.2 ASE Business Overview
7.3.3 ASE MEMS Sensor Packaging Major Product Offerings
7.3.4 ASE MEMS Sensor Packaging Revenue in Global Market (2018-2023)
7.3.5 ASE Key News & Latest Developments
7.4 ChipMos Technologies
7.4.1 ChipMos Technologies Company Summary
7.4.2 ChipMos Technologies Business Overview
7.4.3 ChipMos Technologies MEMS Sensor Packaging Major Product Offerings
7.4.4 ChipMos Technologies MEMS Sensor Packaging Revenue in Global Market (2018-2023)
7.4.5 ChipMos Technologies Key News & Latest Developments
7.5 Orbotech
7.5.1 Orbotech Company Summary
7.5.2 Orbotech Business Overview
7.5.3 Orbotech MEMS Sensor Packaging Major Product Offerings
7.5.4 Orbotech MEMS Sensor Packaging Revenue in Global Market (2018-2023)
7.5.5 Orbotech Key News & Latest Developments
7.6 Kyocera Corporation
7.6.1 Kyocera Corporation Company Summary
7.6.2 Kyocera Corporation Business Overview
7.6.3 Kyocera Corporation MEMS Sensor Packaging Major Product Offerings
7.6.4 Kyocera Corporation MEMS Sensor Packaging Revenue in Global Market (2018-2023)
7.6.5 Kyocera Corporation Key News & Latest Developments
7.7 AAC Technologies
7.7.1 AAC Technologies Company Summary
7.7.2 AAC Technologies Business Overview
7.7.3 AAC Technologies MEMS Sensor Packaging Major Product Offerings
7.7.4 AAC Technologies MEMS Sensor Packaging Revenue in Global Market (2018-2023)
7.7.5 AAC Technologies Key News & Latest Developments
7.8 JCET Group
7.8.1 JCET Group Company Summary
7.8.2 JCET Group Business Overview
7.8.3 JCET Group MEMS Sensor Packaging Major Product Offerings
7.8.4 JCET Group MEMS Sensor Packaging Revenue in Global Market (2018-2023)
7.8.5 JCET Group Key News & Latest Developments
7.9 Powertech Technology
7.9.1 Powertech Technology Company Summary
7.9.2 Powertech Technology Business Overview
7.9.3 Powertech Technology MEMS Sensor Packaging Major Product Offerings
7.9.4 Powertech Technology MEMS Sensor Packaging Revenue in Global Market (2018-2023)
7.9.5 Powertech Technology Key News & Latest Developments
7.10 HT-tech
7.10.1 HT-tech Company Summary
7.10.2 HT-tech Business Overview
7.10.3 HT-tech MEMS Sensor Packaging Major Product Offerings
7.10.4 HT-tech MEMS Sensor Packaging Revenue in Global Market (2018-2023)
7.10.5 HT-tech Key News & Latest Developments
7.11 China Wafer Level CSP
7.11.1 China Wafer Level CSP Company Summary
7.11.2 China Wafer Level CSP Business Overview
7.11.3 China Wafer Level CSP MEMS Sensor Packaging Major Product Offerings
7.11.4 China Wafer Level CSP MEMS Sensor Packaging Revenue in Global Market (2018-2023)
7.11.5 China Wafer Level CSP Key News & Latest Developments
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer
