 | • レポートコード：MRC2312MG12784 • 出版社/出版日：Market Monitor Global / 2023年12月 • レポート形態：英文、PDF、148ページ • 納品方法：Eメール（納期：3営業日） • 産業分類：電子＆半導体 |
| Single User | ￥487,500 (USD3,250) | ▷ お問い合わせ |
| Enterprise User | ￥731,250 (USD4,875) | ▷ お問い合わせ |
• お支払方法：銀行振込（納品後、ご請求書送付）
レポート概要
| 当調査レポートは次の情報を含め、世界の自動車用半導体パッケージング市場規模と予測を収録しています。・世界の自動車用半導体パッケージング市場：売上、2018年-2023年、2024年-2029年 ・世界の自動車用半導体パッケージング市場：販売量、2018年-2023年、2024年-2029年 ・世界のトップ5企業、2022年 世界の自動車用半導体パッケージング市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。米国市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「先進型自動車向けパッケージング」セグメントは今後6年間、000%のCAGRで2029年までに000Mドルに成長すると予測されています。 自動車用半導体パッケージングのグローバル主要企業は、NXP、 Infineon (Cypress)、 Renesas、 Texas Instrument、 STMicroelectronics、 Bosch、 onsemi、 Mitsubishi Electric、 Rapidus、 Rohm、 ADI、 Microchip (Microsemi)、 Amkor、 ASE (SPIL)、 UTAC、 JCET (STATS ChipPAC)、 Carsem、 King Yuan Electronics Corp. (KYEC)、 KINGPAK Technology Inc、 Powertech Technology Inc. (PTI)、 SFA Semicon、 Unisem Group、 Chipbond Technology Corporation、 ChipMOS TECHNOLOGIES、 OSE CORP.、 Sigurd Microelectronics、 Natronix Semiconductor Technology、 Nepes、 KESM Industries Berhad、 Forehope Electronic (Ningbo) Co.,Ltd.、 Union Semiconductor（Hefei）Co., Ltd.、 Tongfu Microelectronics (TFME)、 Hefei Chipmore Technology Co.,Ltd.、 HT-tech、 China Wafer Level CSP Co., Ltd、 Ningbo ChipEx Semiconductor Co., Ltd、 Guangdong Leadyo IC Testing、 Unimos Microelectronics (Shanghai)、 Sino Technology、 Taiji Semiconductor (Suzhou)などです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。 MARKET MONITOR GLOBAL（MMG）は、自動車用半導体パッケージングのメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。 【セグメント別市場分析】 世界の自動車用半導体パッケージング市場：タイプ別、2018年-2023年、2024年-2029年 世界の自動車用半導体パッケージング市場：タイプ別市場シェア、2022年 ・先進型自動車向けパッケージング、従来型自動車向けパッケージング 世界の自動車用半導体パッケージング市場：用途別、2018年-2023年、2024年-2029年 世界の自動車用半導体パッケージング市場：用途別市場シェア、2022年 ・自動車OSAT、自動車IDM 世界の自動車用半導体パッケージング市場：地域・国別、2018年-2023年、2024年-2029年 世界の自動車用半導体パッケージング市場：地域別市場シェア、2022年 ・北米：アメリカ、カナダ、メキシコ ・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア ・アジア：中国、日本、韓国、東南アジア、インド ・南米：ブラジル、アルゼンチン ・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE 【競合分析】 また、当レポートは主要な市場参加者の分析を提供します。 ・主要企業における自動車用半導体パッケージングのグローバル売上、2018年-2023年 ・主要企業における自動車用半導体パッケージングのグローバル売上シェア、2022年 ・主要企業における自動車用半導体パッケージングのグローバル販売量、2018年-2023年 ・主要企業における自動車用半導体パッケージングのグローバル販売量シェア、2022年 さらに、当レポートは主要企業のプロファイルを提示します。 NXP、 Infineon (Cypress)、 Renesas、 Texas Instrument、 STMicroelectronics、 Bosch、 onsemi、 Mitsubishi Electric、 Rapidus、 Rohm、 ADI、 Microchip (Microsemi)、 Amkor、 ASE (SPIL)、 UTAC、 JCET (STATS ChipPAC)、 Carsem、 King Yuan Electronics Corp. (KYEC)、 KINGPAK Technology Inc、 Powertech Technology Inc. (PTI)、 SFA Semicon、 Unisem Group、 Chipbond Technology Corporation、 ChipMOS TECHNOLOGIES、 OSE CORP.、 Sigurd Microelectronics、 Natronix Semiconductor Technology、 Nepes、 KESM Industries Berhad、 Forehope Electronic (Ningbo) Co.,Ltd.、 Union Semiconductor（Hefei）Co., Ltd.、 Tongfu Microelectronics (TFME)、 Hefei Chipmore Technology Co.,Ltd.、 HT-tech、 China Wafer Level CSP Co., Ltd、 Ningbo ChipEx Semiconductor Co., Ltd、 Guangdong Leadyo IC Testing、 Unimos Microelectronics (Shanghai)、 Sino Technology、 Taiji Semiconductor (Suzhou) ************************************************************* ・調査・分析レポートの概要 自動車用半導体パッケージング市場の定義 市場セグメント 世界の自動車用半導体パッケージング市場概要 当レポートの特徴・ベネフィット 調査手法と情報源 ・世界の自動車用半導体パッケージング市場規模 世界の自動車用半導体パッケージング市場規模：2022年 VS 2029年 世界の自動車用半導体パッケージング市場規模と予測 2018年-2029年 ・競争状況 グローバルトップ企業 売上ベースでのグローバルトップ企業 企業別グローバルでの自動車用半導体パッケージングの売上 グローバルトップ3およびトップ5企業、2022年売上ベース グローバル企業の自動車用半導体パッケージング製品タイプ グローバルにおけるティア1、ティア2、ティア3企業 ・タイプ別市場分析 タイプ区分：先進型自動車向けパッケージング、従来型自動車向けパッケージング 自動車用半導体パッケージングのタイプ別グローバル売上・予測 ・用途別市場分析 用途区分：自動車OSAT、自動車IDM 自動車用半導体パッケージングの用途別グローバル売上・予測 ・地域別市場分析 地域別自動車用半導体パッケージング市場規模 2022年と2029年 地域別自動車用半導体パッケージング売上・予測 北米市場：アメリカ、カナダ、メキシコ ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア アジア市場：中国、日本、韓国、東南アジア、インド 南米市場：ブラジル、アルゼンチン 中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE ・主要企業のプロファイル（企業概要、事業概要、主要製品、売上、ニュースなど） NXP、 Infineon (Cypress)、 Renesas、 Texas Instrument、 STMicroelectronics、 Bosch、 onsemi、 Mitsubishi Electric、 Rapidus、 Rohm、 ADI、 Microchip (Microsemi)、 Amkor、 ASE (SPIL)、 UTAC、 JCET (STATS ChipPAC)、 Carsem、 King Yuan Electronics Corp. (KYEC)、 KINGPAK Technology Inc、 Powertech Technology Inc. (PTI)、 SFA Semicon、 Unisem Group、 Chipbond Technology Corporation、 ChipMOS TECHNOLOGIES、 OSE CORP.、 Sigurd Microelectronics、 Natronix Semiconductor Technology、 Nepes、 KESM Industries Berhad、 Forehope Electronic (Ningbo) Co.,Ltd.、 Union Semiconductor（Hefei）Co., Ltd.、 Tongfu Microelectronics (TFME)、 Hefei Chipmore Technology Co.,Ltd.、 HT-tech、 China Wafer Level CSP Co., Ltd、 Ningbo ChipEx Semiconductor Co., Ltd、 Guangdong Leadyo IC Testing、 Unimos Microelectronics (Shanghai)、 Sino Technology、 Taiji Semiconductor (Suzhou) ... |
This research report provides a comprehensive analysis of the Automotive Semiconductor Packaging market, focusing on the current trends, market dynamics, and future prospects. The report explores the global Automotive Semiconductor Packaging market, including major regions such as North America, Europe, Asia-Pacific, and emerging markets. It also examines key factors driving the growth of Automotive Semiconductor Packaging, challenges faced by the industry, and potential opportunities for market players.
The global Automotive Semiconductor Packaging market has witnessed rapid growth in recent years, driven by increasing environmental concerns, government incentives, and advancements in technology. The Automotive Semiconductor Packaging market presents opportunities for various stakeholders, including Automotive OSAT, Automotive IDM. Collaboration between the private sector and governments can accelerate the development of supportive policies, research and development efforts, and investment in Automotive Semiconductor Packaging market. Additionally, the growing consumer demand present avenues for market expansion.
The global Automotive Semiconductor Packaging market was valued at US$ 7951 million in 2022 and is projected to reach US$ 14530 million by 2029, at a CAGR of 9.2% during the forecast period.
Currently the key players of Automotive OSAT are Amkor, ASE Group and UTAC, Others Automotive OSAT players are mainly located in China Taiwan, South Korea, China mainland, Southeast Asia (Singapore and Malaysia), including Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, Powertech Technology Inc. (PTI), King Yuan Electronics Corp. (KYEC), OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, SFA Semicon, Unisem Group, Carsem, Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., JCET Group and HT-tech, etc.
Key Features:
The research report on the Automotive Semiconductor Packaging market includes several key features to provide comprehensive insights and facilitate decision-making for stakeholders.
Executive Summary: The report provides overview of the key findings, market trends, and major insights of the Automotive Semiconductor Packaging market.
Market Overview: The report provides a comprehensive overview of the Automotive Semiconductor Packaging market, including its definition, historical development, and current market size. It covers market segmentation by Type (e.g., Advanced Packaging for Automotive, Traditional Packaging for Automotive), region, and application, highlighting the key drivers, challenges, and opportunities within each segment.
Market Dynamics: The report analyses the market dynamics driving the growth and development of the Automotive Semiconductor Packaging market. The report includes an assessment of government policies and regulations, technological advancements, consumer trends and preferences, infrastructure development, and industry collaborations. This analysis helps stakeholders understand the factors influencing the Automotive Semiconductor Packaging market’s trajectory.
Competitive Landscape: The report provides an in-depth analysis of the competitive landscape within the Automotive Semiconductor Packaging market. It includes profiles of major market players, their market share, strategies, product portfolios, and recent developments.
Market Segmentation and Forecast: The report segment the Automotive Semiconductor Packaging market based on various parameters, such as by Type, region, and by Application. It provides market size and growth forecasts for each segment, supported by quantitative data and analysis. This helps stakeholders identify growth opportunities and make informed investment decisions.
Technological Trends: The report should highlight the key technological trends shaping the Automotive Semiconductor Packaging market, such as advancements in Type One technology and emerging substitutes. It analyses the impact of these trends on market growth, adoption rates, and consumer preferences.
Market Challenges and Opportunities: The report identify and analyses the major challenges faced by the Automotive Semiconductor Packaging market, such as technical bottleneck, cost limitations, and high entry barrier. It also highlights the opportunities for market growth, such as government incentives, emerging markets, and collaborations between stakeholders.
Regulatory and Policy Analysis: The report should assess the regulatory and policy landscape for Automotive Semiconductor Packaging, including government incentives, emission standards, and infrastructure development plans. It should analyse the impact of these policies on market growth and provide insights into future regulatory developments.
Recommendations and Conclusion: The report conclude with actionable recommendations for stakeholders, such as Application One Consumer, policymakers, investors, and infrastructure providers. These recommendations should be based on the research findings and address key challenges and opportunities within the Automotive Semiconductor Packaging market.
Supporting Data and Appendices: The report include supporting data, charts, and graphs to substantiate the analysis and findings. It also includes appendices with additional detailed information, such as data sources, survey questionnaires, and detailed market forecasts.
Market Segmentation
Automotive Semiconductor Packaging market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Market segment by Type
Advanced Packaging for Automotive
Traditional Packaging for Automotive
Market segment by Application
Automotive OSAT
Automotive IDM
Global Automotive Semiconductor Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Major players covered
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
onsemi
Mitsubishi Electric
Rapidus
Rohm
ADI
Microchip (Microsemi)
Amkor
ASE (SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor（Hefei）Co., Ltd.
Tongfu Microelectronics (TFME)
Hefei Chipmore Technology Co.,Ltd.
HT-tech
China Wafer Level CSP Co., Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)
Outline of Major Chapters:
Chapter 1: Introduces the definition of Automotive Semiconductor Packaging, market overview.
Chapter 2: Global Automotive Semiconductor Packaging market size in revenue.
Chapter 3: Detailed analysis of Automotive Semiconductor Packaging company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Automotive Semiconductor Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
1 Introduction to Research & Analysis Reports
1.1 Automotive Semiconductor Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Automotive Semiconductor Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Automotive Semiconductor Packaging Overall Market Size
2.1 Global Automotive Semiconductor Packaging Market Size: 2022 VS 2029
2.2 Global Automotive Semiconductor Packaging Market Size, Prospects & Forecasts: 2018-2029
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Automotive Semiconductor Packaging Players in Global Market
3.2 Top Global Automotive Semiconductor Packaging Companies Ranked by Revenue
3.3 Global Automotive Semiconductor Packaging Revenue by Companies
3.4 Top 3 and Top 5 Automotive Semiconductor Packaging Companies in Global Market, by Revenue in 2022
3.5 Global Companies Automotive Semiconductor Packaging Product Type
3.6 Tier 1, Tier 2 and Tier 3 Automotive Semiconductor Packaging Players in Global Market
3.6.1 List of Global Tier 1 Automotive Semiconductor Packaging Companies
3.6.2 List of Global Tier 2 and Tier 3 Automotive Semiconductor Packaging Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type – Global Automotive Semiconductor Packaging Market Size Markets, 2022 & 2029
4.1.2 Advanced Packaging for Automotive
4.1.3 Traditional Packaging for Automotive
4.2 By Type – Global Automotive Semiconductor Packaging Revenue & Forecasts
4.2.1 By Type – Global Automotive Semiconductor Packaging Revenue, 2018-2023
4.2.2 By Type – Global Automotive Semiconductor Packaging Revenue, 2024-2029
4.2.3 By Type – Global Automotive Semiconductor Packaging Revenue Market Share, 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Automotive Semiconductor Packaging Market Size, 2022 & 2029
5.1.2 Automotive OSAT
5.1.3 Automotive IDM
5.2 By Application – Global Automotive Semiconductor Packaging Revenue & Forecasts
5.2.1 By Application – Global Automotive Semiconductor Packaging Revenue, 2018-2023
5.2.2 By Application – Global Automotive Semiconductor Packaging Revenue, 2024-2029
5.2.3 By Application – Global Automotive Semiconductor Packaging Revenue Market Share, 2018-2029
6 Sights by Region
6.1 By Region – Global Automotive Semiconductor Packaging Market Size, 2022 & 2029
6.2 By Region – Global Automotive Semiconductor Packaging Revenue & Forecasts
6.2.1 By Region – Global Automotive Semiconductor Packaging Revenue, 2018-2023
6.2.2 By Region – Global Automotive Semiconductor Packaging Revenue, 2024-2029
6.2.3 By Region – Global Automotive Semiconductor Packaging Revenue Market Share, 2018-2029
6.3 North America
6.3.1 By Country – North America Automotive Semiconductor Packaging Revenue, 2018-2029
6.3.2 US Automotive Semiconductor Packaging Market Size, 2018-2029
6.3.3 Canada Automotive Semiconductor Packaging Market Size, 2018-2029
6.3.4 Mexico Automotive Semiconductor Packaging Market Size, 2018-2029
6.4 Europe
6.4.1 By Country – Europe Automotive Semiconductor Packaging Revenue, 2018-2029
6.4.2 Germany Automotive Semiconductor Packaging Market Size, 2018-2029
6.4.3 France Automotive Semiconductor Packaging Market Size, 2018-2029
6.4.4 U.K. Automotive Semiconductor Packaging Market Size, 2018-2029
6.4.5 Italy Automotive Semiconductor Packaging Market Size, 2018-2029
6.4.6 Russia Automotive Semiconductor Packaging Market Size, 2018-2029
6.4.7 Nordic Countries Automotive Semiconductor Packaging Market Size, 2018-2029
6.4.8 Benelux Automotive Semiconductor Packaging Market Size, 2018-2029
6.5 Asia
6.5.1 By Region – Asia Automotive Semiconductor Packaging Revenue, 2018-2029
6.5.2 China Automotive Semiconductor Packaging Market Size, 2018-2029
6.5.3 Japan Automotive Semiconductor Packaging Market Size, 2018-2029
6.5.4 South Korea Automotive Semiconductor Packaging Market Size, 2018-2029
6.5.5 Southeast Asia Automotive Semiconductor Packaging Market Size, 2018-2029
6.5.6 India Automotive Semiconductor Packaging Market Size, 2018-2029
6.6 South America
6.6.1 By Country – South America Automotive Semiconductor Packaging Revenue, 2018-2029
6.6.2 Brazil Automotive Semiconductor Packaging Market Size, 2018-2029
6.6.3 Argentina Automotive Semiconductor Packaging Market Size, 2018-2029
6.7 Middle East & Africa
6.7.1 By Country – Middle East & Africa Automotive Semiconductor Packaging Revenue, 2018-2029
6.7.2 Turkey Automotive Semiconductor Packaging Market Size, 2018-2029
6.7.3 Israel Automotive Semiconductor Packaging Market Size, 2018-2029
6.7.4 Saudi Arabia Automotive Semiconductor Packaging Market Size, 2018-2029
6.7.5 UAE Automotive Semiconductor Packaging Market Size, 2018-2029
7 Automotive Semiconductor Packaging Companies Profiles
7.1 NXP
7.1.1 NXP Company Summary
7.1.2 NXP Business Overview
7.1.3 NXP Automotive Semiconductor Packaging Major Product Offerings
7.1.4 NXP Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.1.5 NXP Key News & Latest Developments
7.2 Infineon (Cypress)
7.2.1 Infineon (Cypress) Company Summary
7.2.2 Infineon (Cypress) Business Overview
7.2.3 Infineon (Cypress) Automotive Semiconductor Packaging Major Product Offerings
7.2.4 Infineon (Cypress) Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.2.5 Infineon (Cypress) Key News & Latest Developments
7.3 Renesas
7.3.1 Renesas Company Summary
7.3.2 Renesas Business Overview
7.3.3 Renesas Automotive Semiconductor Packaging Major Product Offerings
7.3.4 Renesas Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.3.5 Renesas Key News & Latest Developments
7.4 Texas Instrument
7.4.1 Texas Instrument Company Summary
7.4.2 Texas Instrument Business Overview
7.4.3 Texas Instrument Automotive Semiconductor Packaging Major Product Offerings
7.4.4 Texas Instrument Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.4.5 Texas Instrument Key News & Latest Developments
7.5 STMicroelectronics
7.5.1 STMicroelectronics Company Summary
7.5.2 STMicroelectronics Business Overview
7.5.3 STMicroelectronics Automotive Semiconductor Packaging Major Product Offerings
7.5.4 STMicroelectronics Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.5.5 STMicroelectronics Key News & Latest Developments
7.6 Bosch
7.6.1 Bosch Company Summary
7.6.2 Bosch Business Overview
7.6.3 Bosch Automotive Semiconductor Packaging Major Product Offerings
7.6.4 Bosch Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.6.5 Bosch Key News & Latest Developments
7.7 onsemi
7.7.1 onsemi Company Summary
7.7.2 onsemi Business Overview
7.7.3 onsemi Automotive Semiconductor Packaging Major Product Offerings
7.7.4 onsemi Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.7.5 onsemi Key News & Latest Developments
7.8 Mitsubishi Electric
7.8.1 Mitsubishi Electric Company Summary
7.8.2 Mitsubishi Electric Business Overview
7.8.3 Mitsubishi Electric Automotive Semiconductor Packaging Major Product Offerings
7.8.4 Mitsubishi Electric Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.8.5 Mitsubishi Electric Key News & Latest Developments
7.9 Rapidus
7.9.1 Rapidus Company Summary
7.9.2 Rapidus Business Overview
7.9.3 Rapidus Automotive Semiconductor Packaging Major Product Offerings
7.9.4 Rapidus Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.9.5 Rapidus Key News & Latest Developments
7.10 Rohm
7.10.1 Rohm Company Summary
7.10.2 Rohm Business Overview
7.10.3 Rohm Automotive Semiconductor Packaging Major Product Offerings
7.10.4 Rohm Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.10.5 Rohm Key News & Latest Developments
7.11 ADI
7.11.1 ADI Company Summary
7.11.2 ADI Business Overview
7.11.3 ADI Automotive Semiconductor Packaging Major Product Offerings
7.11.4 ADI Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.11.5 ADI Key News & Latest Developments
7.12 Microchip (Microsemi)
7.12.1 Microchip (Microsemi) Company Summary
7.12.2 Microchip (Microsemi) Business Overview
7.12.3 Microchip (Microsemi) Automotive Semiconductor Packaging Major Product Offerings
7.12.4 Microchip (Microsemi) Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.12.5 Microchip (Microsemi) Key News & Latest Developments
7.13 Amkor
7.13.1 Amkor Company Summary
7.13.2 Amkor Business Overview
7.13.3 Amkor Automotive Semiconductor Packaging Major Product Offerings
7.13.4 Amkor Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.13.5 Amkor Key News & Latest Developments
7.14 ASE (SPIL)
7.14.1 ASE (SPIL) Company Summary
7.14.2 ASE (SPIL) Business Overview
7.14.3 ASE (SPIL) Automotive Semiconductor Packaging Major Product Offerings
7.14.4 ASE (SPIL) Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.14.5 ASE (SPIL) Key News & Latest Developments
7.15 UTAC
7.15.1 UTAC Company Summary
7.15.2 UTAC Business Overview
7.15.3 UTAC Automotive Semiconductor Packaging Major Product Offerings
7.15.4 UTAC Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.15.5 UTAC Key News & Latest Developments
7.16 JCET (STATS ChipPAC)
7.16.1 JCET (STATS ChipPAC) Company Summary
7.16.2 JCET (STATS ChipPAC) Business Overview
7.16.3 JCET (STATS ChipPAC) Automotive Semiconductor Packaging Major Product Offerings
7.16.4 JCET (STATS ChipPAC) Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.16.5 JCET (STATS ChipPAC) Key News & Latest Developments
7.17 Carsem
7.17.1 Carsem Company Summary
7.17.2 Carsem Business Overview
7.17.3 Carsem Automotive Semiconductor Packaging Major Product Offerings
7.17.4 Carsem Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.17.5 Carsem Key News & Latest Developments
7.18 King Yuan Electronics Corp. (KYEC)
7.18.1 King Yuan Electronics Corp. (KYEC) Company Summary
7.18.2 King Yuan Electronics Corp. (KYEC) Business Overview
7.18.3 King Yuan Electronics Corp. (KYEC) Automotive Semiconductor Packaging Major Product Offerings
7.18.4 King Yuan Electronics Corp. (KYEC) Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.18.5 King Yuan Electronics Corp. (KYEC) Key News & Latest Developments
7.19 KINGPAK Technology Inc
7.19.1 KINGPAK Technology Inc Company Summary
7.19.2 KINGPAK Technology Inc Business Overview
7.19.3 KINGPAK Technology Inc Automotive Semiconductor Packaging Major Product Offerings
7.19.4 KINGPAK Technology Inc Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.19.5 KINGPAK Technology Inc Key News & Latest Developments
7.20 Powertech Technology Inc. (PTI)
7.20.1 Powertech Technology Inc. (PTI) Company Summary
7.20.2 Powertech Technology Inc. (PTI) Business Overview
7.20.3 Powertech Technology Inc. (PTI) Automotive Semiconductor Packaging Major Product Offerings
7.20.4 Powertech Technology Inc. (PTI) Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.20.5 Powertech Technology Inc. (PTI) Key News & Latest Developments
7.21 SFA Semicon
7.21.1 SFA Semicon Company Summary
7.21.2 SFA Semicon Business Overview
7.21.3 SFA Semicon Automotive Semiconductor Packaging Major Product Offerings
7.21.4 SFA Semicon Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.21.5 SFA Semicon Key News & Latest Developments
7.22 Unisem Group
7.22.1 Unisem Group Company Summary
7.22.2 Unisem Group Business Overview
7.22.3 Unisem Group Automotive Semiconductor Packaging Major Product Offerings
7.22.4 Unisem Group Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.22.5 Unisem Group Key News & Latest Developments
7.23 Chipbond Technology Corporation
7.23.1 Chipbond Technology Corporation Company Summary
7.23.2 Chipbond Technology Corporation Business Overview
7.23.3 Chipbond Technology Corporation Automotive Semiconductor Packaging Major Product Offerings
7.23.4 Chipbond Technology Corporation Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.23.5 Chipbond Technology Corporation Key News & Latest Developments
7.24 ChipMOS TECHNOLOGIES
7.24.1 ChipMOS TECHNOLOGIES Company Summary
7.24.2 ChipMOS TECHNOLOGIES Business Overview
7.24.3 ChipMOS TECHNOLOGIES Automotive Semiconductor Packaging Major Product Offerings
7.24.4 ChipMOS TECHNOLOGIES Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.24.5 ChipMOS TECHNOLOGIES Key News & Latest Developments
7.25 OSE CORP.
7.25.1 OSE CORP. Company Summary
7.25.2 OSE CORP. Business Overview
7.25.3 OSE CORP. Automotive Semiconductor Packaging Major Product Offerings
7.25.4 OSE CORP. Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.25.5 OSE CORP. Key News & Latest Developments
7.26 Sigurd Microelectronics
7.26.1 Sigurd Microelectronics Company Summary
7.26.2 Sigurd Microelectronics Business Overview
7.26.3 Sigurd Microelectronics Automotive Semiconductor Packaging Major Product Offerings
7.26.4 Sigurd Microelectronics Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.26.5 Sigurd Microelectronics Key News & Latest Developments
7.27 Natronix Semiconductor Technology
7.27.1 Natronix Semiconductor Technology Company Summary
7.27.2 Natronix Semiconductor Technology Business Overview
7.27.3 Natronix Semiconductor Technology Automotive Semiconductor Packaging Major Product Offerings
7.27.4 Natronix Semiconductor Technology Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.27.5 Natronix Semiconductor Technology Key News & Latest Developments
7.28 Nepes
7.28.1 Nepes Company Summary
7.28.2 Nepes Business Overview
7.28.3 Nepes Automotive Semiconductor Packaging Major Product Offerings
7.28.4 Nepes Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.28.5 Nepes Key News & Latest Developments
7.29 KESM Industries Berhad
7.29.1 KESM Industries Berhad Company Summary
7.29.2 KESM Industries Berhad Business Overview
7.29.3 KESM Industries Berhad Automotive Semiconductor Packaging Major Product Offerings
7.29.4 KESM Industries Berhad Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.29.5 KESM Industries Berhad Key News & Latest Developments
7.30 Forehope Electronic (Ningbo) Co.,Ltd.
7.30.1 Forehope Electronic (Ningbo) Co.,Ltd. Company Summary
7.30.2 Forehope Electronic (Ningbo) Co.,Ltd. Business Overview
7.30.3 Forehope Electronic (Ningbo) Co.,Ltd. Automotive Semiconductor Packaging Major Product Offerings
7.30.4 Forehope Electronic (Ningbo) Co.,Ltd. Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.30.5 Forehope Electronic (Ningbo) Co.,Ltd. Key News & Latest Developments
7.31 Union Semiconductor（Hefei）Co., Ltd.
7.31.1 Union Semiconductor（Hefei）Co., Ltd. Company Summary
7.31.2 Union Semiconductor（Hefei）Co., Ltd. Business Overview
7.31.3 Union Semiconductor（Hefei）Co., Ltd. Automotive Semiconductor Packaging Major Product Offerings
7.31.4 Union Semiconductor（Hefei）Co., Ltd. Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.31.5 Union Semiconductor（Hefei）Co., Ltd. Key News & Latest Developments
7.32 Tongfu Microelectronics (TFME)
7.32.1 Tongfu Microelectronics (TFME) Company Summary
7.32.2 Tongfu Microelectronics (TFME) Business Overview
7.32.3 Tongfu Microelectronics (TFME) Automotive Semiconductor Packaging Major Product Offerings
7.32.4 Tongfu Microelectronics (TFME) Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.32.5 Tongfu Microelectronics (TFME) Key News & Latest Developments
7.33 Hefei Chipmore Technology Co.,Ltd.
7.33.1 Hefei Chipmore Technology Co.,Ltd. Company Summary
7.33.2 Hefei Chipmore Technology Co.,Ltd. Business Overview
7.33.3 Hefei Chipmore Technology Co.,Ltd. Automotive Semiconductor Packaging Major Product Offerings
7.33.4 Hefei Chipmore Technology Co.,Ltd. Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.33.5 Hefei Chipmore Technology Co.,Ltd. Key News & Latest Developments
7.34 HT-tech
7.34.1 HT-tech Company Summary
7.34.2 HT-tech Business Overview
7.34.3 HT-tech Automotive Semiconductor Packaging Major Product Offerings
7.34.4 HT-tech Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.34.5 HT-tech Key News & Latest Developments
7.35 China Wafer Level CSP Co., Ltd
7.35.1 China Wafer Level CSP Co., Ltd Company Summary
7.35.2 China Wafer Level CSP Co., Ltd Business Overview
7.35.3 China Wafer Level CSP Co., Ltd Automotive Semiconductor Packaging Major Product Offerings
7.35.4 China Wafer Level CSP Co., Ltd Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.35.5 China Wafer Level CSP Co., Ltd Key News & Latest Developments
7.36 Ningbo ChipEx Semiconductor Co., Ltd
7.36.1 Ningbo ChipEx Semiconductor Co., Ltd Company Summary
7.36.2 Ningbo ChipEx Semiconductor Co., Ltd Business Overview
7.36.3 Ningbo ChipEx Semiconductor Co., Ltd Automotive Semiconductor Packaging Major Product Offerings
7.36.4 Ningbo ChipEx Semiconductor Co., Ltd Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.36.5 Ningbo ChipEx Semiconductor Co., Ltd Key News & Latest Developments
7.37 Guangdong Leadyo IC Testing
7.37.1 Guangdong Leadyo IC Testing Company Summary
7.37.2 Guangdong Leadyo IC Testing Business Overview
7.37.3 Guangdong Leadyo IC Testing Automotive Semiconductor Packaging Major Product Offerings
7.37.4 Guangdong Leadyo IC Testing Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.37.5 Guangdong Leadyo IC Testing Key News & Latest Developments
7.38 Unimos Microelectronics (Shanghai)
7.38.1 Unimos Microelectronics (Shanghai) Company Summary
7.38.2 Unimos Microelectronics (Shanghai) Business Overview
7.38.3 Unimos Microelectronics (Shanghai) Automotive Semiconductor Packaging Major Product Offerings
7.38.4 Unimos Microelectronics (Shanghai) Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.38.5 Unimos Microelectronics (Shanghai) Key News & Latest Developments
7.39 Sino Technology
7.39.1 Sino Technology Company Summary
7.39.2 Sino Technology Business Overview
7.39.3 Sino Technology Automotive Semiconductor Packaging Major Product Offerings
7.39.4 Sino Technology Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.39.5 Sino Technology Key News & Latest Developments
7.40 Taiji Semiconductor (Suzhou)
7.40.1 Taiji Semiconductor (Suzhou) Company Summary
7.40.2 Taiji Semiconductor (Suzhou) Business Overview
7.40.3 Taiji Semiconductor (Suzhou) Automotive Semiconductor Packaging Major Product Offerings
7.40.4 Taiji Semiconductor (Suzhou) Automotive Semiconductor Packaging Revenue in Global Market (2018-2023)
7.40.5 Taiji Semiconductor (Suzhou) Key News & Latest Developments
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer