 | • レポートコード：MRC23Q34588 • 出版社/出版日：QYResearch / 2023年3月 • レポート形態：英文、PDF、90ページ • 納品方法：Eメール（2-3日） • 産業分類：産業機械 |
| Single User | ￥420,500 (USD2,900) | ▷ お問い合わせ |
| Enterprise License | ￥841,000 (USD5,800) | ▷ お問い合わせ |
• お支払方法：銀行振込（納品後、ご請求書送付）
レポート概要
| 本調査レポートは世界の常温ウェーハ接合機市場について調査・分析し、世界の常温ウェーハ接合機市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析（全自動、半自動）、用途別セグメント分析（半導体産業、太陽光発電産業、その他）、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、Nidec Corporation、Mitsubishi Heavy Industries, Ltd.、EV Group、Adamant Namiki、Canon、Applied Microengineering、SET Corporation SA、Ayumi Industry Co., Ltd.、Kyodo International, Inc.、Bondtech Co., Ltd.などが含まれています。世界の常温ウェーハ接合機市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争による影響は、常温ウェーハ接合機市場規模を推定する際に考慮しました。本レポートは、常温ウェーハ接合機の世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、常温ウェーハ接合機に関するビジネス上の意思決定に役立てることを目的としています。 ・常温ウェーハ接合機市場の概要 - 製品の定義 - 常温ウェーハ接合機のタイプ別セグメント - 世界の常温ウェーハ接合機市場成長率のタイプ別分析（全自動、半自動） - 常温ウェーハ接合機の用途別セグメント - 世界の常温ウェーハ接合機市場成長率の用途別分析（半導体産業、太陽光発電産業、その他） - 世界市場の成長展望 - 世界の常温ウェーハ接合機生産量の推定と予測（2018年-2029年） - 世界の常温ウェーハ接合機生産能力の推定と予測（2018年-2029年） - 常温ウェーハ接合機の平均価格の推定と予測（2018年-2029年） - 前提条件と制限事項 ・メーカー別競争状況 - メーカー別市場シェア - 世界の主要メーカー、業界ランキング分析 - メーカー別平均価格 - 常温ウェーハ接合機市場の競争状況およびトレンド ・常温ウェーハ接合機の地域別生産量 - 常温ウェーハ接合機生産量の地域別推計と予測（2018年-2029年） - 地域別常温ウェーハ接合機価格分析（2018年-2023年） - 北米の常温ウェーハ接合機生産規模（2018年-2029年） - ヨーロッパの常温ウェーハ接合機生産規模（2018年-2029年） - 中国の常温ウェーハ接合機生産規模（2018年-2029年） - 日本の常温ウェーハ接合機生産規模（2018年-2029年） - 韓国の常温ウェーハ接合機生産規模（2018年-2029年） - インドの常温ウェーハ接合機生産規模（2018年-2029年） ・常温ウェーハ接合機の地域別消費量 - 常温ウェーハ接合機消費量の地域別推計と予測（2018年-2029年） - 北米の常温ウェーハ接合機消費量（2018年-2029年） - アメリカの常温ウェーハ接合機消費量（2018年-2029年） - ヨーロッパの常温ウェーハ接合機消費量（2018年-2029年） - アジア太平洋の常温ウェーハ接合機消費量（2018年-2029年） - 中国の常温ウェーハ接合機消費量（2018年-2029年） - 日本の常温ウェーハ接合機消費量（2018年-2029年） - 韓国の常温ウェーハ接合機消費量（2018年-2029年） - 東南アジアの常温ウェーハ接合機消費量（2018年-2029年） - インドの常温ウェーハ接合機消費量（2018年-2029年） - 中南米・中東・アフリカの常温ウェーハ接合機消費量（2018年-2029年） ・タイプ別セグメント：全自動、半自動 - 世界の常温ウェーハ接合機のタイプ別生産量（2018年-2023年） - 世界の常温ウェーハ接合機のタイプ別生産量（2024年-2029年） - 世界の常温ウェーハ接合機のタイプ別価格 ・用途別セグメント：半導体産業、太陽光発電産業、その他 - 世界の常温ウェーハ接合機の用途別生産量（2018年-2023年） - 世界の常温ウェーハ接合機の用途別生産量（2024年-2029年） - 世界の常温ウェーハ接合機の用途別価格 ・主要企業のプロファイル：企業情報、製品ポートフォリオ、生産量、価格、動向 Nidec Corporation、Mitsubishi Heavy Industries, Ltd.、EV Group、Adamant Namiki、Canon、Applied Microengineering、SET Corporation SA、Ayumi Industry Co., Ltd.、Kyodo International, Inc.、Bondtech Co., Ltd. ・産業チェーンと販売チャネルの分析 - 常温ウェーハ接合機産業チェーン分析 - 常温ウェーハ接合機の主要原材料 - 常温ウェーハ接合機の販売チャネル - 常温ウェーハ接合機のディストリビューター - 常温ウェーハ接合機の主要顧客 ・常温ウェーハ接合機市場ダイナミクス - 常温ウェーハ接合機の業界動向 - 常温ウェーハ接合機市場の成長ドライバ、課題、阻害要因 ・調査成果および結論 ・調査方法とデータソース |
A Wafer Bonding Machine is a Precision Machine Tool Used to Manufacture Microelectromechanical Systems and Other Similar Technologies. Room Temperature Wafer Bonders Are Used to Package Two or More Substrates Together on a Wafer Level at Room Temperature.
The global Room Temperature Wafer Bonding Machines market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Room Temperature Wafer Bonding Machines is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Room Temperature Wafer Bonding Machines is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Room Temperature Wafer Bonding Machines include Nidec Corporation, Mitsubishi Heavy Industries, Ltd., EV Group, Adamant Namiki, Canon, Applied Microengineering, SET Corporation SA, Ayumi Industry Co., Ltd. and Kyodo International, Inc., etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Room Temperature Wafer Bonding Machines, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Room Temperature Wafer Bonding Machines.
The Room Temperature Wafer Bonding Machines market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Room Temperature Wafer Bonding Machines market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Room Temperature Wafer Bonding Machines manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Nidec Corporation
Mitsubishi Heavy Industries, Ltd.
EV Group
Adamant Namiki
Canon
Applied Microengineering
SET Corporation SA
Ayumi Industry Co., Ltd.
Kyodo International, Inc.
Bondtech Co., Ltd.
Segment by Type
Fully Automatic
Semi Automatic
Segment by Application
Semiconductor Industry
PV Industry
Others
Production by Region
North America
Europe
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Room Temperature Wafer Bonding Machines manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Room Temperature Wafer Bonding Machines by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Room Temperature Wafer Bonding Machines in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
1 Room Temperature Wafer Bonding Machines Market Overview
1.1 Product Definition
1.2 Room Temperature Wafer Bonding Machines Segment by Type
1.2.1 Global Room Temperature Wafer Bonding Machines Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Fully Automatic
1.2.3 Semi Automatic
1.3 Room Temperature Wafer Bonding Machines Segment by Application
1.3.1 Global Room Temperature Wafer Bonding Machines Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Semiconductor Industry
1.3.3 PV Industry
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Room Temperature Wafer Bonding Machines Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Room Temperature Wafer Bonding Machines Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Room Temperature Wafer Bonding Machines Production Estimates and Forecasts (2018-2029)
1.4.4 Global Room Temperature Wafer Bonding Machines Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Room Temperature Wafer Bonding Machines Production Market Share by Manufacturers (2018-2023)
2.2 Global Room Temperature Wafer Bonding Machines Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Room Temperature Wafer Bonding Machines, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Room Temperature Wafer Bonding Machines Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Room Temperature Wafer Bonding Machines Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Room Temperature Wafer Bonding Machines, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Room Temperature Wafer Bonding Machines, Product Offered and Application
2.8 Global Key Manufacturers of Room Temperature Wafer Bonding Machines, Date of Enter into This Industry
2.9 Room Temperature Wafer Bonding Machines Market Competitive Situation and Trends
2.9.1 Room Temperature Wafer Bonding Machines Market Concentration Rate
2.9.2 Global 5 and 10 Largest Room Temperature Wafer Bonding Machines Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Room Temperature Wafer Bonding Machines Production by Region
3.1 Global Room Temperature Wafer Bonding Machines Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Room Temperature Wafer Bonding Machines Production Value by Region (2018-2029)
3.2.1 Global Room Temperature Wafer Bonding Machines Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Room Temperature Wafer Bonding Machines by Region (2024-2029)
3.3 Global Room Temperature Wafer Bonding Machines Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Room Temperature Wafer Bonding Machines Production by Region (2018-2029)
3.4.1 Global Room Temperature Wafer Bonding Machines Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Room Temperature Wafer Bonding Machines by Region (2024-2029)
3.5 Global Room Temperature Wafer Bonding Machines Market Price Analysis by Region (2018-2023)
3.6 Global Room Temperature Wafer Bonding Machines Production and Value, Year-over-Year Growth
3.6.1 North America Room Temperature Wafer Bonding Machines Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Room Temperature Wafer Bonding Machines Production Value Estimates and Forecasts (2018-2029)
3.6.3 Japan Room Temperature Wafer Bonding Machines Production Value Estimates and Forecasts (2018-2029)
4 Room Temperature Wafer Bonding Machines Consumption by Region
4.1 Global Room Temperature Wafer Bonding Machines Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Room Temperature Wafer Bonding Machines Consumption by Region (2018-2029)
4.2.1 Global Room Temperature Wafer Bonding Machines Consumption by Region (2018-2023)
4.2.2 Global Room Temperature Wafer Bonding Machines Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Room Temperature Wafer Bonding Machines Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Room Temperature Wafer Bonding Machines Consumption by Country (2018-2029)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Room Temperature Wafer Bonding Machines Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Room Temperature Wafer Bonding Machines Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Room Temperature Wafer Bonding Machines Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Room Temperature Wafer Bonding Machines Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Room Temperature Wafer Bonding Machines Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Room Temperature Wafer Bonding Machines Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Room Temperature Wafer Bonding Machines Production by Type (2018-2029)
5.1.1 Global Room Temperature Wafer Bonding Machines Production by Type (2018-2023)
5.1.2 Global Room Temperature Wafer Bonding Machines Production by Type (2024-2029)
5.1.3 Global Room Temperature Wafer Bonding Machines Production Market Share by Type (2018-2029)
5.2 Global Room Temperature Wafer Bonding Machines Production Value by Type (2018-2029)
5.2.1 Global Room Temperature Wafer Bonding Machines Production Value by Type (2018-2023)
5.2.2 Global Room Temperature Wafer Bonding Machines Production Value by Type (2024-2029)
5.2.3 Global Room Temperature Wafer Bonding Machines Production Value Market Share by Type (2018-2029)
5.3 Global Room Temperature Wafer Bonding Machines Price by Type (2018-2029)
6 Segment by Application
6.1 Global Room Temperature Wafer Bonding Machines Production by Application (2018-2029)
6.1.1 Global Room Temperature Wafer Bonding Machines Production by Application (2018-2023)
6.1.2 Global Room Temperature Wafer Bonding Machines Production by Application (2024-2029)
6.1.3 Global Room Temperature Wafer Bonding Machines Production Market Share by Application (2018-2029)
6.2 Global Room Temperature Wafer Bonding Machines Production Value by Application (2018-2029)
6.2.1 Global Room Temperature Wafer Bonding Machines Production Value by Application (2018-2023)
6.2.2 Global Room Temperature Wafer Bonding Machines Production Value by Application (2024-2029)
6.2.3 Global Room Temperature Wafer Bonding Machines Production Value Market Share by Application (2018-2029)
6.3 Global Room Temperature Wafer Bonding Machines Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Nidec Corporation
7.1.1 Nidec Corporation Room Temperature Wafer Bonding Machines Corporation Information
7.1.2 Nidec Corporation Room Temperature Wafer Bonding Machines Product Portfolio
7.1.3 Nidec Corporation Room Temperature Wafer Bonding Machines Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Nidec Corporation Main Business and Markets Served
7.1.5 Nidec Corporation Recent Developments/Updates
7.2 Mitsubishi Heavy Industries, Ltd.
7.2.1 Mitsubishi Heavy Industries, Ltd. Room Temperature Wafer Bonding Machines Corporation Information
7.2.2 Mitsubishi Heavy Industries, Ltd. Room Temperature Wafer Bonding Machines Product Portfolio
7.2.3 Mitsubishi Heavy Industries, Ltd. Room Temperature Wafer Bonding Machines Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Mitsubishi Heavy Industries, Ltd. Main Business and Markets Served
7.2.5 Mitsubishi Heavy Industries, Ltd. Recent Developments/Updates
7.3 EV Group
7.3.1 EV Group Room Temperature Wafer Bonding Machines Corporation Information
7.3.2 EV Group Room Temperature Wafer Bonding Machines Product Portfolio
7.3.3 EV Group Room Temperature Wafer Bonding Machines Production, Value, Price and Gross Margin (2018-2023)
7.3.4 EV Group Main Business and Markets Served
7.3.5 EV Group Recent Developments/Updates
7.4 Adamant Namiki
7.4.1 Adamant Namiki Room Temperature Wafer Bonding Machines Corporation Information
7.4.2 Adamant Namiki Room Temperature Wafer Bonding Machines Product Portfolio
7.4.3 Adamant Namiki Room Temperature Wafer Bonding Machines Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Adamant Namiki Main Business and Markets Served
7.4.5 Adamant Namiki Recent Developments/Updates
7.5 Canon
7.5.1 Canon Room Temperature Wafer Bonding Machines Corporation Information
7.5.2 Canon Room Temperature Wafer Bonding Machines Product Portfolio
7.5.3 Canon Room Temperature Wafer Bonding Machines Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Canon Main Business and Markets Served
7.5.5 Canon Recent Developments/Updates
7.6 Applied Microengineering
7.6.1 Applied Microengineering Room Temperature Wafer Bonding Machines Corporation Information
7.6.2 Applied Microengineering Room Temperature Wafer Bonding Machines Product Portfolio
7.6.3 Applied Microengineering Room Temperature Wafer Bonding Machines Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Applied Microengineering Main Business and Markets Served
7.6.5 Applied Microengineering Recent Developments/Updates
7.7 SET Corporation SA
7.7.1 SET Corporation SA Room Temperature Wafer Bonding Machines Corporation Information
7.7.2 SET Corporation SA Room Temperature Wafer Bonding Machines Product Portfolio
7.7.3 SET Corporation SA Room Temperature Wafer Bonding Machines Production, Value, Price and Gross Margin (2018-2023)
7.7.4 SET Corporation SA Main Business and Markets Served
7.7.5 SET Corporation SA Recent Developments/Updates
7.8 Ayumi Industry Co., Ltd.
7.8.1 Ayumi Industry Co., Ltd. Room Temperature Wafer Bonding Machines Corporation Information
7.8.2 Ayumi Industry Co., Ltd. Room Temperature Wafer Bonding Machines Product Portfolio
7.8.3 Ayumi Industry Co., Ltd. Room Temperature Wafer Bonding Machines Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Ayumi Industry Co., Ltd. Main Business and Markets Served
7.7.5 Ayumi Industry Co., Ltd. Recent Developments/Updates
7.9 Kyodo International, Inc.
7.9.1 Kyodo International, Inc. Room Temperature Wafer Bonding Machines Corporation Information
7.9.2 Kyodo International, Inc. Room Temperature Wafer Bonding Machines Product Portfolio
7.9.3 Kyodo International, Inc. Room Temperature Wafer Bonding Machines Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Kyodo International, Inc. Main Business and Markets Served
7.9.5 Kyodo International, Inc. Recent Developments/Updates
7.10 Bondtech Co., Ltd.
7.10.1 Bondtech Co., Ltd. Room Temperature Wafer Bonding Machines Corporation Information
7.10.2 Bondtech Co., Ltd. Room Temperature Wafer Bonding Machines Product Portfolio
7.10.3 Bondtech Co., Ltd. Room Temperature Wafer Bonding Machines Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Bondtech Co., Ltd. Main Business and Markets Served
7.10.5 Bondtech Co., Ltd. Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Room Temperature Wafer Bonding Machines Industry Chain Analysis
8.2 Room Temperature Wafer Bonding Machines Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Room Temperature Wafer Bonding Machines Production Mode & Process
8.4 Room Temperature Wafer Bonding Machines Sales and Marketing
8.4.1 Room Temperature Wafer Bonding Machines Sales Channels
8.4.2 Room Temperature Wafer Bonding Machines Distributors
8.5 Room Temperature Wafer Bonding Machines Customers
9 Room Temperature Wafer Bonding Machines Market Dynamics
9.1 Room Temperature Wafer Bonding Machines Industry Trends
9.2 Room Temperature Wafer Bonding Machines Market Drivers
9.3 Room Temperature Wafer Bonding Machines Market Challenges
9.4 Room Temperature Wafer Bonding Machines Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer