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レポート概要
| 本調査レポートは世界の半導体成形システム市場について調査・分析し、世界の半導体成形システム市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析（全自動、半自動、手動）、用途別セグメント分析（ウエハレベルパッケージ、BGAパッケージ、フラットパネルパッケージ、その他）、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、TOWA、ASMPT、Besi、I-PEX、Yamada、TAKARA TOOL & DIE、Asahi Engineering、Tongling Fushi Sanjia、Nextool Technology、DAHUA Technologyなどが含まれています。世界の半導体成形システム市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争による影響は、半導体成形システム市場規模を推定する際に考慮しました。本レポートは、半導体成形システムの世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、半導体成形システムに関するビジネス上の意思決定に役立てることを目的としています。 ・半導体成形システム市場の概要 - 製品の定義 - 半導体成形システムのタイプ別セグメント - 世界の半導体成形システム市場成長率のタイプ別分析（全自動、半自動、手動） - 半導体成形システムの用途別セグメント - 世界の半導体成形システム市場成長率の用途別分析（ウエハレベルパッケージ、BGAパッケージ、フラットパネルパッケージ、その他） - 世界市場の成長展望 - 世界の半導体成形システム生産量の推定と予測（2018年-2029年） - 世界の半導体成形システム生産能力の推定と予測（2018年-2029年） - 半導体成形システムの平均価格の推定と予測（2018年-2029年） - 前提条件と制限事項 ・メーカー別競争状況 - メーカー別市場シェア - 世界の主要メーカー、業界ランキング分析 - メーカー別平均価格 - 半導体成形システム市場の競争状況およびトレンド ・半導体成形システムの地域別生産量 - 半導体成形システム生産量の地域別推計と予測（2018年-2029年） - 地域別半導体成形システム価格分析（2018年-2023年） - 北米の半導体成形システム生産規模（2018年-2029年） - ヨーロッパの半導体成形システム生産規模（2018年-2029年） - 中国の半導体成形システム生産規模（2018年-2029年） - 日本の半導体成形システム生産規模（2018年-2029年） - 韓国の半導体成形システム生産規模（2018年-2029年） - インドの半導体成形システム生産規模（2018年-2029年） ・半導体成形システムの地域別消費量 - 半導体成形システム消費量の地域別推計と予測（2018年-2029年） - 北米の半導体成形システム消費量（2018年-2029年） - アメリカの半導体成形システム消費量（2018年-2029年） - ヨーロッパの半導体成形システム消費量（2018年-2029年） - アジア太平洋の半導体成形システム消費量（2018年-2029年） - 中国の半導体成形システム消費量（2018年-2029年） - 日本の半導体成形システム消費量（2018年-2029年） - 韓国の半導体成形システム消費量（2018年-2029年） - 東南アジアの半導体成形システム消費量（2018年-2029年） - インドの半導体成形システム消費量（2018年-2029年） - 中南米・中東・アフリカの半導体成形システム消費量（2018年-2029年） ・タイプ別セグメント：全自動、半自動、手動 - 世界の半導体成形システムのタイプ別生産量（2018年-2023年） - 世界の半導体成形システムのタイプ別生産量（2024年-2029年） - 世界の半導体成形システムのタイプ別価格 ・用途別セグメント：ウエハレベルパッケージ、BGAパッケージ、フラットパネルパッケージ、その他 - 世界の半導体成形システムの用途別生産量（2018年-2023年） - 世界の半導体成形システムの用途別生産量（2024年-2029年） - 世界の半導体成形システムの用途別価格 ・主要企業のプロファイル：企業情報、製品ポートフォリオ、生産量、価格、動向 TOWA、ASMPT、Besi、I-PEX、Yamada、TAKARA TOOL & DIE、Asahi Engineering、Tongling Fushi Sanjia、Nextool Technology、DAHUA Technology ・産業チェーンと販売チャネルの分析 - 半導体成形システム産業チェーン分析 - 半導体成形システムの主要原材料 - 半導体成形システムの販売チャネル - 半導体成形システムのディストリビューター - 半導体成形システムの主要顧客 ・半導体成形システム市場ダイナミクス - 半導体成形システムの業界動向 - 半導体成形システム市場の成長ドライバ、課題、阻害要因 ・調査成果および結論 ・調査方法とデータソース |
The so-called “Molding” refers to the molding process in which the semiconductor is electrically insulated from the outside by resin encapsulation. It protects the chip by injecting fluid resin from the gate around the semiconductor chip and curing it. Automatic molding machine refers to the fully automatic semiconductor packaging process equipment that automatically transports the lead frame from the feeding box for plastic sealing, and then removes the residual glue and then transports it to the discharging box.
The prices in this report are for individual machines and do not include molds.
Highlights
The global Semiconductor Molding Systems market was valued at US$ 443.3 million in 2022 and is anticipated to reach US$ 712.6 million by 2029, witnessing a CAGR of 10.2% during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global core semiconductor molding systems manufacturers include TOWA, ASMPT etc.The top 2 companies hold a share about 70%.Japan is the largest market, with a share about 75%, followed by China and Europe with the share about 15% and 10%.In terms of product, fully automatic is the largest segment, with a share over 60%. And in terms of application, the largest application is BGA packaging, followed by wafer level packaging.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Molding Systems, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Molding Systems.
The Semiconductor Molding Systems market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Semiconductor Molding Systems market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Molding Systems manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
TOWA
ASMPT
Besi
I-PEX
Yamada
TAKARA TOOL & DIE
Asahi Engineering
Tongling Fushi Sanjia
Nextool Technology
DAHUA Technology
Segment by Type
Fully Automatic
Semi-automatic
Manual
Segment by Application
Wafer Level Packaging
BGA Packaging
Flat Panel Packaging
Others
Production by Region
North America
Europe
China
Japan
Southeast Asia
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Molding Systems manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Molding Systems by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Molding Systems in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
1 Semiconductor Molding Systems Market Overview
1.1 Product Definition
1.2 Semiconductor Molding Systems Segment by Type
1.2.1 Global Semiconductor Molding Systems Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Fully Automatic
1.2.3 Semi-automatic
1.2.4 Manual
1.3 Semiconductor Molding Systems Segment by Application
1.3.1 Global Semiconductor Molding Systems Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Wafer Level Packaging
1.3.3 BGA Packaging
1.3.4 Flat Panel Packaging
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Molding Systems Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Semiconductor Molding Systems Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Semiconductor Molding Systems Production Estimates and Forecasts (2018-2029)
1.4.4 Global Semiconductor Molding Systems Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Molding Systems Production Market Share by Manufacturers (2018-2023)
2.2 Global Semiconductor Molding Systems Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Semiconductor Molding Systems, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Semiconductor Molding Systems Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Molding Systems Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Semiconductor Molding Systems, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Molding Systems, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Molding Systems, Date of Enter into This Industry
2.9 Semiconductor Molding Systems Market Competitive Situation and Trends
2.9.1 Semiconductor Molding Systems Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Molding Systems Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Molding Systems Production by Region
3.1 Global Semiconductor Molding Systems Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Semiconductor Molding Systems Production Value by Region (2018-2029)
3.2.1 Global Semiconductor Molding Systems Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Semiconductor Molding Systems by Region (2024-2029)
3.3 Global Semiconductor Molding Systems Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Semiconductor Molding Systems Production by Region (2018-2029)
3.4.1 Global Semiconductor Molding Systems Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Semiconductor Molding Systems by Region (2024-2029)
3.5 Global Semiconductor Molding Systems Market Price Analysis by Region (2018-2023)
3.6 Global Semiconductor Molding Systems Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Molding Systems Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Semiconductor Molding Systems Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Semiconductor Molding Systems Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Semiconductor Molding Systems Production Value Estimates and Forecasts (2018-2029)
3.6.5 Southeast Asia Semiconductor Molding Systems Production Value Estimates and Forecasts (2018-2029)
3.6.6 South Korea Semiconductor Molding Systems Production Value Estimates and Forecasts (2018-2029)
4 Semiconductor Molding Systems Consumption by Region
4.1 Global Semiconductor Molding Systems Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Semiconductor Molding Systems Consumption by Region (2018-2029)
4.2.1 Global Semiconductor Molding Systems Consumption by Region (2018-2023)
4.2.2 Global Semiconductor Molding Systems Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Semiconductor Molding Systems Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Semiconductor Molding Systems Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Molding Systems Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Semiconductor Molding Systems Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Molding Systems Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Semiconductor Molding Systems Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Molding Systems Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Semiconductor Molding Systems Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Molding Systems Production by Type (2018-2029)
5.1.1 Global Semiconductor Molding Systems Production by Type (2018-2023)
5.1.2 Global Semiconductor Molding Systems Production by Type (2024-2029)
5.1.3 Global Semiconductor Molding Systems Production Market Share by Type (2018-2029)
5.2 Global Semiconductor Molding Systems Production Value by Type (2018-2029)
5.2.1 Global Semiconductor Molding Systems Production Value by Type (2018-2023)
5.2.2 Global Semiconductor Molding Systems Production Value by Type (2024-2029)
5.2.3 Global Semiconductor Molding Systems Production Value Market Share by Type (2018-2029)
5.3 Global Semiconductor Molding Systems Price by Type (2018-2029)
6 Segment by Application
6.1 Global Semiconductor Molding Systems Production by Application (2018-2029)
6.1.1 Global Semiconductor Molding Systems Production by Application (2018-2023)
6.1.2 Global Semiconductor Molding Systems Production by Application (2024-2029)
6.1.3 Global Semiconductor Molding Systems Production Market Share by Application (2018-2029)
6.2 Global Semiconductor Molding Systems Production Value by Application (2018-2029)
6.2.1 Global Semiconductor Molding Systems Production Value by Application (2018-2023)
6.2.2 Global Semiconductor Molding Systems Production Value by Application (2024-2029)
6.2.3 Global Semiconductor Molding Systems Production Value Market Share by Application (2018-2029)
6.3 Global Semiconductor Molding Systems Price by Application (2018-2029)
7 Key Companies Profiled
7.1 TOWA
7.1.1 TOWA Semiconductor Molding Systems Corporation Information
7.1.2 TOWA Semiconductor Molding Systems Product Portfolio
7.1.3 TOWA Semiconductor Molding Systems Production, Value, Price and Gross Margin (2018-2023)
7.1.4 TOWA Main Business and Markets Served
7.1.5 TOWA Recent Developments/Updates
7.2 ASMPT
7.2.1 ASMPT Semiconductor Molding Systems Corporation Information
7.2.2 ASMPT Semiconductor Molding Systems Product Portfolio
7.2.3 ASMPT Semiconductor Molding Systems Production, Value, Price and Gross Margin (2018-2023)
7.2.4 ASMPT Main Business and Markets Served
7.2.5 ASMPT Recent Developments/Updates
7.3 Besi
7.3.1 Besi Semiconductor Molding Systems Corporation Information
7.3.2 Besi Semiconductor Molding Systems Product Portfolio
7.3.3 Besi Semiconductor Molding Systems Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Besi Main Business and Markets Served
7.3.5 Besi Recent Developments/Updates
7.4 I-PEX
7.4.1 I-PEX Semiconductor Molding Systems Corporation Information
7.4.2 I-PEX Semiconductor Molding Systems Product Portfolio
7.4.3 I-PEX Semiconductor Molding Systems Production, Value, Price and Gross Margin (2018-2023)
7.4.4 I-PEX Main Business and Markets Served
7.4.5 I-PEX Recent Developments/Updates
7.5 Yamada
7.5.1 Yamada Semiconductor Molding Systems Corporation Information
7.5.2 Yamada Semiconductor Molding Systems Product Portfolio
7.5.3 Yamada Semiconductor Molding Systems Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Yamada Main Business and Markets Served
7.5.5 Yamada Recent Developments/Updates
7.6 TAKARA TOOL & DIE
7.6.1 TAKARA TOOL & DIE Semiconductor Molding Systems Corporation Information
7.6.2 TAKARA TOOL & DIE Semiconductor Molding Systems Product Portfolio
7.6.3 TAKARA TOOL & DIE Semiconductor Molding Systems Production, Value, Price and Gross Margin (2018-2023)
7.6.4 TAKARA TOOL & DIE Main Business and Markets Served
7.6.5 TAKARA TOOL & DIE Recent Developments/Updates
7.7 Asahi Engineering
7.7.1 Asahi Engineering Semiconductor Molding Systems Corporation Information
7.7.2 Asahi Engineering Semiconductor Molding Systems Product Portfolio
7.7.3 Asahi Engineering Semiconductor Molding Systems Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Asahi Engineering Main Business and Markets Served
7.7.5 Asahi Engineering Recent Developments/Updates
7.8 Tongling Fushi Sanjia
7.8.1 Tongling Fushi Sanjia Semiconductor Molding Systems Corporation Information
7.8.2 Tongling Fushi Sanjia Semiconductor Molding Systems Product Portfolio
7.8.3 Tongling Fushi Sanjia Semiconductor Molding Systems Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Tongling Fushi Sanjia Main Business and Markets Served
7.7.5 Tongling Fushi Sanjia Recent Developments/Updates
7.9 Nextool Technology
7.9.1 Nextool Technology Semiconductor Molding Systems Corporation Information
7.9.2 Nextool Technology Semiconductor Molding Systems Product Portfolio
7.9.3 Nextool Technology Semiconductor Molding Systems Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Nextool Technology Main Business and Markets Served
7.9.5 Nextool Technology Recent Developments/Updates
7.10 DAHUA Technology
7.10.1 DAHUA Technology Semiconductor Molding Systems Corporation Information
7.10.2 DAHUA Technology Semiconductor Molding Systems Product Portfolio
7.10.3 DAHUA Technology Semiconductor Molding Systems Production, Value, Price and Gross Margin (2018-2023)
7.10.4 DAHUA Technology Main Business and Markets Served
7.10.5 DAHUA Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Molding Systems Industry Chain Analysis
8.2 Semiconductor Molding Systems Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Molding Systems Production Mode & Process
8.4 Semiconductor Molding Systems Sales and Marketing
8.4.1 Semiconductor Molding Systems Sales Channels
8.4.2 Semiconductor Molding Systems Distributors
8.5 Semiconductor Molding Systems Customers
9 Semiconductor Molding Systems Market Dynamics
9.1 Semiconductor Molding Systems Industry Trends
9.2 Semiconductor Molding Systems Market Drivers
9.3 Semiconductor Molding Systems Market Challenges
9.4 Semiconductor Molding Systems Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer