【調査レポート】スルーホール電子パッケージングの世界市場2023年：プラスチック、金属、ガラス、その他

• 英文タイトル：Global Through-Hole Electronics Packaging Market Research Report 2023

QYResearchが調査・発行した産業分析レポートです。スルーホール電子パッケージングの世界市場2023年：プラスチック、金属、ガラス、その他 / Global Through-Hole Electronics Packaging Market Research Report 2023 / MRC23Q35333資料のイメージです。

• レポートコード：MRC23Q35333
• 出版社/出版日：QYResearch / 2023年3月
• レポート形態：英文、PDF、106ページ
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• 産業分類：電子＆半導体

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レポート概要

本調査レポートは世界のスルーホール電子パッケージング市場について調査・分析し、世界のスルーホール電子パッケージング市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析（プラスチック、金属、ガラス、その他）、用途別セグメント分析（家電、航空宇宙/防衛、自動車、通信、その他）、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、AMETEK, Inc.、Dordan Mfg、Dupont、Osram、The Plastiform Company、Kiva Container、Primex Plastics Corporation.、Quality Foam Packaging Inc、Ameson Packaging、Lithoflex, Inc.、UFP Technologies、Intel Corporation、STMicroelectronics、Advanced Micro Devices, Inc、SAMSUNG、GY Packaging、Taiwan Semiconductorなどが含まれています。世界のスルーホール電子パッケージング市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争による影響は、スルーホール電子パッケージング市場規模を推定する際に考慮しました。本レポートは、スルーホール電子パッケージングの世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、スルーホール電子パッケージングに関するビジネス上の意思決定に役立てることを目的としています。

・スルーホール電子パッケージング市場の概要
- 製品の定義
- スルーホール電子パッケージングのタイプ別セグメント
- 世界のスルーホール電子パッケージング市場成長率のタイプ別分析（プラスチック、金属、ガラス、その他）
- スルーホール電子パッケージングの用途別セグメント
- 世界のスルーホール電子パッケージング市場成長率の用途別分析（家電、航空宇宙/防衛、自動車、通信、その他）
- 世界市場の成長展望
- 世界のスルーホール電子パッケージング生産量の推定と予測（2018年-2029年）
- 世界のスルーホール電子パッケージング生産能力の推定と予測（2018年-2029年）
- スルーホール電子パッケージングの平均価格の推定と予測（2018年-2029年）
- 前提条件と制限事項

・メーカー別競争状況
- メーカー別市場シェア
- 世界の主要メーカー、業界ランキング分析
- メーカー別平均価格
- スルーホール電子パッケージング市場の競争状況およびトレンド

・スルーホール電子パッケージングの地域別生産量
- スルーホール電子パッケージング生産量の地域別推計と予測（2018年-2029年）
- 地域別スルーホール電子パッケージング価格分析（2018年-2023年）
- 北米のスルーホール電子パッケージング生産規模（2018年-2029年）
- ヨーロッパのスルーホール電子パッケージング生産規模（2018年-2029年）
- 中国のスルーホール電子パッケージング生産規模（2018年-2029年）
- 日本のスルーホール電子パッケージング生産規模（2018年-2029年）
- 韓国のスルーホール電子パッケージング生産規模（2018年-2029年）
- インドのスルーホール電子パッケージング生産規模（2018年-2029年）

・スルーホール電子パッケージングの地域別消費量
- スルーホール電子パッケージング消費量の地域別推計と予測（2018年-2029年）
- 北米のスルーホール電子パッケージング消費量（2018年-2029年）
- アメリカのスルーホール電子パッケージング消費量（2018年-2029年）
- ヨーロッパのスルーホール電子パッケージング消費量（2018年-2029年）
- アジア太平洋のスルーホール電子パッケージング消費量（2018年-2029年）
- 中国のスルーホール電子パッケージング消費量（2018年-2029年）
- 日本のスルーホール電子パッケージング消費量（2018年-2029年）
- 韓国のスルーホール電子パッケージング消費量（2018年-2029年）
- 東南アジアのスルーホール電子パッケージング消費量（2018年-2029年）
- インドのスルーホール電子パッケージング消費量（2018年-2029年）
- 中南米・中東・アフリカのスルーホール電子パッケージング消費量（2018年-2029年）

・タイプ別セグメント：プラスチック、金属、ガラス、その他
- 世界のスルーホール電子パッケージングのタイプ別生産量（2018年-2023年）
- 世界のスルーホール電子パッケージングのタイプ別生産量（2024年-2029年）
- 世界のスルーホール電子パッケージングのタイプ別価格

・用途別セグメント：家電、航空宇宙/防衛、自動車、通信、その他
- 世界のスルーホール電子パッケージングの用途別生産量（2018年-2023年）
- 世界のスルーホール電子パッケージングの用途別生産量（2024年-2029年）
- 世界のスルーホール電子パッケージングの用途別価格

・主要企業のプロファイル：企業情報、製品ポートフォリオ、生産量、価格、動向
AMETEK, Inc.、Dordan Mfg、Dupont、Osram、The Plastiform Company、Kiva Container、Primex Plastics Corporation.、Quality Foam Packaging Inc、Ameson Packaging、Lithoflex, Inc.、UFP Technologies、Intel Corporation、STMicroelectronics、Advanced Micro Devices, Inc、SAMSUNG、GY Packaging、Taiwan Semiconductor

・産業チェーンと販売チャネルの分析
- スルーホール電子パッケージング産業チェーン分析
- スルーホール電子パッケージングの主要原材料
- スルーホール電子パッケージングの販売チャネル
- スルーホール電子パッケージングのディストリビューター
- スルーホール電子パッケージングの主要顧客

・スルーホール電子パッケージング市場ダイナミクス
- スルーホール電子パッケージングの業界動向
- スルーホール電子パッケージング市場の成長ドライバ、課題、阻害要因

・調査成果および結論

・調査方法とデータソース

Through-Hole Electronics Packaging is the process by which the component leads are packed into the drilled holes on a bare printed circuit board. The Through-Hole Electronics Packaging offers number of advantages such as high-reliability, easy to solder/desolder and test and others. It also provides interconnections between upper and lower layers (vias) in non-plated hole technologies.
The global Through-Hole Electronics Packaging market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Through-Hole Electronics Packaging is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Through-Hole Electronics Packaging is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Through-Hole Electronics Packaging include AMETEK, Inc., Dordan Mfg, Dupont, Osram, The Plastiform Company, Kiva Container, Primex Plastics Corporation., Quality Foam Packaging Inc and Ameson Packaging, etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Through-Hole Electronics Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through-Hole Electronics Packaging.
The Through-Hole Electronics Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Through-Hole Electronics Packaging market comprehensively. Regional market sizes, concerning products by material type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Through-Hole Electronics Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by material type, by application, and by regions.
By Company
AMETEK, Inc.
Dordan Mfg
Dupont
Osram
The Plastiform Company
Kiva Container
Primex Plastics Corporation.
Quality Foam Packaging Inc
Ameson Packaging
Lithoflex, Inc.
UFP Technologies
Intel Corporation
STMicroelectronics
Advanced Micro Devices, Inc
SAMSUNG
GY Packaging
Taiwan Semiconductor
Segment by Material Type
Plastic
Metal
Glass
Others
Segment by Application
Consumer Electronics
Aerospace and Defense
Automotive
Telecommunications
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by material type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Through-Hole Electronics Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Through-Hole Electronics Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Through-Hole Electronics Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by material type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

レポート目次

1 Through-Hole Electronics Packaging Market Overview
1.1 Product Definition
1.2 Through-Hole Electronics Packaging Segment by Material Type
1.2.1 Global Through-Hole Electronics Packaging Market Value Growth Rate Analysis by Material Type 2022 VS 2029
1.2.2 Plastic
1.2.3 Metal
1.2.4 Glass
1.2.5 Others
1.3 Through-Hole Electronics Packaging Segment by Application
1.3.1 Global Through-Hole Electronics Packaging Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Aerospace and Defense
1.3.4 Automotive
1.3.5 Telecommunications
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Through-Hole Electronics Packaging Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Through-Hole Electronics Packaging Production Estimates and Forecasts (2018-2029)
1.4.4 Global Through-Hole Electronics Packaging Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Through-Hole Electronics Packaging Production Market Share by Manufacturers (2018-2023)
2.2 Global Through-Hole Electronics Packaging Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Through-Hole Electronics Packaging, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Through-Hole Electronics Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Through-Hole Electronics Packaging Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Through-Hole Electronics Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Through-Hole Electronics Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Through-Hole Electronics Packaging, Date of Enter into This Industry
2.9 Through-Hole Electronics Packaging Market Competitive Situation and Trends
2.9.1 Through-Hole Electronics Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Through-Hole Electronics Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Through-Hole Electronics Packaging Production by Region
3.1 Global Through-Hole Electronics Packaging Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Through-Hole Electronics Packaging Production Value by Region (2018-2029)
3.2.1 Global Through-Hole Electronics Packaging Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Through-Hole Electronics Packaging by Region (2024-2029)
3.3 Global Through-Hole Electronics Packaging Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Through-Hole Electronics Packaging Production by Region (2018-2029)
3.4.1 Global Through-Hole Electronics Packaging Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Through-Hole Electronics Packaging by Region (2024-2029)
3.5 Global Through-Hole Electronics Packaging Market Price Analysis by Region (2018-2023)
3.6 Global Through-Hole Electronics Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2018-2029)
4 Through-Hole Electronics Packaging Consumption by Region
4.1 Global Through-Hole Electronics Packaging Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Through-Hole Electronics Packaging Consumption by Region (2018-2029)
4.2.1 Global Through-Hole Electronics Packaging Consumption by Region (2018-2023)
4.2.2 Global Through-Hole Electronics Packaging Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Through-Hole Electronics Packaging Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Through-Hole Electronics Packaging Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Through-Hole Electronics Packaging Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Through-Hole Electronics Packaging Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Through-Hole Electronics Packaging Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Material Type
5.1 Global Through-Hole Electronics Packaging Production by Material Type (2018-2029)
5.1.1 Global Through-Hole Electronics Packaging Production by Material Type (2018-2023)
5.1.2 Global Through-Hole Electronics Packaging Production by Material Type (2024-2029)
5.1.3 Global Through-Hole Electronics Packaging Production Market Share by Material Type (2018-2029)
5.2 Global Through-Hole Electronics Packaging Production Value by Material Type (2018-2029)
5.2.1 Global Through-Hole Electronics Packaging Production Value by Material Type (2018-2023)
5.2.2 Global Through-Hole Electronics Packaging Production Value by Material Type (2024-2029)
5.2.3 Global Through-Hole Electronics Packaging Production Value Market Share by Material Type (2018-2029)
5.3 Global Through-Hole Electronics Packaging Price by Material Type (2018-2029)
6 Segment by Application
6.1 Global Through-Hole Electronics Packaging Production by Application (2018-2029)
6.1.1 Global Through-Hole Electronics Packaging Production by Application (2018-2023)
6.1.2 Global Through-Hole Electronics Packaging Production by Application (2024-2029)
6.1.3 Global Through-Hole Electronics Packaging Production Market Share by Application (2018-2029)
6.2 Global Through-Hole Electronics Packaging Production Value by Application (2018-2029)
6.2.1 Global Through-Hole Electronics Packaging Production Value by Application (2018-2023)
6.2.2 Global Through-Hole Electronics Packaging Production Value by Application (2024-2029)
6.2.3 Global Through-Hole Electronics Packaging Production Value Market Share by Application (2018-2029)
6.3 Global Through-Hole Electronics Packaging Price by Application (2018-2029)
7 Key Companies Profiled
7.1 AMETEK, Inc.
7.1.1 AMETEK, Inc. Through-Hole Electronics Packaging Corporation Information
7.1.2 AMETEK, Inc. Through-Hole Electronics Packaging Product Portfolio
7.1.3 AMETEK, Inc. Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.1.4 AMETEK, Inc. Main Business and Markets Served
7.1.5 AMETEK, Inc. Recent Developments/Updates
7.2 Dordan Mfg
7.2.1 Dordan Mfg Through-Hole Electronics Packaging Corporation Information
7.2.2 Dordan Mfg Through-Hole Electronics Packaging Product Portfolio
7.2.3 Dordan Mfg Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Dordan Mfg Main Business and Markets Served
7.2.5 Dordan Mfg Recent Developments/Updates
7.3 Dupont
7.3.1 Dupont Through-Hole Electronics Packaging Corporation Information
7.3.2 Dupont Through-Hole Electronics Packaging Product Portfolio
7.3.3 Dupont Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Dupont Main Business and Markets Served
7.3.5 Dupont Recent Developments/Updates
7.4 Osram
7.4.1 Osram Through-Hole Electronics Packaging Corporation Information
7.4.2 Osram Through-Hole Electronics Packaging Product Portfolio
7.4.3 Osram Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Osram Main Business and Markets Served
7.4.5 Osram Recent Developments/Updates
7.5 The Plastiform Company
7.5.1 The Plastiform Company Through-Hole Electronics Packaging Corporation Information
7.5.2 The Plastiform Company Through-Hole Electronics Packaging Product Portfolio
7.5.3 The Plastiform Company Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.5.4 The Plastiform Company Main Business and Markets Served
7.5.5 The Plastiform Company Recent Developments/Updates
7.6 Kiva Container
7.6.1 Kiva Container Through-Hole Electronics Packaging Corporation Information
7.6.2 Kiva Container Through-Hole Electronics Packaging Product Portfolio
7.6.3 Kiva Container Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Kiva Container Main Business and Markets Served
7.6.5 Kiva Container Recent Developments/Updates
7.7 Primex Plastics Corporation.
7.7.1 Primex Plastics Corporation. Through-Hole Electronics Packaging Corporation Information
7.7.2 Primex Plastics Corporation. Through-Hole Electronics Packaging Product Portfolio
7.7.3 Primex Plastics Corporation. Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Primex Plastics Corporation. Main Business and Markets Served
7.7.5 Primex Plastics Corporation. Recent Developments/Updates
7.8 Quality Foam Packaging Inc
7.8.1 Quality Foam Packaging Inc Through-Hole Electronics Packaging Corporation Information
7.8.2 Quality Foam Packaging Inc Through-Hole Electronics Packaging Product Portfolio
7.8.3 Quality Foam Packaging Inc Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Quality Foam Packaging Inc Main Business and Markets Served
7.7.5 Quality Foam Packaging Inc Recent Developments/Updates
7.9 Ameson Packaging
7.9.1 Ameson Packaging Through-Hole Electronics Packaging Corporation Information
7.9.2 Ameson Packaging Through-Hole Electronics Packaging Product Portfolio
7.9.3 Ameson Packaging Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Ameson Packaging Main Business and Markets Served
7.9.5 Ameson Packaging Recent Developments/Updates
7.10 Lithoflex, Inc.
7.10.1 Lithoflex, Inc. Through-Hole Electronics Packaging Corporation Information
7.10.2 Lithoflex, Inc. Through-Hole Electronics Packaging Product Portfolio
7.10.3 Lithoflex, Inc. Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Lithoflex, Inc. Main Business and Markets Served
7.10.5 Lithoflex, Inc. Recent Developments/Updates
7.11 UFP Technologies
7.11.1 UFP Technologies Through-Hole Electronics Packaging Corporation Information
7.11.2 UFP Technologies Through-Hole Electronics Packaging Product Portfolio
7.11.3 UFP Technologies Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.11.4 UFP Technologies Main Business and Markets Served
7.11.5 UFP Technologies Recent Developments/Updates
7.12 Intel Corporation
7.12.1 Intel Corporation Through-Hole Electronics Packaging Corporation Information
7.12.2 Intel Corporation Through-Hole Electronics Packaging Product Portfolio
7.12.3 Intel Corporation Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Intel Corporation Main Business and Markets Served
7.12.5 Intel Corporation Recent Developments/Updates
7.13 STMicroelectronics
7.13.1 STMicroelectronics Through-Hole Electronics Packaging Corporation Information
7.13.2 STMicroelectronics Through-Hole Electronics Packaging Product Portfolio
7.13.3 STMicroelectronics Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.13.4 STMicroelectronics Main Business and Markets Served
7.13.5 STMicroelectronics Recent Developments/Updates
7.14 Advanced Micro Devices, Inc
7.14.1 Advanced Micro Devices, Inc Through-Hole Electronics Packaging Corporation Information
7.14.2 Advanced Micro Devices, Inc Through-Hole Electronics Packaging Product Portfolio
7.14.3 Advanced Micro Devices, Inc Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Advanced Micro Devices, Inc Main Business and Markets Served
7.14.5 Advanced Micro Devices, Inc Recent Developments/Updates
7.15 SAMSUNG
7.15.1 SAMSUNG Through-Hole Electronics Packaging Corporation Information
7.15.2 SAMSUNG Through-Hole Electronics Packaging Product Portfolio
7.15.3 SAMSUNG Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.15.4 SAMSUNG Main Business and Markets Served
7.15.5 SAMSUNG Recent Developments/Updates
7.16 GY Packaging
7.16.1 GY Packaging Through-Hole Electronics Packaging Corporation Information
7.16.2 GY Packaging Through-Hole Electronics Packaging Product Portfolio
7.16.3 GY Packaging Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.16.4 GY Packaging Main Business and Markets Served
7.16.5 GY Packaging Recent Developments/Updates
7.17 Taiwan Semiconductor
7.17.1 Taiwan Semiconductor Through-Hole Electronics Packaging Corporation Information
7.17.2 Taiwan Semiconductor Through-Hole Electronics Packaging Product Portfolio
7.17.3 Taiwan Semiconductor Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2018-2023)
7.17.4 Taiwan Semiconductor Main Business and Markets Served
7.17.5 Taiwan Semiconductor Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Through-Hole Electronics Packaging Industry Chain Analysis
8.2 Through-Hole Electronics Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Through-Hole Electronics Packaging Production Mode & Process
8.4 Through-Hole Electronics Packaging Sales and Marketing
8.4.1 Through-Hole Electronics Packaging Sales Channels
8.4.2 Through-Hole Electronics Packaging Distributors
8.5 Through-Hole Electronics Packaging Customers
9 Through-Hole Electronics Packaging Market Dynamics
9.1 Through-Hole Electronics Packaging Industry Trends
9.2 Through-Hole Electronics Packaging Market Drivers
9.3 Through-Hole Electronics Packaging Market Challenges
9.4 Through-Hole Electronics Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

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