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レポート概要
| 本調査レポートは世界の外部委託半導体組立/テストサービス市場について調査・分析し、世界の外部委託半導体組立/テストサービス市場概要、市場トレンド、主要企業別競争状況、タイプ別セグメント分析（組立サービス、テストサービス）、用途別セグメント分析（通信、自動車、コンピューティング、家電、その他）、地域別市場規模、主要企業のプロファイルなどに関する情報を掲載しています。主要企業としては、ASE、Amkor Technology、JCET、SPIL、Powertech Technology Inc.、TongFu Microelectronics、Tianshui Huatian Technology、UTAC、Chipbond Technology、Hana Micron、OSE、Walton Advanced Engineering、NEPES、Unisem、ChipMOS Technologies、Signetics、Carsem、KYECなどが含まれています。世界の外部委託半導体組立/テストサービス市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争の影響は、外部委託半導体組立/テストサービス市場規模を推定する際に考慮しました。本レポートは、外部委託半導体組立/テストサービスの世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、外部委託半導体組立/テストサービスに関するビジネス上の意思決定に役立てることを目的としています。 ・外部委託半導体組立/テストサービス市場の概要 - 外部委託半導体組立/テストサービスのタイプ別セグメント - 世界の外部委託半導体組立/テストサービス市場規模：タイプ別分析（組立サービス、テストサービス） - 外部委託半導体組立/テストサービスの用途別セグメント - 世界の外部委託半導体組立/テストサービス市場規模：用途別分析（通信、自動車、コンピューティング、家電、その他） - 世界の外部委託半導体組立/テストサービス市場規模予測（2018年-2029年） ・外部委託半導体組立/テストサービス市場の成長トレンド - 外部委託半導体組立/テストサービスの地域別市場規模（2018年-2029年） - 外部委託半導体組立/テストサービス市場ダイナミクス - 外部委託半導体組立/テストサービスの業界動向 - 外部委託半導体組立/テストサービス市場の成長ドライバ、課題、阻害要因 ・主要企業別競争状況 - 企業別市場シェア - 世界の主要企業、業界ランキング分析 - 市場への参入、M＆A動向 ・タイプ別セグメント：組立サービス、テストサービス - 世界の外部委託半導体組立/テストサービスのタイプ別市場規模（2018年-2023年） - 世界の外部委託半導体組立/テストサービスのタイプ別市場規模（2024年-2029年） ・用途別セグメント：通信、自動車、コンピューティング、家電、その他 - 世界の外部委託半導体組立/テストサービスの用途別市場規模（2018年-2023年） - 世界の外部委託半導体組立/テストサービスの用途別市場規模（2024年-2029年） ・外部委託半導体組立/テストサービスの地域別市場規模 - 北米の外部委託半導体組立/テストサービス市場規模（2018年-2029年） - アメリカの外部委託半導体組立/テストサービス市場規模（2018年-2029年） - ヨーロッパの外部委託半導体組立/テストサービス市場規模（2018年-2029年） - アジア太平洋の外部委託半導体組立/テストサービス市場規模（2018年-2029年） - 中国の外部委託半導体組立/テストサービス市場規模（2018年-2029年） - 日本の外部委託半導体組立/テストサービス市場規模（2018年-2029年） - 韓国の外部委託半導体組立/テストサービス市場規模（2018年-2029年） - インドの外部委託半導体組立/テストサービス市場規模（2018年-2029年） - オーストラリアの外部委託半導体組立/テストサービス市場規模（2018年-2029年） - 中南米の外部委託半導体組立/テストサービス市場規模（2018年-2029年） - 中東・アフリカの外部委託半導体組立/テストサービス市場規模（2018年-2029年） ・主要企業のプロファイル：企業情報、事業概要、売上、動向 ASE、Amkor Technology、JCET、SPIL、Powertech Technology Inc.、TongFu Microelectronics、Tianshui Huatian Technology、UTAC、Chipbond Technology、Hana Micron、OSE、Walton Advanced Engineering、NEPES、Unisem、ChipMOS Technologies、Signetics、Carsem、KYEC ・アナリストの観点/結論 ・調査方法とデータソース |
Highlights
The global Outsourced Semiconductor Assembly and Test Service market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Outsourced Semiconductor Assembly and Test Service is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Outsourced Semiconductor Assembly and Test Service is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The global market for Outsourced Semiconductor Assembly and Test Service in Communications is estimated to increase from $ million in 2023 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Outsourced Semiconductor Assembly and Test Service include ASE, Amkor Technology, JCET, SPIL, Powertech Technology Inc., TongFu Microelectronics, Tianshui Huatian Technology, UTAC and Chipbond Technology, etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Outsourced Semiconductor Assembly and Test Service, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Outsourced Semiconductor Assembly and Test Service.
The Outsourced Semiconductor Assembly and Test Service market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Outsourced Semiconductor Assembly and Test Service market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Outsourced Semiconductor Assembly and Test Service companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
ASE
Amkor Technology
JCET
SPIL
Powertech Technology Inc.
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
Segment by Type
Assembly Service
Test Service
Segment by Application
Communications
Automotive
Computing
Consumer Electronics
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Outsourced Semiconductor Assembly and Test Service companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Outsourced Semiconductor Assembly and Test Service Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 Assembly Service
1.2.3 Test Service
1.3 Market by Application
1.3.1 Global Outsourced Semiconductor Assembly and Test Service Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Communications
1.3.3 Automotive
1.3.4 Computing
1.3.5 Consumer Electronics
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Outsourced Semiconductor Assembly and Test Service Market Perspective (2018-2029)
2.2 Outsourced Semiconductor Assembly and Test Service Growth Trends by Region
2.2.1 Global Outsourced Semiconductor Assembly and Test Service Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Outsourced Semiconductor Assembly and Test Service Historic Market Size by Region (2018-2023)
2.2.3 Outsourced Semiconductor Assembly and Test Service Forecasted Market Size by Region (2024-2029)
2.3 Outsourced Semiconductor Assembly and Test Service Market Dynamics
2.3.1 Outsourced Semiconductor Assembly and Test Service Industry Trends
2.3.2 Outsourced Semiconductor Assembly and Test Service Market Drivers
2.3.3 Outsourced Semiconductor Assembly and Test Service Market Challenges
2.3.4 Outsourced Semiconductor Assembly and Test Service Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Outsourced Semiconductor Assembly and Test Service Players by Revenue
3.1.1 Global Top Outsourced Semiconductor Assembly and Test Service Players by Revenue (2018-2023)
3.1.2 Global Outsourced Semiconductor Assembly and Test Service Revenue Market Share by Players (2018-2023)
3.2 Global Outsourced Semiconductor Assembly and Test Service Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Outsourced Semiconductor Assembly and Test Service Revenue
3.4 Global Outsourced Semiconductor Assembly and Test Service Market Concentration Ratio
3.4.1 Global Outsourced Semiconductor Assembly and Test Service Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Outsourced Semiconductor Assembly and Test Service Revenue in 2022
3.5 Outsourced Semiconductor Assembly and Test Service Key Players Head office and Area Served
3.6 Key Players Outsourced Semiconductor Assembly and Test Service Product Solution and Service
3.7 Date of Enter into Outsourced Semiconductor Assembly and Test Service Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Outsourced Semiconductor Assembly and Test Service Breakdown Data by Type
4.1 Global Outsourced Semiconductor Assembly and Test Service Historic Market Size by Type (2018-2023)
4.2 Global Outsourced Semiconductor Assembly and Test Service Forecasted Market Size by Type (2024-2029)
5 Outsourced Semiconductor Assembly and Test Service Breakdown Data by Application
5.1 Global Outsourced Semiconductor Assembly and Test Service Historic Market Size by Application (2018-2023)
5.2 Global Outsourced Semiconductor Assembly and Test Service Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Outsourced Semiconductor Assembly and Test Service Market Size (2018-2029)
6.2 North America Outsourced Semiconductor Assembly and Test Service Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Outsourced Semiconductor Assembly and Test Service Market Size by Country (2018-2023)
6.4 North America Outsourced Semiconductor Assembly and Test Service Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Outsourced Semiconductor Assembly and Test Service Market Size (2018-2029)
7.2 Europe Outsourced Semiconductor Assembly and Test Service Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Outsourced Semiconductor Assembly and Test Service Market Size by Country (2018-2023)
7.4 Europe Outsourced Semiconductor Assembly and Test Service Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Outsourced Semiconductor Assembly and Test Service Market Size (2018-2029)
8.2 Asia-Pacific Outsourced Semiconductor Assembly and Test Service Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Outsourced Semiconductor Assembly and Test Service Market Size by Region (2018-2023)
8.4 Asia-Pacific Outsourced Semiconductor Assembly and Test Service Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Outsourced Semiconductor Assembly and Test Service Market Size (2018-2029)
9.2 Latin America Outsourced Semiconductor Assembly and Test Service Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Outsourced Semiconductor Assembly and Test Service Market Size by Country (2018-2023)
9.4 Latin America Outsourced Semiconductor Assembly and Test Service Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Outsourced Semiconductor Assembly and Test Service Market Size (2018-2029)
10.2 Middle East & Africa Outsourced Semiconductor Assembly and Test Service Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Outsourced Semiconductor Assembly and Test Service Market Size by Country (2018-2023)
10.4 Middle East & Africa Outsourced Semiconductor Assembly and Test Service Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE
11.1.1 ASE Company Detail
11.1.2 ASE Business Overview
11.1.3 ASE Outsourced Semiconductor Assembly and Test Service Introduction
11.1.4 ASE Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.1.5 ASE Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Outsourced Semiconductor Assembly and Test Service Introduction
11.2.4 Amkor Technology Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.2.5 Amkor Technology Recent Development
11.3 JCET
11.3.1 JCET Company Detail
11.3.2 JCET Business Overview
11.3.3 JCET Outsourced Semiconductor Assembly and Test Service Introduction
11.3.4 JCET Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.3.5 JCET Recent Development
11.4 SPIL
11.4.1 SPIL Company Detail
11.4.2 SPIL Business Overview
11.4.3 SPIL Outsourced Semiconductor Assembly and Test Service Introduction
11.4.4 SPIL Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.4.5 SPIL Recent Development
11.5 Powertech Technology Inc.
11.5.1 Powertech Technology Inc. Company Detail
11.5.2 Powertech Technology Inc. Business Overview
11.5.3 Powertech Technology Inc. Outsourced Semiconductor Assembly and Test Service Introduction
11.5.4 Powertech Technology Inc. Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.5.5 Powertech Technology Inc. Recent Development
11.6 TongFu Microelectronics
11.6.1 TongFu Microelectronics Company Detail
11.6.2 TongFu Microelectronics Business Overview
11.6.3 TongFu Microelectronics Outsourced Semiconductor Assembly and Test Service Introduction
11.6.4 TongFu Microelectronics Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.6.5 TongFu Microelectronics Recent Development
11.7 Tianshui Huatian Technology
11.7.1 Tianshui Huatian Technology Company Detail
11.7.2 Tianshui Huatian Technology Business Overview
11.7.3 Tianshui Huatian Technology Outsourced Semiconductor Assembly and Test Service Introduction
11.7.4 Tianshui Huatian Technology Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.7.5 Tianshui Huatian Technology Recent Development
11.8 UTAC
11.8.1 UTAC Company Detail
11.8.2 UTAC Business Overview
11.8.3 UTAC Outsourced Semiconductor Assembly and Test Service Introduction
11.8.4 UTAC Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.8.5 UTAC Recent Development
11.9 Chipbond Technology
11.9.1 Chipbond Technology Company Detail
11.9.2 Chipbond Technology Business Overview
11.9.3 Chipbond Technology Outsourced Semiconductor Assembly and Test Service Introduction
11.9.4 Chipbond Technology Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.9.5 Chipbond Technology Recent Development
11.10 Hana Micron
11.10.1 Hana Micron Company Detail
11.10.2 Hana Micron Business Overview
11.10.3 Hana Micron Outsourced Semiconductor Assembly and Test Service Introduction
11.10.4 Hana Micron Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.10.5 Hana Micron Recent Development
11.11 OSE
11.11.1 OSE Company Detail
11.11.2 OSE Business Overview
11.11.3 OSE Outsourced Semiconductor Assembly and Test Service Introduction
11.11.4 OSE Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.11.5 OSE Recent Development
11.12 Walton Advanced Engineering
11.12.1 Walton Advanced Engineering Company Detail
11.12.2 Walton Advanced Engineering Business Overview
11.12.3 Walton Advanced Engineering Outsourced Semiconductor Assembly and Test Service Introduction
11.12.4 Walton Advanced Engineering Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.12.5 Walton Advanced Engineering Recent Development
11.13 NEPES
11.13.1 NEPES Company Detail
11.13.2 NEPES Business Overview
11.13.3 NEPES Outsourced Semiconductor Assembly and Test Service Introduction
11.13.4 NEPES Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.13.5 NEPES Recent Development
11.14 Unisem
11.14.1 Unisem Company Detail
11.14.2 Unisem Business Overview
11.14.3 Unisem Outsourced Semiconductor Assembly and Test Service Introduction
11.14.4 Unisem Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.14.5 Unisem Recent Development
11.15 ChipMOS Technologies
11.15.1 ChipMOS Technologies Company Detail
11.15.2 ChipMOS Technologies Business Overview
11.15.3 ChipMOS Technologies Outsourced Semiconductor Assembly and Test Service Introduction
11.15.4 ChipMOS Technologies Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.15.5 ChipMOS Technologies Recent Development
11.16 Signetics
11.16.1 Signetics Company Detail
11.16.2 Signetics Business Overview
11.16.3 Signetics Outsourced Semiconductor Assembly and Test Service Introduction
11.16.4 Signetics Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.16.5 Signetics Recent Development
11.17 Carsem
11.17.1 Carsem Company Detail
11.17.2 Carsem Business Overview
11.17.3 Carsem Outsourced Semiconductor Assembly and Test Service Introduction
11.17.4 Carsem Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.17.5 Carsem Recent Development
11.18 KYEC
11.18.1 KYEC Company Detail
11.18.2 KYEC Business Overview
11.18.3 KYEC Outsourced Semiconductor Assembly and Test Service Introduction
11.18.4 KYEC Revenue in Outsourced Semiconductor Assembly and Test Service Business (2018-2023)
11.18.5 KYEC Recent Development
12 Analyst’s Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
