 | • レポートコード：MRC309Z6108 • 出版社/出版日：GlobalInfoResearch / 2023年9月 • レポート形態：英文、PDF、97ページ • 納品方法：Eメール（2-3営業日） • 産業分類：機械&装置 |
| Single User | ￥522,000 (USD3,480) | ▷ お問い合わせ |
| Corporate User | ￥1,044,000 (USD6,960) | ▷ お問い合わせ |
• お支払方法：銀行振込（納品後、ご請求書送付）
レポート概要
| GlobalInfoResearchの最新の調査によると、世界のウェーハレーザーステルスダイシングマシンの市場規模は2022年のxxx米ドルから2029年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。新型コロナウイルス感染症とロシア・ウクライナ戦争の影響を考慮しながら市場規模を推計しました。 このレポートは、世界のウェーハレーザーステルスダイシングマシン市場に関する詳細かつ包括的な分析の結果です。定量的分析と定性的分析データが、メーカー別、地域別、国別、種類別、用途別に記載されています。 市場は常に変化しているため、本レポートでは、競争、需要と供給の傾向、および多くの市場にわたる需要の変化に影響する主要な要因を調査しました。主要な競合他社の企業概要と製品例、および2023年の市場シェア予測も記載しました。 本レポートの主な目的は次のとおりです。 - 世界および主要国の市場機会の規模を決定するため - ウェーハレーザーステルスダイシングマシンの成長可能性を評価するため - 各製品および最終用途市場の将来の成長を予測するため - 市場に影響を与える競争要因を評価するため ウェーハレーザーステルスダイシングマシン市場は種類と用途によって区分されます。2018年～2029年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 種類別セグメント ・単焦点ステルスダイシングマシン、二焦点ステルスダイシングマシン、多焦点ステルスダイシングマシン 用途別セグメント ・4インチウェーハ、6インチウェーハ、8インチウェーハ、12インチウェーハ 主要な市場プレーヤー ・DISCO Corporation、Hamamatsu Photonics、3D-Micromac AG、Physik Instrumente、Henan General Intelligent Equipment、Suzhou Tianhong Laser 地域別セグメントは次の地域・国をカバーします。 ・北米（米国、カナダ、メキシコ） ・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南アメリカ（ブラジル、アルゼンチン、コロンビア） ・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、ウェーハレーザーステルスダイシングマシン製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要なウェーハレーザーステルスダイシングマシンメーカーの企業概要、2019年～2022年までのウェーハレーザーステルスダイシングマシンの価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要なウェーハレーザーステルスダイシングマシンメーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2018年～2029年までの地域別ウェーハレーザーステルスダイシングマシンの販売量、売上、成長性を示しています。 ・第5、6章では、2018年～2029年までのウェーハレーザーステルスダイシングマシンの種類別と用途別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2018年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2029年までの主要地域でのウェーハレーザーステルスダイシングマシン市場予測を収録しています。 ・第12章では、市場力学、成長要因、阻害要因、トレンド、ポーターズファイブフォース分析、新型コロナウイルス感染症とロシア・ウクライナ戦争の影響を掲載しています。 ・第13章では、主要な原材料、主要なサプライヤー、およびウェーハレーザーステルスダイシングマシンの産業チェーンを掲載しています。 ・第14、15章では、ウェーハレーザーステルスダイシングマシンの販売チャネル、販売業者、顧客、調査結果について説明します。 ***** 目次(一部) ***** ・市場概要 - ウェーハレーザーステルスダイシングマシンの概要 - 種類別分析（2018年vs2022年vs2029年）：単焦点ステルスダイシングマシン、二焦点ステルスダイシングマシン、多焦点ステルスダイシングマシン - 用途別分析（2018年vs2022年vs2029年）：4インチウェーハ、6インチウェーハ、8インチウェーハ、12インチウェーハ - 世界のウェーハレーザーステルスダイシングマシン市場規模・予測 - 世界のウェーハレーザーステルスダイシングマシン生産能力分析 - 市場の成長要因・阻害要因・動向 ・メーカー情報（企業概要、製品概要、販売量、価格、売上） - DISCO Corporation、Hamamatsu Photonics、3D-Micromac AG、Physik Instrumente、Henan General Intelligent Equipment、Suzhou Tianhong Laser ・メーカー別市場シェア・市場集中度 ・地域別市場分析2018年-2029年 ・種類別分析2018年-2029年：単焦点ステルスダイシングマシン、二焦点ステルスダイシングマシン、多焦点ステルスダイシングマシン ・用途別分析2018年-2029年：4インチウェーハ、6インチウェーハ、8インチウェーハ、12インチウェーハ ・ウェーハレーザーステルスダイシングマシンの北米市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：アメリカ、カナダ、メキシコなど ・ウェーハレーザーステルスダイシングマシンのヨーロッパ市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：ドイツ、イギリス、フランス、ロシア、イタリアなど ・ウェーハレーザーステルスダイシングマシンのアジア市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：中国、日本、韓国、インド、東南アジア、オーストラリアなど ・ウェーハレーザーステルスダイシングマシンの南米市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：ブラジル、アルゼンチンなど ・ウェーハレーザーステルスダイシングマシンの中東・アフリカ市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：サウジアラビア、トルコ、エジプト、南アフリカなど ・市場力学（成長要因、阻害要因、トレンド、ポーターズファイブフォース分析） ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論 |
According to our (Global Info Research) latest study, the global Wafer Laser Stealth Dicing Machine market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Stealth Dicing technology is a laser dicing technology that uses lasers, which has such features as the “completely dry process”, “no kerf loss”, “no chipping”, “high bending strength” and the like.
Stealth Dicing technology is a technology that focuses a laser beam of a wavelength that permeates through materials, focus internally and forms a starting point for cracking the wafer, then applies external stress to the wafer, separating it. The process is comprised primarily of two parts, namely the “laser irradiation process” in which the SD layer is formed to crack the wafer interior and the “expansion process” for separating the wafer.
This report is a detailed and comprehensive analysis for global Wafer Laser Stealth Dicing Machine market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Wafer Laser Stealth Dicing Machine market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2018-2029
Global Wafer Laser Stealth Dicing Machine market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2018-2029
Global Wafer Laser Stealth Dicing Machine market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2018-2029
Global Wafer Laser Stealth Dicing Machine market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2018-2023.
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Laser Stealth Dicing Machine
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace.
This report profiles key players in the global Wafer Laser Stealth Dicing Machine market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO Corporation, Hamamatsu Photonics, 3D-Micromac AG, Physik Instrumente and Henan General Intelligent Equipment and etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Wafer Laser Stealth Dicing Machine market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Single Focus Stealth Dicing Machine
Double Focus Stealth Dicing Machine
Multi Focus Stealth Dicing Machine
Market segment by Application
4-inch Wafer
6-inch Wafer
8-inch Wafer
12-inch Wafer
Major players covered
DISCO Corporation
Hamamatsu Photonics
3D-Micromac AG
Physik Instrumente
Henan General Intelligent Equipment
Suzhou Tianhong Laser
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Laser Stealth Dicing Machine product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Laser Stealth Dicing Machine, with price, sales, revenue and global market share of Wafer Laser Stealth Dicing Machine from 2018 to 2023.
Chapter 3, the Wafer Laser Stealth Dicing Machine competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Laser Stealth Dicing Machine breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Wafer Laser Stealth Dicing Machine market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Laser Stealth Dicing Machine.
Chapter 14 and 15, to describe Wafer Laser Stealth Dicing Machine sales channel, distributors, customers, research findings and conclusion.
1 Market Overview
1.1 Product Overview and Scope of Wafer Laser Stealth Dicing Machine
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Type
1.3.1 Overview: Global Wafer Laser Stealth Dicing Machine Consumption Value by Type: 2018 Versus 2022 Versus 2029
1.3.2 Single Focus Stealth Dicing Machine
1.3.3 Double Focus Stealth Dicing Machine
1.3.4 Multi Focus Stealth Dicing Machine
1.4 Market Analysis by Application
1.4.1 Overview: Global Wafer Laser Stealth Dicing Machine Consumption Value by Application: 2018 Versus 2022 Versus 2029
1.4.2 4-inch Wafer
1.4.3 6-inch Wafer
1.4.4 8-inch Wafer
1.4.5 12-inch Wafer
1.5 Global Wafer Laser Stealth Dicing Machine Market Size & Forecast
1.5.1 Global Wafer Laser Stealth Dicing Machine Consumption Value (2018 & 2022 & 2029)
1.5.2 Global Wafer Laser Stealth Dicing Machine Sales Quantity (2018-2029)
1.5.3 Global Wafer Laser Stealth Dicing Machine Average Price (2018-2029)
2 Manufacturers Profiles
2.1 DISCO Corporation
2.1.1 DISCO Corporation Details
2.1.2 DISCO Corporation Major Business
2.1.3 DISCO Corporation Wafer Laser Stealth Dicing Machine Product and Services
2.1.4 DISCO Corporation Wafer Laser Stealth Dicing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.1.5 DISCO Corporation Recent Developments/Updates
2.2 Hamamatsu Photonics
2.2.1 Hamamatsu Photonics Details
2.2.2 Hamamatsu Photonics Major Business
2.2.3 Hamamatsu Photonics Wafer Laser Stealth Dicing Machine Product and Services
2.2.4 Hamamatsu Photonics Wafer Laser Stealth Dicing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.2.5 Hamamatsu Photonics Recent Developments/Updates
2.3 3D-Micromac AG
2.3.1 3D-Micromac AG Details
2.3.2 3D-Micromac AG Major Business
2.3.3 3D-Micromac AG Wafer Laser Stealth Dicing Machine Product and Services
2.3.4 3D-Micromac AG Wafer Laser Stealth Dicing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.3.5 3D-Micromac AG Recent Developments/Updates
2.4 Physik Instrumente
2.4.1 Physik Instrumente Details
2.4.2 Physik Instrumente Major Business
2.4.3 Physik Instrumente Wafer Laser Stealth Dicing Machine Product and Services
2.4.4 Physik Instrumente Wafer Laser Stealth Dicing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.4.5 Physik Instrumente Recent Developments/Updates
2.5 Henan General Intelligent Equipment
2.5.1 Henan General Intelligent Equipment Details
2.5.2 Henan General Intelligent Equipment Major Business
2.5.3 Henan General Intelligent Equipment Wafer Laser Stealth Dicing Machine Product and Services
2.5.4 Henan General Intelligent Equipment Wafer Laser Stealth Dicing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.5.5 Henan General Intelligent Equipment Recent Developments/Updates
2.6 Suzhou Tianhong Laser
2.6.1 Suzhou Tianhong Laser Details
2.6.2 Suzhou Tianhong Laser Major Business
2.6.3 Suzhou Tianhong Laser Wafer Laser Stealth Dicing Machine Product and Services
2.6.4 Suzhou Tianhong Laser Wafer Laser Stealth Dicing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.6.5 Suzhou Tianhong Laser Recent Developments/Updates
3 Competitive Environment: Wafer Laser Stealth Dicing Machine by Manufacturer
3.1 Global Wafer Laser Stealth Dicing Machine Sales Quantity by Manufacturer (2018-2023)
3.2 Global Wafer Laser Stealth Dicing Machine Revenue by Manufacturer (2018-2023)
3.3 Global Wafer Laser Stealth Dicing Machine Average Price by Manufacturer (2018-2023)
3.4 Market Share Analysis (2022)
3.4.1 Producer Shipments of Wafer Laser Stealth Dicing Machine by Manufacturer Revenue ($MM) and Market Share (%): 2022
3.4.2 Top 3 Wafer Laser Stealth Dicing Machine Manufacturer Market Share in 2022
3.4.2 Top 6 Wafer Laser Stealth Dicing Machine Manufacturer Market Share in 2022
3.5 Wafer Laser Stealth Dicing Machine Market: Overall Company Footprint Analysis
3.5.1 Wafer Laser Stealth Dicing Machine Market: Region Footprint
3.5.2 Wafer Laser Stealth Dicing Machine Market: Company Product Type Footprint
3.5.3 Wafer Laser Stealth Dicing Machine Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Wafer Laser Stealth Dicing Machine Market Size by Region
4.1.1 Global Wafer Laser Stealth Dicing Machine Sales Quantity by Region (2018-2029)
4.1.2 Global Wafer Laser Stealth Dicing Machine Consumption Value by Region (2018-2029)
4.1.3 Global Wafer Laser Stealth Dicing Machine Average Price by Region (2018-2029)
4.2 North America Wafer Laser Stealth Dicing Machine Consumption Value (2018-2029)
4.3 Europe Wafer Laser Stealth Dicing Machine Consumption Value (2018-2029)
4.4 Asia-Pacific Wafer Laser Stealth Dicing Machine Consumption Value (2018-2029)
4.5 South America Wafer Laser Stealth Dicing Machine Consumption Value (2018-2029)
4.6 Middle East and Africa Wafer Laser Stealth Dicing Machine Consumption Value (2018-2029)
5 Market Segment by Type
5.1 Global Wafer Laser Stealth Dicing Machine Sales Quantity by Type (2018-2029)
5.2 Global Wafer Laser Stealth Dicing Machine Consumption Value by Type (2018-2029)
5.3 Global Wafer Laser Stealth Dicing Machine Average Price by Type (2018-2029)
6 Market Segment by Application
6.1 Global Wafer Laser Stealth Dicing Machine Sales Quantity by Application (2018-2029)
6.2 Global Wafer Laser Stealth Dicing Machine Consumption Value by Application (2018-2029)
6.3 Global Wafer Laser Stealth Dicing Machine Average Price by Application (2018-2029)
7 North America
7.1 North America Wafer Laser Stealth Dicing Machine Sales Quantity by Type (2018-2029)
7.2 North America Wafer Laser Stealth Dicing Machine Sales Quantity by Application (2018-2029)
7.3 North America Wafer Laser Stealth Dicing Machine Market Size by Country
7.3.1 North America Wafer Laser Stealth Dicing Machine Sales Quantity by Country (2018-2029)
7.3.2 North America Wafer Laser Stealth Dicing Machine Consumption Value by Country (2018-2029)
7.3.3 United States Market Size and Forecast (2018-2029)
7.3.4 Canada Market Size and Forecast (2018-2029)
7.3.5 Mexico Market Size and Forecast (2018-2029)
8 Europe
8.1 Europe Wafer Laser Stealth Dicing Machine Sales Quantity by Type (2018-2029)
8.2 Europe Wafer Laser Stealth Dicing Machine Sales Quantity by Application (2018-2029)
8.3 Europe Wafer Laser Stealth Dicing Machine Market Size by Country
8.3.1 Europe Wafer Laser Stealth Dicing Machine Sales Quantity by Country (2018-2029)
8.3.2 Europe Wafer Laser Stealth Dicing Machine Consumption Value by Country (2018-2029)
8.3.3 Germany Market Size and Forecast (2018-2029)
8.3.4 France Market Size and Forecast (2018-2029)
8.3.5 United Kingdom Market Size and Forecast (2018-2029)
8.3.6 Russia Market Size and Forecast (2018-2029)
8.3.7 Italy Market Size and Forecast (2018-2029)
9 Asia-Pacific
9.1 Asia-Pacific Wafer Laser Stealth Dicing Machine Sales Quantity by Type (2018-2029)
9.2 Asia-Pacific Wafer Laser Stealth Dicing Machine Sales Quantity by Application (2018-2029)
9.3 Asia-Pacific Wafer Laser Stealth Dicing Machine Market Size by Region
9.3.1 Asia-Pacific Wafer Laser Stealth Dicing Machine Sales Quantity by Region (2018-2029)
9.3.2 Asia-Pacific Wafer Laser Stealth Dicing Machine Consumption Value by Region (2018-2029)
9.3.3 China Market Size and Forecast (2018-2029)
9.3.4 Japan Market Size and Forecast (2018-2029)
9.3.5 Korea Market Size and Forecast (2018-2029)
9.3.6 India Market Size and Forecast (2018-2029)
9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
9.3.8 Australia Market Size and Forecast (2018-2029)
10 South America
10.1 South America Wafer Laser Stealth Dicing Machine Sales Quantity by Type (2018-2029)
10.2 South America Wafer Laser Stealth Dicing Machine Sales Quantity by Application (2018-2029)
10.3 South America Wafer Laser Stealth Dicing Machine Market Size by Country
10.3.1 South America Wafer Laser Stealth Dicing Machine Sales Quantity by Country (2018-2029)
10.3.2 South America Wafer Laser Stealth Dicing Machine Consumption Value by Country (2018-2029)
10.3.3 Brazil Market Size and Forecast (2018-2029)
10.3.4 Argentina Market Size and Forecast (2018-2029)
11 Middle East & Africa
11.1 Middle East & Africa Wafer Laser Stealth Dicing Machine Sales Quantity by Type (2018-2029)
11.2 Middle East & Africa Wafer Laser Stealth Dicing Machine Sales Quantity by Application (2018-2029)
11.3 Middle East & Africa Wafer Laser Stealth Dicing Machine Market Size by Country
11.3.1 Middle East & Africa Wafer Laser Stealth Dicing Machine Sales Quantity by Country (2018-2029)
11.3.2 Middle East & Africa Wafer Laser Stealth Dicing Machine Consumption Value by Country (2018-2029)
11.3.3 Turkey Market Size and Forecast (2018-2029)
11.3.4 Egypt Market Size and Forecast (2018-2029)
11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
11.3.6 South Africa Market Size and Forecast (2018-2029)
12 Market Dynamics
12.1 Wafer Laser Stealth Dicing Machine Market Drivers
12.2 Wafer Laser Stealth Dicing Machine Market Restraints
12.3 Wafer Laser Stealth Dicing Machine Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
12.5 Influence of COVID-19 and Russia-Ukraine War
12.5.1 Influence of COVID-19
12.5.2 Influence of Russia-Ukraine War
13 Raw Material and Industry Chain
13.1 Raw Material of Wafer Laser Stealth Dicing Machine and Key Manufacturers
13.2 Manufacturing Costs Percentage of Wafer Laser Stealth Dicing Machine
13.3 Wafer Laser Stealth Dicing Machine Production Process
13.4 Wafer Laser Stealth Dicing Machine Industrial Chain
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Wafer Laser Stealth Dicing Machine Typical Distributors
14.3 Wafer Laser Stealth Dicing Machine Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer
